Method and device for the production of wafers with a pre-defined break initiation point

Patent metadata

Field	Value
Publication number	US-10269643-B2
Application number	US-201414888928-A
Country	US
Kind code	B2
Filing date	May 5, 2014
Priority date	May 3, 2013
Publication date	Apr 23, 2019
Grant date	Apr 23, 2019

Abstract

The present invention relates to a method for the production of layers of solid material, in particular for use as wafers. The method may include the following steps: providing a workpiece for the separation of the layers of solid material with the workpiece optionally having at least one exposed surface, producing and/or providing a carrier unit for receiving at least one layer of solid material having the carrier unit optionally having a receiving layer for holding the layer of solid material, attaching the receiving layer to the exposed surface of the workpiece forming a composite structure, producing a break initiation point by means of pre-defined local stress induction in the peripheral region, including at the edge, of the workpiece, and separating the layer of solid material from the workpiece starting from the break initiation point.

First claim

The invention claimed is:

1. A method for the production of layers of solid material for use as wafers, the method comprising:
providing a workpiece for the separation of the layers of solid material, the workpiece having at least one exposed surface;
producing and/or providing a carrier unit for receiving at least one layer of solid material, the carrier unit having a receiving layer for holding the layer of solid material, the receiving layer comprising a polymer;
attaching the receiving layer to the exposed surface of the workpiece to facilitate forming a composite structure;
exposing the composite structure including the receiving layer and the workpiece to an inner and/or outer stress field such that at least one part of the polymer undergoes at least one glass transition;
producing a break initiation point with use of pre-defined local stress induction in a peripheral region at an edge of the workpiece; and
separating the layer of solid material from the workpiece starting from the break initiation point.

2. The method according to claim 1 wherein the pre-defined local stress induction is brought about by exposing the composite structure to local cooling or heating, local exposure to sound waves or light waves, local exposure to electromagnetic fields, local exposure to the inverse piezo effect, and/or local exposure to radiation from a radiation source.

3. The method according to claim 2 wherein a stabilisation layer is disposed over the receiving layer to facilitate forming the composite structure and the pre-defined local stress induction is brought about by at least one stress inducing means formed in the composite structure that generates a stress peak in the layer of solid material to be separated such that the break initiation point is formed.

4. The method according to claim 3 wherein the stress inducing means is a projection formed on the stabilisation layer, in particular with a pointed end, or a recess formed in the latter.

5. The method according to claim 3 wherein the stress inducing means extends with its longitudinal axis in the longitudinal direction and/or in the depth direction of the stabilisation layer.

6. The method according to claim 3 wherein a plurality of the stress inducing means are formed on the stabilisation layer in the circumferential direction of the stabilisation layer.

7. The method according to any of claim 3 wherein the stress inducing means is a projection formed on the receiving layer with a pointed end or a recess formed in the receiving layer.

8. The method according to claim 2 wherein the pre-defined local stress induction is brought about with a pulse emitting device, the pulse emitting device emitting sound waves or light waves.

9. The method according to claim 8 wherein a number of pulse emitting devices are arranged in the circumferential direction of the workpiece and stresses are induced with the pulse emitting devices at a number of points provided in the circumferential direction of the workpiece.

10. The method according to claim 2 wherein the pre-defined local stress induction is brought about with a stress inducing means and a pulse emitting device, the stress inducing means being formed by a geometric configuration of the composite structure, and the pulse emitting device emitting light waves or sound waves.

11. The method according to claim 10 wherein the pre-defined local stress induction by means of the stress inducing means and the pulse emitting device is brought about at the same time.

12. The method according to claim 11 wherein the pre-defined local stress induction is brought about by the stress inducing means over a longer time than by the pulse emitting device, the pulse emitting device being controlled in particular dependently upon the stress inducing means.

13. The method according to claim 1 wherein:
pre-defined stress distribution within the workpiece is induced in order to specify, in a defined manner, a separation sequence when separating the layer of solid material from the workpiece, and
the layer of solid material is separated from the workpiece along a plane extending within the workpiece according to the separating sequence influenced by the pre-defined stress distribution, the pre-defined stress distribution constituting stress distribution according to which the stress intensity within a plane of the workpiece passing from the centre of the workpiece towards the peripheral regions of the workpiece is at least partially different, the stress intensity in the centre of the workpiece being greater than close to the peripheral regions of the workpiece.

14. The method according to claim 1 wherein:
basic stresses in the workpiece are generated by tempering the receiving layer, the basic stresses being smaller than the stresses required for crack initiation; and
the break initiation point is brought about by means of the pre-defined local stress induction in the peripheral region bringing about a local increase in stress, a period of time between generating the basic stresses and the local stress induction being specified in a defined manner.

Assignees

• Siltectra Gmbh

Inventors

• Lichtensteiger Lukas
• Drescher Wolfram

Classifications

• H10P90/00

  Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• H10P90/1904

  Preparing vertically inhomogeneous wafers · CPC title