Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force

Patent metadata

Field	Value
Publication number	US-12309966-B2
Application number	US-202117475026-A
Country	US
Kind code	B2
Filing date	Sep 14, 2021
Priority date	Jun 30, 2021
Publication date	May 20, 2025
Grant date	May 20, 2025

Abstract

An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

First claim

The invention claimed is:

1. An apparatus, comprising:
a ceiling part and a floor part of a thermally conductive component to be placed upon an integrated heat spreader to remove heat from at least one semiconductor chip within a semiconductor chip package associated with the integrated heat spreader, the floor part and the ceiling part to be pressed against one another to form the thermally conductive component, one or more cavities exist within the thermally conductive component between respective inner surfaces of the floor part and the ceiling part that face one another when the floor part and the ceiling part are pressed against one another; and
a frame component to be abutted against at least one of the ceiling part or the floor part to impede deformation of at least one of the ceiling part or the floor part when loading forces are being applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package, the frame component to reside between the floor part and the integrated heat spreader.

2. The apparatus of claim 1 wherein the thermally conductive component includes a vapor chamber for a two-phase cooling system.

3. The apparatus of claim 1 wherein the thermally conductive component includes a cold plate for a liquid cooling system.

4. The apparatus of claim 1 wherein the ceiling part includes a flange and the frame component is to be abutted against the flange.

5. The apparatus of claim 1 wherein the floor part includes a flange and the frame component is to be abutted against the flange.

6. The apparatus of claim 1 wherein a thickest part of the frame component is thicker than a thinnest respective part of the ceiling part and the floor part.

7. A data center, comprising:
a plurality of computing systems housed in racks communicatively coupled to one another by at least one network;
a liquid cooling system including pumping equipment and cooling equipment; and
a thermal assembly upon a semiconductor chip package within one of the plurality of computing systems to remove heat from at least one semiconductor chip within the semiconductor chip package, the thermal assembly including:
a thermally conductive component in direct thermal contact with an integrated heat spreader of the semiconductor chip package, the thermally conductive component having a floor part and a ceiling part, the floor part and the ceiling part being pressed against one another and structured to define one or more cavities within the thermally conductive component between respective inner surfaces of the ceiling part and the floor part, the thermally conductive component fluidically coupled to the liquid cooling system with an exit port to emit warmed vapor and/or liquid coolant and an input port to receive cooled liquid coolant; and
a frame component abutted against at least one of the ceiling part or the floor part, the frame component to impede deformation of at least one of the ceiling part or the floor part when loading forces are applied to the thermal assembly, the frame component is to reside between the floor part and the integrated heat spreader.

8. The data center of claim 7 wherein the thermally conductive component includes a vapor chamber for a two-phase cooling system.

9. The data center of claim 7 wherein the thermally conductive component includes a cold plate associated with the liquid cooling system.

10. The data center of claim 7 wherein the ceiling part includes a flange and the frame component is to be abutted against the flange.

11. The data center of claim 7 wherein the floor part includes a flange and the frame component is to be abutted against the flange.

12. The data center of claim 7 wherein a thickest part of the frame component is thicker than a thinnest respective part of the ceiling part and the floor part.

13. A method, comprising:
mechanically integrating a ceiling part and a floor part of a thermally conductive component upon an integrated heat spreader of a semiconductor chip package, wherein respective inner surfaces of the ceiling part and the floor part are to form at least one cavity within the thermally conductive component;
abutting a frame component against at least one of the ceiling part or the floor part, the frame component to reside between the floor part and the integrated heat spreader; and
applying loading forces to secure a thermal assembly that includes the thermally conductive component and the frame component to an electronic circuit board, wherein the ceiling part and the floor part maintain their structural integrity during the applying of the loading forces.

14. The method of claim 13 wherein the ceiling part includes a flange and the frame component presses against the flange during the applying of the loading forces.

15. The method of claim 13 wherein the floor part includes a flange and the frame component presses against the flange during the applying of the loading forces.

16. The method of claim 13 wherein the thermally conductive component includes a vapor chamber for a two-phase cooling system.

17. The method of claim 13 wherein the thermal conductive component includes a cold plate for a liquid cooling system.

Assignees

• Intel Corp

Inventors

• Yang Jin
• Chuang Jimmy
• Liu Mengqi
• Geng Phil
• Miele Ralph V
• Ahuja Sandeep
• Shia David

Classifications

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/735

  by melting or evaporation of solids · CPC title