Method for electrochemically depositing metal on a reactive metal film

Patent metadata

Field	Value
Publication number	US-9840788-B2
Application number	US-201514637290-A
Country	US
Kind code	B2
Filing date	Mar 3, 2015
Priority date	May 30, 2014
Publication date	Dec 12, 2017
Grant date	Dec 12, 2017

Abstract

In accordance with one embodiment of the present disclosure, a method for depositing metal on a reactive metal film on a workpiece includes electrochemically depositing a metallization layer on a seed layer formed on a workpiece using a plating electrolyte having at least one plating metal ion, a pH range of about 6 to about 11 and applying a cathodic potential in the range of about −1 V to about −6 V. The workpiece includes a barrier layer disposed between the seed layer and a dielectric surface of the workpiece, the barrier layer including a first metal having a standard electrode potential more negative than 0 V and the seed layer including a second metal having a standard electrode potential more positive than 0 V.

First claim

The embodiments of the disclosure in which an exclusive property or privilege is claimed are defined as follows:

1. A method for depositing metal on a reactive metal film on a workpiece, the method comprising:
electrochemically depositing a metallization layer on a seed layer formed on a workpiece, wherein the workpiece includes a nonmetallic substrate having a dielectric layer disposed over the substrate, a barrier layer of manganese or manganese nitride disposed between the seed layer and a dielectric surface of the workpiece, the barrier layer including a first metal of manganese having a standard electrode potential more negative than 0 V, a diffusion barrier layer at an interface between the dielectric layer and the barrier layer, wherein the diffusion barrier layer comprises MnSiO oxide, and the seed layer having a thickness and a sidewall coverage of less than 200 angstroms, wherein the seed layer includes a second metal having a standard electrode potential more positive than 0 V, the workpiece having at least one microfeature comprising a recessed structure having a feature size of less than or equal to 50 nm, the metallization layer formed while preventing dissolution of the seed layer or the barrier layer, and the metallization layer formed using a plating electrolyte having at least one species of plating metal ions and containing a metal ion concentration of the at least one species of plating metal ions in the plating electrolyte, a pH range of about 6 to about 11, and applying a cathodic potential in a range of from about −1 V to about −6 V,
wherein an absolute value of a difference between the applied cathodic potential and a mean value of standard electrode potentials of the first and second metals is more than 1.0 V.

2. The method of claim 1 , wherein the standard electrode potential of the first metal is more negative than −0.10 V, and the standard electrode potential of the second metal is more positive than 0.10 V.

3. The method of claim 1 , wherein the metal ion concentration in the plating electrolyte is less than 0.25M.

4. The method of claim 1 , wherein the seed layer is a seed stack including a liner layer and a seed layer.

5. The method of claim 1 , wherein the workpiece further includes a liner layer between the barrier layer and the seed layer, wherein the liner layer includes a third metal having a standard electrode potential more positive than the standard electrode potential of the first metal.

6. The method of claim 5 , wherein the liner layer includes at least one metal selected from the group consisting of ruthenium, cobalt, rhenium, nickel, tantalum, tantalum nitride, and titanium nitride.

7. The method of claim 1 , wherein the seed layer includes at least one metal selected from the group consisting of copper, gold, silver, ruthenium, and alloys thereof.

8. The method of claim 1 , wherein the plating electrolyte further includes at least one metal complex selected from the group consisting of ethylenediamine, glycine, citrate, tartrate, ethylenediaminetetraacetic acid (EDTA), ammonia, and urea.

9. The method of claim 1 , wherein metal for the metallization layer is selected from the group consisting of copper, cobalt, nickel, gold, silver, and alloys thereof.

10. The method of claim 1 , wherein a thickness of the barrier layer is in a range of from 1 nm to 3 nm.

11. The method of claim 4 , wherein a thickness of the liner layer is in a range of from 5 Å to 30 Å.

12. A method for depositing metal on a reactive metal film on a workpiece, the method comprising:
electrochemically depositing a metallization layer on a seed layer formed on a workpiece, wherein the workpiece includes a nonmetallic substrate having a dielectric layer disposed over the substrate, a barrier layer of manganese or manganese nitride disposed between the seed layer and a dielectric surface of the workpiece, the barrier layer including a first metal of manganese having a standard electrode potential more negative than 0 V, a diffusion barrier layer at an interface between the dielectric layer and the barrier layer, wherein the diffusion barrier layer comprises MnSiO oxide, and the seed layer having a thickness and a sidewall coverage of less than 200 angstroms, wherein the seed layer includes a second metal having a standard electrode potential more positive than 0 V, and a liner layer separate from the seed layer and the barrier layer, the liner layer disposed between the seed layer and the barrier layer, the liner layer including a third metal having a standard electrode potential more positive than the standard electrode potential of the first metal, the workpiece having at least one microfeature comprising a recessed structure having a feature size of less than or equal to 50 nm, the metallization layer formed while preventing dissolution of the seed layer, of the barrier layer, or of the liner layer, and the metallization layer formed using a plating electrolyte having at least one species of plating metal ions and containing a metal ion concentration of the at least one species of plating metal ions in the plating electrolyte, a pH range of about 6 to about 11, and applying a cathodic potential in a range of from about −1 V to about −6 V, wherein an absolute value of a difference between the applied cathodic potential and a mean value of standard electrode potentials of the first, second, and third metals is more than 1.0 V.

Assignees

• Applied Materials Inc

Inventors

• Shaviv Roey
• Emesh Ismail T
• Argyris Dimitrios
• Aksu Serdar

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/0425

  comprising multiple stacked seed or nucleation layers · CPC title

• H10W20/425

  Barrier, adhesion or liner layers · CPC title

• H10W20/059

  by reflowing or applying pressure · CPC title

• H10W20/056

  by filling conductive material into holes, grooves or trenches · CPC title