Super conformal plating

Patent metadata

Field	Value
Publication number	US-2015322587-A1
Application number	US-201514707980-A
Country	US
Kind code	A1
Filing date	May 8, 2015
Priority date	May 9, 2014
Publication date	Nov 12, 2015
Grant date	—

Abstract

A method for at least partially filling a feature on a workpiece includes electrochemically depositing a metallization layer on a seed layer formed on a workpiece using a plating electrolyte having at least one plating metal ion, a pH range of about 6 to about 13, an organic additive, and first and second metal complexing agents.

First claim

The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:

1 . A method for at least partially filling a feature on a workpiece, the method comprising:
electrochemically depositing a metallization layer on a seed layer formed on a workpiece using a plating electrolyte having at least one plating metal ion, a pH range of about 6 to about 13, an organic additive, and first and second metal complexing agents.

2 . The method of claim 1 , wherein the feature diameter is less than 30 nm.

3 . The method of claim 1 , wherein the metallization layer is an electrochemically deposited metal super conformal layer.

4 . The method of claim 1 , wherein the metallization layer is annealed.

5 . The method of claim 1 , wherein the first metal complexing agent is selected from the group consisting of EDTA, EDA, ammonia, glycine, citrate, tartrate, and urea.

6 . The method of claim 1 , wherein the second metal complexing agent is selected from the group consisting of EDTA, EDA, ammonia, glycine, citrate, tartrate, and urea.

7 . The method of claim 1 , wherein the organic additive is an accelerator.

8 . The method of claim 1 , wherein metal for the metallization layer is selected from the group consisting of copper, cobalt, nickel, gold, silver, tin, aluminum, and alloys thereof.

9 . The method of claim 1 , wherein the workpiece further includes a barrier layer in the feature between the seed layer and a dielectric surface of the workpiece.

10 . The method of claim 1 , wherein metal for the seed layer is selected from the group consisting of copper, cobalt, nickel, gold, silver, manganese, tin, aluminum, ruthenium, and alloys thereof.

11 . The method of claim 1 , wherein the seed layer is selected from the group consisting of seed, secondary seed, and a stack film of seed and liner.

12 . A method for at least partially filling a feature on a workpiece, the method comprising:
(a) obtaining a workpiece including a feature; and (b) electrochemically depositing a superconformal metallization layer on a seed layer formed on a workpiece using a plating electrolyte having at least one plating metal ion, a pH range of about 6 to about 13, and an accelerator, and further including a first metal complexing agent and a second metal complexing agent.

Assignees

• Applied Materials Inc

Inventors

• Pabelico Chris
• Shaviv Roey
• Klocke John L
• Emesh Ismail T

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/0526

  by thermal treatment thereof · CPC title

• H10W20/0425

  comprising multiple stacked seed or nucleation layers · CPC title

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• H10W20/043

  for electroplating · CPC title