Semiconductor reflow processing for feature fill
US-10665503-B2 · May 26, 2020 · US
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Emesh Ismail T patents
Emesh Ismail T is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Emesh Ismail T |
| Total patents | 20 |
| First publication | Nov 12, 2015 |
| Latest publication | May 26, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Co or Ni and Cu integration for small and large features in integrated circuits
US-10622252-B2 · Apr 14, 2020 · US
Methods for producing interconnects in semiconductor devices
US-10062607-B2 · Aug 28, 2018 · US
Co or ni and cu integration for small and large features in integrated circuits
US-2018122696-A1 · May 3, 2018 · US
Method for electrochemically depositing metal on a reactive metal film
US-9840788-B2 · Dec 12, 2017 · US
Method for electrochemically depositing metal on a reactive metal film
US-9828687-B2 · Nov 28, 2017 · US
Co or Ni and Cu integration for small and large features in integrated circuits
US-9805976-B2 · Oct 31, 2017 · US
Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECD
US-9768060-B2 · Sep 19, 2017 · US
Co or ni and cu integration for small and large features in integrated circuits
US-2017200642-A1 · Jul 13, 2017 · US
Methods for producing interconnects in semiconductor devices
US-2017047249-A1 · Feb 16, 2017 · US
Recent patents
Latest publications not already listed above.
Methods for producing interconnects in semiconductor devices
US-9425092-B2 · Aug 23, 2016 · US
Systems and methods for removing contamination from seed layer surface
US-2016126134-A1 · May 5, 2016 · US
Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ecd
US-2016126104-A1 · May 5, 2016 · US
Semiconductor reflow processing for high aspect ratio fill
US-9245798-B2 · Jan 26, 2016 · US
Methods for depositing metal on a reactive metal film
US-2015348836-A1 · Dec 3, 2015 · US
Method for electrochemically depositing metal on a reactive metal film
US-2015345045-A1 · Dec 3, 2015 · US
Method for electrochemically depositing metal on a reactive metal film
US-2015348826-A1 · Dec 3, 2015 · US
Method for electrochemically depositing metal on a reactive metal film
US-2015348837-A1 · Dec 3, 2015 · US
Super conformal metal plating from complexed electrolytes
US-2015325477-A1 · Nov 12, 2015 · US
Super conformal plating
US-2015322587-A1 · Nov 12, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 20 |
| Applied Matrials Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/043 | 20 |
| H10W20/033 | 15 |
| H10W20/0425 | 14 |
| H10W20/056 | 14 |
| H10W20/059 | 13 |