Connector retention mechanism for improved structural reliability
US-2020327912-A1 · Oct 15, 2020 · US
US11587597B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11587597-B2 |
| Application number | US-202016911168-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 24, 2020 |
| Priority date | Jun 24, 2020 |
| Publication date | Feb 21, 2023 |
| Grant date | Feb 21, 2023 |
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Official abstract text for this publication.
A connector includes mounting tabs that are extended relative to traditional mounting tabs. On a back side of the printed circuit board (PCB), the mounting tabs connect to a back plate. The mounting tabs extend through the PCB and connect with the back plate, which provides improved structural integrity. Depending on the connector, the use of the mounting tabs can use existing mounting holes for the connector and remove the need for additional mounting holes.
Opening claim text (preview).
What is claimed is: 1. An apparatus, comprising: a dual inline memory module (DIMM) connector including multiple contacts and including mounting tabs extending from the DIMM connector, the mounting tabs having a rectangular cross-section; a printed circuit board (PCB) including pads to connect with the DIMM connector and structural mounting holes through the PCB, the mounting tabs to extend through the structural mounting holes; and a back plate to connect with the mounting tabs. 2. The apparatus of claim 1 , wherein the pads comprise surface mount pads. 3. The apparatus of claim 1 , wherein the pads comprise through-hole pads, and wherein the back plate further comprises an electrical insulator. 4. The apparatus of claim 1 , wherein the back plate comprises a metallic plate. 5. The apparatus of claim 4 , wherein the metallic plate comprises at least a portion to adhere to the mounting tabs with solder. 6. The apparatus of claim 1 , wherein the back plate comprises a non-metallic material. 7. The apparatus of claim 1 , wherein the PCB comprises a first PCB, and wherein the back plate comprises a second PCB with mounting holes to solder to the mounting tabs. 8. The apparatus of claim 1 , wherein the mounting tabs include holes through the mounting tabs, and wherein the back plate comprises a structure to secure to the holes through the mounting tabs. 9. A computing device, comprising: a printed circuit board (PCB) motherboard; a processor mounted on the PCB motherboard; a dual inline memory module (DIMM) connector including multiple contacts mounted on pads on the PCB motherboard and mounting tabs to extend through structural mounting holes through the PCB motherboard, the mounting tabs having a rectangular cross-section; and a back plate to connect with the mounting tabs. 10. The computing device of claim 9 , wherein the pads comprise surface mount pads. 11. The computing device of claim 9 , wherein the pads comprise through-hole pads, and wherein the back plate further comprises an electrical insulator. 12. The computing device of claim 9 , wherein the back plate comprises a metallic plate. 13. The computing device of claim 12 , wherein the metallic plate comprises at least a portion to adhere to the mounting tabs with solder. 14. The computing device of claim 9 , wherein the back plate comprises a non-metallic material. 15. The computing device of claim 9 , wherein the PCB comprises a first PCB, and wherein the back plate comprises a second PCB with mounting holes to solder to the mounting tabs. 16. The computing device of claim 9 , wherein the mounting tabs include holes through the mounting tabs, and wherein the back plate comprises a structure to secure to the holes through the mounting tabs. 17. The computing device of claim 9 , wherein the processor includes a multicore processor; further comprising a display communicatively coupled to the processor; further comprising a network interface communicatively coupled to the processor; or further comprising a battery to power the computing device.
associated with surface mounted components · CPC title
Soldering or welding · CPC title
Supports for storage elements {, e.g. memory modules}; Mounting or fixing of storage elements on such supports · CPC title
associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes · CPC title
Non-printed connector · CPC title
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