DIMM retention assembly for compression mount technology and land grid array connector loading

US12334674B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12334674-B2
Application numberUS-202117470646-A
CountryUS
Kind codeB2
Filing dateSep 9, 2021
Priority dateSep 9, 2021
Publication dateJun 17, 2025
Grant dateJun 17, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A memory module, a motherboard, and a latch assembly coupled to the memory module and the motherboard are described, the latch assembly including a connector coupled to the motherboard, a first lever coupled to the connector via a first pivot point, an load member extending through an opening in the first lever, a second lever coupled to the load member via a second pivot point, and a spring to bias the load member away from the opening in the first lever. The latch assembly may be used as a dual inline memory module (DIMM) retention assembly for compression mount technology (CMT) and land grid array (LGA) connector loading.

First claim

Opening claim text (preview).

We claim: 1. A computing system comprising: a memory module; a motherboard; and a latch assembly coupled to the memory module and the motherboard, the latch assembly including: a connector coupled to the motherboard, a first lever coupled to the connector via a first pivot point, an L-shaped load member extending through an opening in the first lever, a second lever coupled to the L-shaped load member via a second pivot point, and a spring to bias the L-shaped load member away from the opening in the first lever, wherein the spring is located so as to coil around a portion of the L-shaped load member. 2. The computing system of claim 1 , wherein the L-shaped load member includes a protrusion extending away from the spring. 3. The computing system of claim 2 , wherein in a latched position, the first lever rotates toward the memory module and the spring engages the protrusion with a recess in the memory module. 4. The computing system of claim 1 , wherein in an open position, the second lever causes the L-shaped load member to compress the spring and the first lever rotates away from the memory module. 5. The computing system of claim 1 , wherein the connector is a land grid array connector. 6. The computing system of claim 1 , wherein the connector is a compression mount technology connector. 7. The computing system of claim 1 , wherein the first lever is an L-shaped lever and the second lever is a longitudinal lever. 8. A latch assembly comprising: a connector; a first lever coupled to the connector via a first pivot point; an L-shaped load member extending through an opening in the first lever; a second lever coupled to the L-shaped load member via a second pivot point; and a spring to bias the L-shaped load member away from the opening in the first lever, wherein the spring is located so as to coil around a portion of the L-shaped load member. 9. The latch assembly of claim 8 , wherein the L-shaped load member includes a protrusion extending away from the spring. 10. The latch assembly of claim 9 , wherein in a latched position, the first lever rotates toward a memory module and the spring engages the protrusion with a recess in the memory module. 11. The latch assembly of claim 8 , wherein in an open position, the second lever causes the L-shaped load member to compress the spring and the first lever rotates away from a memory module. 12. The latch assembly of claim 8 , wherein the connector is a land grid array connector. 13. The latch assembly of claim 8 , wherein the connector is a compression mount technology connector. 14. The latch assembly of claim 8 , wherein the first lever is an L-shaped lever and the second lever is a longitudinal lever.

Assignees

Inventors

Classifications

  • by lever-type mechanisms · CPC title

  • Mounting of expansion boards · CPC title

  • Printed circuits being substantially perpendicular to each other (for printed connections H05K3/366) · CPC title

  • connecting to other rigid printed circuits or like structures · CPC title

  • comprising a single latching arm · CPC title

Patent family

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Frequently asked questions

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What does patent US12334674B2 cover?
A memory module, a motherboard, and a latch assembly coupled to the memory module and the motherboard are described, the latch assembly including a connector coupled to the motherboard, a first lever coupled to the connector via a first pivot point, an load member extending through an opening in the first lever, a second lever coupled to the load member via a second pivot point, and a spring to…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H01R13/6272. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 17 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).