Solid body and multi-component arrangement
US-12211702-B2 · Jan 28, 2025 · US
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Drescher Wolfram patents
Drescher Wolfram is listed as an inventor on 33 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Drescher Wolfram |
| Total patents | 33 |
| First publication | Mar 3, 2016 |
| Latest publication | Jan 28, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for Producing a Layer of Solid Material
US-2023307286-A1 · Sep 28, 2023 · US
Method for producing a layer of solid material
US-11699616-B2 · Jul 11, 2023 · US
Method of treating a solid layer bonded to a carrier substrate
US-11518066-B2 · Dec 6, 2022 · US
Method for separating thin layers of solid material from a solid body
US-11201081-B2 · Dec 14, 2021 · US
Method for Producing a Layer of Solid Material
US-2021225694-A1 · Jul 22, 2021 · US
Solid Body and Multi-Component Arrangement
US-2021225659-A1 · Jul 22, 2021 · US
Wafer production method
US-11004723-B2 · May 11, 2021 · US
Method for thinning solid body layers provided with components
US-10978311-B2 · Apr 13, 2021 · US
Method of Treating a Solid Layer Bonded to a Carrier Substrate
US-2021039279-A1 · Feb 11, 2021 · US
Recent patents
Latest publications not already listed above.
Method for the material-saving production of wafers and processing of wafers
US-10843380-B2 · Nov 24, 2020 · US
Method of producing stresses in a semiconductor wafer
US-10825732-B2 · Nov 3, 2020 · US
Wafer Production Method
US-2020185267-A1 · Jun 11, 2020 · US
Method of Producing Stresses in a Semiconductor Wafer
US-2020144121-A1 · May 7, 2020 · US
Combined wafer production method with laser treatment and temperature-induced stresses
US-10593590-B2 · Mar 17, 2020 · US
Method and device for the production of wafers with a pre-defined break initiation point
US-10580699-B1 · Mar 3, 2020 · US
Method for Thinning Solid Body Layers Provided with Components
US-2020066542-A1 · Feb 27, 2020 · US
Method for Separating Thin Layers of Solid Material from a Solid Body
US-2020006119-A1 · Jan 2, 2020 · US
Combined wafer production method with laser treatment and temperature-induced stresses
US-2019237359-A1 · Aug 1, 2019 · US
Combined wafer production method with laser treatment and temperature-induced stresses
US-10312135-B2 · Jun 4, 2019 · US
Method and device for the production of wafers with a pre-defined break initiation point
US-10304738-B2 · May 28, 2019 · US
Method and device for the production of wafers with a pre-defined break initiation point
US-10269643-B2 · Apr 23, 2019 · US
Combined production mehtod for separating a number of thin layers of solid material from a thick solid body
US-2019096746-A1 · Mar 28, 2019 · US
Splitting method and use of a material in a splitting method
US-10229835-B2 · Mar 12, 2019 · US
Method and device for the production of wafers with a pre-defined break initiation point
US-2019019729-A1 · Jan 17, 2019 · US
Combined production method for separating a number of thin layers of solid material from a thick solid body
US-10141219-B2 · Nov 27, 2018 · US
Method for the material-saving production of wafers and processing of wafers
US-2018243944-A1 · Aug 30, 2018 · US
Splitting method and use of a material in a splitting method
US-2018233373-A1 · Aug 16, 2018 · US
Method of producing large-scale layers of solid material
US-10029277-B2 · Jul 24, 2018 · US
Method for the low-loss production of multi-component wafers
US-2018118562-A1 · May 3, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Siltectra Gmbh | 33 |
| Siltectra | 1 |
| Siltectra Gmbh | 1 |
| Silectra GmbH | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B23K26/53 | 22 |
| H10P90/00 | 19 |
| H10W10/181 | 17 |
| H10P90/1916 | 17 |
| H01L21/02002 | 17 |