Technologies for processor loading mechanisms

Patent metadata

Field	Value
Publication number	US-12315780-B2
Application number	US-202117187470-A
Country	US
Kind code	B2
Filing date	Feb 26, 2021
Priority date	Feb 26, 2021
Publication date	May 27, 2025
Grant date	May 27, 2025

Abstract

Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.

First claim

The invention claimed is:

1. A system comprising:
a mainboard including a processor socket and a bolster plate;
an integrated circuit component physically coupled to the processor socket;
a heat sink including a heat sink base in contact with a surface of the integrated circuit component, the heat sink base including a perimeter and a thickness that extends from a first surface of the heat sink base to a second surface of the heat sink base, the second surface opposite the first surface, the heat sink base including a cut out defining a portion of the perimeter of the heat sink base, the cut out extending through the thickness; and
a load plate in contact with the integrated circuit component, the load plate fastened to the bolster plate with a fastener positioned in an area defined by the cut out, the heat sink and the load plate to apply a force on the integrated circuit component to press the integrated circuit component into the processor socket.

2. The system of claim 1 , wherein the heat sink base includes a first edge, a second edge opposite the first edge, and a third edge extending between the first edge and the second edge, and the heat sink is fastened to the bolster plate with an additional fastener, the additional fastener positioned closer to a middle of the third edge than to the first edge and to the second edge.

3. The system of claim 1 , wherein the heat sink base includes a first edge, a second edge opposite the first edge, and a middle defined equidistant between the first edge and the second edge, and the heat sink is fastened to the load plate with an additional fastener, the middle being closer to the additional fastener than each of the first edge and the second edge is to the additional fastener.

4. The system of claim 1 , wherein the heat sink is fastened to the load plate with one or more springs, the one or more springs to apply a force on the heat sink that is transferred to the integrated circuit component.

5. The system of claim 1 , wherein the load plate applies a force to the integrated circuit component of at least one hundred pounds.

6. The system of claim 1 , wherein the load plate applies at least 50% of the force applied to the integrated circuit component by the load plate and the heat sink.

7. The system of claim 1 , wherein the processor socket includes at least one thousand pins.

8. The system of claim 1 , wherein the load plate is a steel load plate.

9. The system of claim 1 , further including a back plate on an underside of the mainboard, the bolster plate fastened to the back plate.

10. The system of claim 1 , wherein the integrated circuit component includes an integrated heat spreader, and the heat sink base is in contact with a surface of the integrated heat spreader.

Assignees

• Intel Corp

Inventors

• Miele Ralph V
• Geng Phil
• Liu Mengqi
• Shia David
• Ahuja Sandeep
• Buddrius Eric W
• Smalley Jeffory L

Classifications

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title

• H10W40/242

  comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/611 Primary

  Bolts or screws · CPC title