Splitting method and use of a material in a splitting method

Patent metadata

Field	Value
Publication number	US-10229835-B2
Application number	US-201515516781-A
Country	US
Kind code	B2
Filing date	Oct 6, 2015
Priority date	Oct 6, 2014
Publication date	Mar 12, 2019
Grant date	Mar 12, 2019

Abstract

The overall yield of a splitting method for division of a solid-state starting material into at least two solid-state pieces is increased by use of a polymer hybrid material comprising one or more fillers in a polymer matrix. A corresponding splitting method comprises the steps of providing the solid-state starting material with at least one exposed surface, applying a polymer hybrid material comprising fillers in a polymer matrix to at least one exposed surface of the solid-state starting material, so as to result in a composite structure, and subjecting the composite structure to a stress field such that the solid-state starting material is split along a plane within the solid-state starting material into at least two solid-state pieces.

First claim

The invention claimed is:

1. A polymer hybrid material comprising one or more fillers in a polymer matrix for use in a splitting method for division of a solid-state starting material into at least two solid-state pieces, wherein the one or more fillers brings about a specific influence on removal of the polymer hybrid material after the division of the solid-state starting material, wherein the one or more fillers comprises at least one metal, and/or inorganic fibers, and/or silica, and wherein the one or more fillers reacts with aid of a reactant to release a gaseous product.

2. The polymer hybrid material as claimed in claim 1 , wherein the polymer matrix comprises an elastomer matrix.

3. The polymer hybrid material as claimed in claim 1 , wherein the one or more fillers is distributed in the polymer matrix such that the polymer hybrid material has isotropic or anisotropic properties.

4. The polymer hybrid material as claimed in claim 1 applied to division of a cylindrical solid-state starting material into at least two cylindrical solid-state pieces.

5. The polymer hybrid material as claimed in claim 1 , wherein the one or more fillers acts as catalyst, promoter, initiator or inhibitor in the removal of the polymer hybrid material after the division of the solid-state starting material.

6. The polymer hybrid material as claimed in claim 1 , wherein the one or more fillers comprises at least one metal, and brings about an improvement in thermal conductivity over a filler-free matrix.

7. A splitting method for division of a solid-state starting material into two or more solid-state pieces, comprising the following steps:
providing the solid-state starting material having at least one exposed surface,
applying a polymer hybrid material comprising one or more fillers in a polymer matrix to at least one exposed surface of the solid-state starting material, so as to result in a composite structure, wherein the one or more fillers comprise at least one metal, and/or inorganic fibers, and/or silica, and wherein the one or more fillers reacts with aid of a reactant to release a gaseous product,
subjecting the composite structure to a stress field in such a way that the solid-state starting material is split along a plane within the solid-state starting material into at least two solid-state pieces,
removing the polymer hybrid material from the solid-state piece, wherein this removal is influenced in a specific manner by the one or more fillers.

8. The splitting method as claimed in claim 7 , wherein the polymer matrix of the polymer hybrid material comprises an elastomer matrix.

9. The splitting method as claimed in claim 7 , wherein the one or more fillers is distributed in the polymer matrix such that the polymer hybrid material has isotropic or anisotropic properties.

10. The splitting method as claimed in claim 7 , wherein a cylindrical solid-state starting material is divided into at least two cylindrical solid-state pieces.

11. The splitting method as claimed in claim 7 , wherein first a sacrificial layer is applied to at least one exposed surface of the solid-state starting material and then the polymer hybrid material is applied to the sacrificial layer, such that the composite structure comprises the solid-state starting material, the sacrificial layer and the polymer hybrid material.

12. The splitting method as claimed in claim 7 , wherein the one or more fillers acts as catalyst, promoter, initiator or inhibitor in the removal of the polymer hybrid material.

13. The splitting method as claimed in claim 7 , wherein the one or more fillers comprise at least one metal, and brings about an improvement in thermal conductivity over a filler-free matrix.

14. The polymer hybrid material as claimed in claim 1 , wherein the at least one metal comprises aluminum, iron, zinc and/or copper, and the inorganic fibers comprise carbon fibers, glass fibers and/or basalt fibers.

15. The polymer hybrid material as claimed in claim 2 , wherein the elastomer matrix comprises a polydiorganosiloxane matrix.

16. The polymer hybrid material as claimed in claim 2 , wherein the elastomer matrix comprises a polydimethylsiloxane matrix.

17. The polymer hybrid material as claimed in claim 1 wherein the reactant comprises an oxidizing agent.

18. The splitting method as claimed in claim 7 , wherein the at least one metal comprises aluminum, iron, zinc and/or copper, and the inorganic fibers comprise carbon fibers, glass fibers and/or basalt fibers.

19. The splitting method as claimed in claim 8 , wherein the elastomer matrix comprises a polydiorganosiloxane matrix.

20. The splitting method as claimed in claim 8 , wherein the elastomer matrix comprises a polydimethylsiloxane matrix.

21. The splitting method as claimed in claim 7 , wherein the reactant comprises an oxidizing agent.

22. The splitting method as claimed in claim 13 , wherein the at least one metal comprises aluminum, iron, zinc and/or copper.

Assignees

• Siltectra Gmbh

Inventors

• Drescher Wolfram
• Richter Jan
• Beyer Christian

Classifications

• H10P90/00

  Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P90/1904

  Preparing vertically inhomogeneous wafers · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• C08K3/08

  Metals · CPC title