Semiconductor chip package thermo-mechanical cooling assembly
US-2022208645-A1 · Jun 30, 2022 · US
US12453054B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12453054-B2 |
| Application number | US-202217676100-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 18, 2022 |
| Priority date | Feb 18, 2022 |
| Publication date | Oct 21, 2025 |
| Grant date | Oct 21, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.
Opening claim text (preview).
The invention claimed is: 1. An apparatus, comprising: a bolster plate including: a first fixturing element; and a strap, the strap positioned along a frame arm of the bolster plate, the strap including a second fixturing element to be fixed to a cooling mass, the strap to diminish movement of the cooling mass along a first dimension along a length of the frame arm and a second dimension that is orthogonal to the first dimension, a semiconductor chip package to be placed in a window opening defined by the bolster plate's frame arms, the cooling mass to be thermally coupled to the semiconductor chip package; a first fastener to couple a first end of the strap to the bolster plate; and a second fastener to couple a second end of the strap to the bolster plate. 2. The apparatus of claim 1 wherein the first fixturing element is spring loaded. 3. The apparatus of claim 2 wherein the second fixturing element is a bolt that emanates from the strap. 4. The apparatus of claim 3 wherein the bolt is to be threaded through a nut that is mechanically integrated with the cooling mass. 5. The apparatus of claim 1 wherein the strap is to be bowed when the strap is secured to the cooling mass with the second fixturing element and the cooling mass is not yet secured to the bolster plate with the first fixturing element. 6. The apparatus of claim 1 wherein the bolster plate includes: a third fixturing element and a second strap, the second strap positioned along another frame arm of the bolster plate, the second strap including a fourth fixturing element to be fixed to the cooling mass, the second strap to diminish movement of the cooling mass along the first dimension and the second dimension. 7. The apparatus of claim 1 wherein the frame arm is a first frame arm and the window is defined in part by the first frame arm and a second frame arm which is opposite the frame arm across the window. 8. The apparatus of claim 5 wherein the strap is to be flat when the strap is secured to the cooling mass with the second fixturing element and the cooling mass is secured to the bolster plate with the first fixturing element. 9. A cooling assembly, comprising: a cooling mass; a nut directly coupled to the cooling mass; a bolster plate, the bolster plate including: a first fixturing element; and a strap, the strap positioned along a frame arm of the bolster plate, the strap including a second fixturing element to be coupled to the nut, the strap to diminish movement of the cooling mass along a first dimension along a length of the frame arm and a second dimension that is orthogonal to the first dimension; a stopping element coupled to the second fixturing element, the stopping element to abut the cooling mass; and a back plate, the bolster plate having additional fixturing elements to secure the bolster plate to the back plate with a printed circuit between the back plate and the bolster plate. 10. The cooling assembly of claim 9 wherein the first fixturing element is spring loaded. 11. The cooling assembly of claim 10 wherein the second fixturing element is a bolt that emanates from the strap. 12. The cooling assembly of claim 9 wherein the strap is to be bowed when the strap is secured to the cooling mass with the second fixturing element and the cooling mass is not yet secured to the bolster plate with the first fixturing element. 13. The cooling assembly of claim 9 wherein the bolster plate includes: a third fixturing element and a second strap, the second strap positioned along another frame arm of the bolster plate, the second strap including a fourth fixturing element to be fixed to the cooling mass, the second strap to diminish movement of the cooling mass along the first dimension and the second dimension. 14. The cooling assembly of claim 9 wherein the frame arm is a first frame arm and the bolster plate includes a window that is defined in part by the frame arm and a second frame arm which is opposite the frame arm across the window. 15. The cooling assembly of claim 9 wherein the cooling mass is a heat sink. 16. A data center, comprising: a plurality of racks; a plurality of electronic systems installed into the plurality of racks, the plurality of electronic systems communicatively coupled via one or more networks; an assembly including: a bolster plate; a cooling mass; a semiconductor chip package within one of the electronic systems, the semiconductor chip package in contact with the cooling mass, the semiconductor chip package located within a window of the bolster plate, the bolster plate including: a first fixturing element; and a strap, the strap positioned along a frame arm of the bolster plate, the strap including a second fixturing element that is fixed to the cooling mass, the strap to diminish movement of the cooling mass along a first dimension along a length of the frame arm and a second dimension that is orthogonal to the first dimension; and a first fastener to couple a first end of the strap to the bolster plate; and a second fastener to couple a second end of the strap to the bolster plate. 17. The data center of claim 16 wherein the cooling mass is a heat sink. 18. The data center of claim 16 wherein the bolster plate includes: a third fixturing element and a second strap, the second strap positioned along another frame arm of the bolster plate, the second strap including a fourth fixturing element to be fixed to the cooling mass, the second strap to diminish movement of the cooling mass along the first dimension and the second dimension. 19. The data center of claim 18 wherein the frame arm is a first frame arm, the first frame arm is opposite a second frame arm across the window of the bolster plate. 20. The data center of claim 16 wherein the first fixturing element is spring loaded.
within server blades for removing heat from heat source · CPC title
characterized by the mounting of blades therein, e.g. brackets, rails, trays (H05K7/1491 takes precedence) · CPC title
the radiating structures being additional and fastened onto the housing · CPC title
Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title
for server racks or cabinets; for data centers, e.g. 19-inch computer racks · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.