Semiconductor chip package thermo-mechanical cooling assembly

Patent metadata

Field	Value
Publication number	US-12476167-B2
Application number	US-202217696694-A
Country	US
Kind code	B2
Filing date	Mar 16, 2022
Priority date	Mar 16, 2022
Publication date	Nov 18, 2025
Grant date	Nov 18, 2025

Abstract

An apparatus is described. The apparatus includes a back plate. The apparatus includes a bolster plate that is secured to the back plate with a back bolt. The bolster plate has a window. The apparatus includes a circuit board between the back plate and the bolster plate. A semiconductor chip package is electro-mechanically coupled to the circuit board within the window. The apparatus includes a load stud that emanates from a face of the bolster plate. The back bolt emanates from an opposite face of the bolster plate. The load stud and back bolt are oriented along a same axis that is orthogonal to the face and the opposite face. The apparatus includes a heat sink. The apparatus includes a loading plate. The heat sink is mounted to the loading plate. The loading plate has a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate.

First claim

The invention claimed is:

1 . An apparatus, comprising:
a bolster plate having a window; a load stud that emanates from a face of the bolster plate; a back bolt that emanates from an opposite face of the bolster plate, the back bolt to secure the bolster plate to a back plate with a circuit board therebetween, the circuit board to support a semiconductor chip package within the window, the load stud and the back bolt oriented along a same axis that is orthogonal to the face and the opposite face; and a fixturing element to secure a loading plate to the bolster plate, the fixturing element including fingers that: (a) open away from the load stud when the load stud moves in a first direction that is deeper into the fixturing element and (b) clamp upon the load stud when the load stud moves in an opposite direction.

2 . The apparatus of claim 1 wherein the load stud and the back bolt are different sections of a same mechanical element.

3 . The apparatus of claim 2 further including the loading plate, the loading plate to be placed on the bolster plate, the loading plate having a thickness to support weight of a heat sink that is to be thermally coupled to the semiconductor chip package.

4 . The apparatus of claim 3 wherein a load spring for the fixturing element is formed by the mechanical element between the load stud and the back bolt.

5 . The apparatus of claim 1 further including the loading plate, the loading plate to be placed on the bolster plate, the loading plate having a thickness to support weight of a heat sink that is to be thermally coupled to the semiconductor chip package.

6 . The apparatus of claim 1 wherein the bolster plate does not include any observable holes.

7 . The apparatus of claim 1 wherein the bolster plate includes protrusions to strengthen the bolster plate.

8 . An apparatus, comprising:
a heat sink; a loading plate, the heat sink mounted to the loading plate, the loading plate to be placed on a bolster plate, the loading plate including a fixturing element to secure the loading plate to the bolster plate, the loading plate having a thickness to support weight of the heat sink, the fixturing element including fingers that: (a) open away from a load stud of the bolster plate when the load stud moves in a first direction that is deeper into the fixturing element and (b) clamp upon the load stud when the load stud moves in an opposite direction; and a semiconductor chip package mounted to the loading plate, the semiconductor chip package being thermally coupled to the heat sink.

9 . The apparatus of claim 8 wherein the fingers are threaded.

10 . The apparatus of claim 8 wherein the loading plate includes multiple fixturing elements to secure the loading plate to the bolster plate, the multiple fixturing elements including a respective nut to thread onto a respective load stud of the bolster plate, the fixturing elements including a respective stop element to stop further threading of the respective nut onto the respective load stud.

11 . The apparatus of claim 8 wherein the loading plate has keys to mate with corresponding keys and/or grooves on the bolster plate.

12 . The apparatus of claim 8 wherein the heat sink is mounted to the loading plate with a second fixturing element in a locked state, the thermal coupling between the heat sink and the semiconductor chip package to break when the second fixturing element is unlocked.

13 . The apparatus of claim 12 wherein the second fixturing element includes a cam to drive a pin that emanates from the loading plate toward the heat sink when the second fixturing element is being locked.

14 . An apparatus, comprising:
a back plate; a bolster plate that is secured to the back plate with a back bolt, the bolster plate having a window; a circuit board between the back plate and the bolster plate, a semiconductor chip package electro-mechanically coupled to the circuit board within the window; a load stud that emanates from a face of the bolster plate, the back bolt emanating from an opposite face of the bolster plate, the load stud and the back bolt oriented along a same axis that is orthogonal to the face and the opposite face; a heat sink; and a loading plate, the heat sink mounted to the loading plate, the loading plate including a fixturing element that is secured to the load stud to secure the loading plate to the bolster plate, the fixturing element including fingers that: (a) open away from the load stud when the load stud moves in a first direction that is deeper into the fixturing element and (b) clamp upon the load stud when the load stud moves in an opposite direction.

15 . The apparatus of claim 14 wherein the load stud and the back bolt are different sections of a same mechanical element.

16 . The apparatus of claim 15 wherein a load spring for the fixturing element is formed by the mechanical element between the load stud and the back bolt.

17 . The apparatus of claim 14 wherein the bolster plate does not include any observable holes.

18 . The apparatus of claim 14 wherein the bolster plate includes protrusions to strengthen the bolster plate.

Assignees

• Intel Corp

Inventors

• Elenitoba-Johnson Olaotan
• Erike Eric
• Smalley Jeffory L
• Encarnacion Ulises
• Miele Ralph V
• Geng Phil
• Tunuguntla Sri Priyanka
• Immeker Shaun G

Classifications

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title

• H10W40/611 Primary

  Bolts or screws · CPC title

• H01L2023/4087

  Electricity · mapped topic

• H01L23/4006 Primary

  Electricity · mapped topic