Improved semiconductor chip package thermo-mechanical cooling assembly
US-2026047437-A1 · Feb 12, 2026 · US
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Geng Phil patents
Geng Phil is listed as an inventor on 58 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Geng Phil |
| Total patents | 58 |
| First publication | Sep 6, 2018 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load
US-12494441-B2 · Dec 9, 2025 · US
Semiconductor chip package thermo-mechanical cooling assembly
US-12476167-B2 · Nov 18, 2025 · US
Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass
US-12453054-B2 · Oct 21, 2025 · US
Patterned bolster plate and composite back plate for semiconductor chip lga package and cooling assembly retention
US-2025234478-A1 · Jul 17, 2025 · US
DIMM retention assembly for compression mount technology and land grid array connector loading
US-12334674-B2 · Jun 17, 2025 · US
Damping elements for pin vibration fretting risk mitigation
US-2025174922-A1 · May 29, 2025 · US
Technologies for processor loading mechanisms
US-12315780-B2 · May 27, 2025 · US
Magnetically secured semiconductor chip package loading assembly
US-12309933-B2 · May 20, 2025 · US
Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force
US-12309966-B2 · May 20, 2025 · US
Recent patents
Latest publications not already listed above.
Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention
US-12279395-B2 · Apr 15, 2025 · US
Composite backplate architectures for backside power delivery and associated methods
US-2025089192-A1 · Mar 13, 2025 · US
Tall DIMM Structural Retention
US-2025071924-A1 · Feb 27, 2025 · US
Cold plate architecture for liquid cooling of devices
US-2025071938-A1 · Feb 27, 2025 · US
Pins for use in land grid array
US-2025055217-A1 · Feb 13, 2025 · US
Integrated circuit packages with fluid spacers to improve pin load distribution
US-2024413054-A1 · Dec 12, 2024 · US
Cold plate architecture for liquid cooling of devices
US-12133357-B2 · Oct 29, 2024 · US
Electronic systems with inverted circuit board with heat sink to chassis attachment
US-12131977-B2 · Oct 29, 2024 · US
Localized damping elements for mitigating interconnect vibration damage
US-2024355759-A1 · Oct 24, 2024 · US
Dual in-line memory module retainer
US-2024242740-A1 · Jul 18, 2024 · US
Retention latch with spring mechanism
US-11984685-B2 · May 14, 2024 · US
Socket interconnect structures and related methods
US-2024113479-A1 · Apr 4, 2024 · US
Cooling systems with main and remote cooling masses having integrated flexibility
US-2024096741-A1 · Mar 21, 2024 · US
Electronic systems with inverted circuit board with heat sink to chassis attachment
US-2024063082-A1 · Feb 22, 2024 · US
Electronic systems with inverted circuit board with heat sink to chassis attachment
US-11842943-B2 · Dec 12, 2023 · US
Bga stiffener attachment with low eolife adhesive strength at high solder joint stress area generated from enabling load
US-2023307379-A1 · Sep 28, 2023 · US
Dual in-line memory module cover
US-2023273654-A1 · Aug 31, 2023 · US
Dimm cooling assembly with heat spreader anti-rotation mechanism
US-2023092972-A1 · Mar 23, 2023 · US
Connector retention mechanism for improved structural reliability
US-11587597-B2 · Feb 21, 2023 · US
Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packages
US-2023038805-A1 · Feb 9, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 58 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/60 | 20 |
| H10W40/611 | 18 |
| H10W40/625 | 11 |
| H05K2201/10159 | 10 |
| H05K7/20509 | 9 |