Co or ni and cu integration for small and large features in integrated circuits

Patent metadata

Field	Value
Publication number	US-2017200642-A1
Application number	US-201614991712-A
Country	US
Kind code	A1
Filing date	Jan 8, 2016
Priority date	Jan 8, 2016
Publication date	Jul 13, 2017
Grant date	—

Abstract

In one embodiment of the present disclosure, a method for depositing metal in a feature on a workpiece is provided. The method includes electrochemically depositing a second metal layer on a first metal layer on a workpiece having at least two features of two different sizes in a dielectric layer, wherein the second metal layer is a copper layer and wherein the first metal layer includes a metal selected from the group consisting of cobalt and nickel, wherein the first metal layer completely fills the smallest feature but does not completely fill the largest feature.

First claim

1 . A method for depositing metal in a feature on a workpiece, the method comprising:
electrochemically depositing a second metal layer on a first metal layer on the workpiece having at least two features of two different sizes in a dielectric layer, wherein the second metal layer is a copper layer and wherein the first metal layer includes a metal selected from a group consisting of cobalt and nickel, wherein the first metal layer completely fills the smallest feature but does not completely fill the largest feature.

2 . The method of claim 1 , wherein a first feature has a critical dimension of less than or equal to 17 nm.

3 . The method of claim 1 , wherein a second feature has a critical dimension of greater than 20 nm.

4 . The method of claim 1 , further comprising heat treating the workpiece after deposition of the second metal layer.

5 . The method of claim 4 , wherein a temperature for heat treating the workpiece is in a temperature range of 150 degrees C. to 400 degrees C.

6 . The method of claim 4 , wherein heat treating the workpiece anneals the first and second metal layers.

7 . The method of claim 4 , wherein heat treating the workpiece reflows the second metal layer to at least partially fill the largest feature.

8 . The method of claim 4 , further comprising plasma treating the first metal layer using hydrogen plasma or hydrogen radicals (H*) prior to electrochemically depositing the second metal layer.

9 . The method of claim 1 , further comprising heat treating the first metal layer before depositing the second metal layer.

10 . The method of claim 9 , wherein heat treating the first metal layer is in a temperature range of 200 degrees C. to 400 degrees C.

11 . The method of claim 1 , wherein the second metal layer is a conformal or superconformal layer.

12 . The method of claim 1 , wherein the second metal layer includes an overburden.

13 . The method of claim 1 , wherein the second metal layer at least partially fills the largest feature without depositing an overburden on the workpiece.

14 . The method of claim 1 , further comprising electrochemically depositing a third metal layer on the second metal layer.

15 . The method of claim 14 , wherein the third metal layer is an overburden, a cap, a fill layer, a conformal conductive layer, or a superconformal conductive layer.

16 - 17 . (canceled)

18 . The method of claim 1 , wherein the first metal layer is a first seed layer.

19 . (canceled)

20 . The method of claim 18 , further comprising depositing a second seed layer on the first seed layer prior to deposition of the second metal layer.

21 . The method of claim 20 , wherein the second seed layer is different in metal composition from the first seed layer.

22 . The method of claim 20 , wherein the second seed layer is a copper seed layer.

23 - 24 . (canceled)

25 . The method of claim 1 , wherein the second metal layer is deposited over an entire surface of the first metal layer.

26 - 27 . (canceled)

28 . The method of claim 1 , wherein the second metal layer is a bottom-up fill layer.

Assignees

• Applied Materials Inc

Inventors

• Shaviv Roey
• Emesh Ismail T

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/4403

  based on metals, e.g. alloys, metal silicides (H10W20/4484 takes precedence) · CPC title

• H10W20/0526

  by thermal treatment thereof · CPC title

• H10W20/0523

  by irradiating with ultraviolet or particle radiation · CPC title

• H10W20/425 Primary

  Barrier, adhesion or liner layers · CPC title