BGA structure using CTF balls in high stress regions

Patent metadata

Field	Value
Publication number	US-9237659-B2
Application number	US-201213631683-A
Country	US
Kind code	B2
Filing date	Sep 28, 2012
Priority date	Sep 28, 2012
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

First claim

What is claimed is:

1. A device comprising: a PCB having a land surface; a package having a mounting surface; a high stress region of the mounting surface; a first plurality of solder balls having a first average diameter electrically joining the mounting surface of the package to the land surface of the PCB within the high stress region; and a second plurality of solder balls having a second average diameter electrically joining the mounting surface of the package the land surface of the PCB outside of the high stress region, wherein the first average diameter is larger than the second average diameter, wherein the first average diameter is at least 10% greater than the second average diameter.

2. The device of claim 1 , wherein at least one of the first plurality of solder balls carry input/output signals between the PCB and the package.

3. The device of claim 1 , wherein the mounting surface of the package is rectangular, having four corner areas, and wherein the high stress region comprises the corner areas.

4. The device of claim 1 , wherein the high stress region comprises a periphery of the mounting surface.

5. The device of claim 1 , wherein the package comprises:
a package substrate; and
a die mounted on the package substrate, wherein the die has a die area, wherein the mounting surface of the package has a die shadow area aligned with the die area, and wherein the high stress region comprises the die shadow area.

6. The device of claim 5 , wherein the die shadow area is up to 15% larger than the die area.

7. The device of claim 5 , wherein the die is mounted on a top surface of the package substrate opposite the mounting surface.

8. The device of claim 5 , wherein the die is mounted on the mounting surface of the package.

9. The device of claim 1 , wherein the first plurality of solder balls is mounted within one or more recesses in the mounting surface of the package.

10. The device of claim 9 , wherein the package comprises one or more buildup layers, and wherein the one or more recesses is formed in one or more of the buildup layers.

11. The device of claim 1 , wherein the first plurality of solder balls is mounted within one or more recesses in the land surface of the PCB.

12. The device of claim 11 , wherein the package comprises one or more buildup layers, and wherein the one or more recesses is formed in one or more of the buildup layers.

13. The device of claim 1 , wherein the second plurality of solder balls is mounted within one or more recesses in the mounting surface of the package and within one or more recesses in the land surface of the PCB.

14. The device of claim 1 , further comprising:
a first plurality of contact pads coupling the respective first plurality of solder balls to each of the package and the PCB; and
a second plurality of contact pads coupling the respective second plurality of solder balls to each of the package and the PCB.

15. The device of claim 14 , wherein the first plurality of contact pads are at least 10% larger by area than the second plurality of contact pads.

16. The device of claim 1 , further comprising a third plurality of solder balls electrically coupling the mounting surface of the package to the land surface of the PCB within a second high-stress region of the mounting surface, wherein a third average diameter of the third plurality of solder balls is greater than the second average diameter of the second plurality of solder balls, and wherein at least one of the third plurality of solder balls carries input/output signals between the PCB and the package.

17. A device, comprising: a PCB having a land surface; a package having a mounting surface; a high stress region of the mounting surface; a first plurality of solder balls having a first average diameter electrically joining the mounting surface of the package the land surface of the PCB within the high stress region, wherein the first plurality of solder balls are each mounted within at least one recess in at least one of the land surface and the mounting surface, further comprising a second plurality of solder balls having a second average diameter electrically joining the mounting surface of the package to the land surface of the PCB outside of the high stress region, wherein the first average diameter is at least 10% larger than the second average diameter.

18. The device of claim 17 , wherein each of the first plurality of solder balls is mounted within a recess formed in the land surface of the PCB.

19. The device of claim 17 , wherein each of the first plurality of solder balls is mounted within a recess formed in the mounting surface of the package.

20. The device of claim 17 , wherein each of the first plurality of solder balls is mounted within a pair of recesses formed in the land surface of the PCB and the mounting surface of the package.

Assignees

• Hossain Md Altaf
• Gilbert Scott A
• Intel Corp

Inventors

• Hossain Md Altaf
• Gilbert Scott A

Classifications

• H05K2203/041

  Solder preforms in the shape of solder balls · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K2201/09745

  Recess in conductor, e.g. in pad or in metallic substrate · CPC title

• H05K3/3478

  Application of solder preforms; Transferring prefabricated solder patterns · CPC title

• H05K3/3436 Primary

  having an array of bottom contacts, e.g. pad grid array or ball grid array components · CPC title