Method for orienting solder balls on a BGA device

Patent metadata

Field	Value
Publication number	US-11528809-B2
Application number	US-202117187262-A
Country	US
Kind code	B2
Filing date	Feb 26, 2021
Priority date	Sep 28, 2012
Publication date	Dec 13, 2022
Grant date	Dec 13, 2022

Abstract

A BGA structure having larger solder balls in high stress regions of the array is disclosed. The larger solder balls have higher solder joint reliability (SJR) and as such may be designated critical to function (CTF), whereby the larger solder balls in high stress regions carry input/output signals between a circuit board and a package mounted thereon. The larger solder balls are accommodated by recessing each ball in the package substrate, the circuit board, or both the package substrate and the circuit board. Additionally, a ball attach method for mounting a plurality of solder balls having different average diameters is disclosed.

First claim

What is claimed is:

1. A method of forming a device comprising:
providing a printed circuit board (PCB) having a land surface;
providing a package comprising a die coupled to a package substrate, the package substrate having a mounting surface; and
electrically joining the mounting surface of the package substrate to the land surface of the PCB with a first plurality of solder balls having a first average diameter and a second plurality of solder balls having a second average diameter, wherein the first average diameter is larger than the second average diameter, wherein the first plurality of solder balls and the second plurality of solder balls are intervening between the package substrate and the PCB.

2. The method of claim 1 wherein the first average diameter is at least 10% greater than the second average diameter.

3. The method of claim 1 wherein at least one of the first plurality of solder balls carries input/output signals between the PCB and the package.

4. The method of claim 1 wherein the mounting surface of the package substrate is rectangular having four corner areas and wherein the first plurality of solder balls is disposed within the corner areas.

5. The method of claim 1 wherein the mounting surface of the package substrate is rectangular having a periphery and wherein the first plurality of solder balls is disposed within the periphery.

6. The method of claim 1 wherein the die has a die area, wherein the mounting surface of the substrate package has a die shadow area aligned with the die area, and wherein the first plurality of solder balls is disposed within the die shadow area.

7. A method of forming a semiconductor device comprising:
providing a printed circuit board (PCB) having a land surface;
providing a package comprising a die coupled to a package substrate, the package substrate having a mounting surface, wherein at least one recess is formed in at least one of the land surface or the mounting surface; and
electrically joining the mounting surface of the package substrate to the land surface of the PCB with a first plurality of solder balls having a first average diameter and a second plurality of solder balls having a second average diameter wherein the first average diameter is larger than the second average diameter and wherein the first plurality of solder balls is disposed in the recess, wherein the first plurality of solder balls and the second plurality of solder balls are intervening between the package substrate and the PCB.

8. The method of forming a semiconductor device of claim 7 wherein the recess is formed in the land surface of the PCB.

9. The method of forming a semiconductor device of claim 7 wherein the recess is formed in the mounting surface of the package substrate.

10. The method of forming a semiconductor device of claim 7 wherein the recess is formed in the land surface of the PCB and a second recess is formed in the mounting surface of the package substrate and wherein the first plurality of solder balls is disposed within the recess formed in the land surface of the PCB and disposed within the second recess formed in the mounting surface of the package substrate.

11. The method of forming a semiconductor device of claim 7 wherein the first average diameter is at least 10% larger than the second average diameter.

12. A method of forming a device, the method comprising:
providing a printed circuit board (PCB) having a land surface;
providing a package having a mounting surface, the mounting surface having a high stress region; and
electrically joining the mounting surface of the package to the land surface of the PCB with a first plurality of solder balls having a first average diameter electrically joining the mounting surface of the package to the land surface of the PCB within the high stress region, and a second plurality of solder balls having a second average diameter electrically joining the mounting surface of the package to the land surface of the PCB outside of the high stress region, wherein the first average diameter is at least 10% greater than the second average diameter.

13. The method of claim 12 , wherein at least one of the first plurality of solder balls carries input/output signals between the PCB and the package.

14. The method of claim 12 , wherein the mounting surface of the package is rectangular, having four corner areas, and wherein the high stress region comprises the corner areas.

15. The method of claim 12 , wherein the high stress region comprises a periphery of the mounting surface.

16. The method of claim 12 , wherein the first plurality of solder balls is mounted within one or more recesses in the mounting surface of the package.

17. The method of claim 16 , wherein the package comprises one or more buildup layers, and wherein the one or more recesses is formed in one or more of the buildup layers.

18. The method of claim 12 , wherein the first plurality of solder balls is mounted within one or more recesses in the land surface of the PCB.

19. The method of claim 18 , wherein the PCB comprises one or more buildup layers, and wherein the one or more recesses is formed in one or more of the buildup layers.

20. The method of claim 12 , wherein the second plurality of solder balls is mounted within one or more recesses in the mounting surface of the package and within one or more recesses in the land surface of the PCB.

21. A method of forming a device comprising:
providing a printed circuit board (PCB) having a land surface;
providing a package having a mounting surface; and
electrically joining the mounting surface of the package to the land surface of the PCB with a first plurality of solder balls having a first average diameter and a second plurality of solder balls having a second average diameter, wherein the first average diameter is larger than the second average diameter, wherein at least one of the first plurality of solder balls carries input/output signals between the PCB and the package.

Assignees

• Tahoe Res Ltd

Inventors

• Hossain Md Altaf
• Gilbert Scott A

Classifications

• H10W72/07251

  characterised by changes in properties of the bump connectors during connecting · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H05K2203/041

  Solder preforms in the shape of solder balls · CPC title