Connector retention mechanism for improved structural reliability

US11587597B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11587597-B2
Application numberUS-202016911168-A
CountryUS
Kind codeB2
Filing dateJun 24, 2020
Priority dateJun 24, 2020
Publication dateFeb 21, 2023
Grant dateFeb 21, 2023

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus, comprising: a dual inline memory module (DIMM) connector including multiple contacts and including mounting tabs extending from the DIMM connector, the mounting tabs having a rectangular cross-section; a printed circuit board (PCB) including pads to connect with the DIMM connector and structural mounting holes through the PCB, the mounting tabs to extend through the structural mounting holes; and a back plate to connect with the mounting tabs. 2. The apparatus of claim 1 , wherein the pads comprise surface mount pads. 3. The apparatus of claim 1 , wherein the pads comprise through-hole pads, and wherein the back plate further comprises an electrical insulator. 4. The apparatus of claim 1 , wherein the back plate comprises a metallic plate. 5. The apparatus of claim 4 , wherein the metallic plate comprises at least a portion to adhere to the mounting tabs with solder. 6. The apparatus of claim 1 , wherein the back plate comprises a non-metallic material. 7. The apparatus of claim 1 , wherein the PCB comprises a first PCB, and wherein the back plate comprises a second PCB with mounting holes to solder to the mounting tabs. 8. The apparatus of claim 1 , wherein the mounting tabs include holes through the mounting tabs, and wherein the back plate comprises a structure to secure to the holes through the mounting tabs. 9. A computing device, comprising: a printed circuit board (PCB) motherboard; a processor mounted on the PCB motherboard; a dual inline memory module (DIMM) connector including multiple contacts mounted on pads on the PCB motherboard and mounting tabs to extend through structural mounting holes through the PCB motherboard, the mounting tabs having a rectangular cross-section; and a back plate to connect with the mounting tabs. 10. The computing device of claim 9 , wherein the pads comprise surface mount pads. 11. The computing device of claim 9 , wherein the pads comprise through-hole pads, and wherein the back plate further comprises an electrical insulator. 12. The computing device of claim 9 , wherein the back plate comprises a metallic plate. 13. The computing device of claim 12 , wherein the metallic plate comprises at least a portion to adhere to the mounting tabs with solder. 14. The computing device of claim 9 , wherein the back plate comprises a non-metallic material. 15. The computing device of claim 9 , wherein the PCB comprises a first PCB, and wherein the back plate comprises a second PCB with mounting holes to solder to the mounting tabs. 16. The computing device of claim 9 , wherein the mounting tabs include holes through the mounting tabs, and wherein the back plate comprises a structure to secure to the holes through the mounting tabs. 17. The computing device of claim 9 , wherein the processor includes a multicore processor; further comprising a display communicatively coupled to the processor; further comprising a network interface communicatively coupled to the processor; or further comprising a battery to power the computing device.

Assignees

Inventors

Classifications

  • associated with surface mounted components · CPC title

  • Soldering or welding · CPC title

  • G11C5/04Primary

    Supports for storage elements {, e.g. memory modules}; Mounting or fixing of storage elements on such supports · CPC title

  • associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes · CPC title

  • Non-printed connector · CPC title

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Frequently asked questions

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What does patent US11587597B2 cover?
A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes fo…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification G11C5/04. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Feb 21 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).