Microelectrode grid with flap for continuous intraoperative neuromonitoring
US-2025235141-A1 · Jul 24, 2025 · US
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Dayeh Shadi A patents
Dayeh Shadi A is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Dayeh Shadi A |
| Total patents | 17 |
| First publication | Aug 17, 2017 |
| Latest publication | Jul 24, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Flexible and scalable microelectrode probe device
US-2025090073-A1 · Mar 20, 2025 · US
Porous platinum nanorod electrode array flexible sensor devices and fabrication
US-12065745-B2 · Aug 20, 2024 · US
Multi-hundred or thousand channel electrode electrophysiological array and fabrication method
US-2024226565-A9 · Jul 11, 2024 · US
Multi-hundred or thousand channel electrode electrophysiological array and fabrication method
US-2024131339-A1 · Apr 25, 2024 · US
Tactile sensor array on flexible substrate with piezoelectric tft tactile sensor
US-2023271320-A1 · Aug 31, 2023 · US
Addressable vertical nanowire probe arrays and fabrication methods
US-11363979-B2 · Jun 21, 2022 · US
Intrinsically tunable and ultra-linear multi-fin MIS-HEMT devices
US-11233142-B2 · Jan 25, 2022 · US
Porous platinum nanorod electrode array flexible sensor devices and fabrication
US-2021371987-A1 · Dec 2, 2021 · US
Monolithic thin film elements and performance electronics, solar powered systems and fabrication
US-11056517-B2 · Jul 6, 2021 · US
Recent patents
Latest publications not already listed above.
Method for forming a multielectrode conformal penetrating array
US-10856764-B2 · Dec 8, 2020 · US
Instrinscally tunable and ultra-linear multi-fin mis hemt devices
US-2020295170-A1 · Sep 17, 2020 · US
Solid-state wafer bonding of functional materials on substrates and self-aligned contacts
US-10679964-B2 · Jun 9, 2020 · US
Addressable vertical nanowire probe arrays and fabrication methods
US-2019021619-A1 · Jan 24, 2019 · US
Monolithic thin film elements and performance electronics, solar powered systems and fabrication
US-2018040649-A1 · Feb 8, 2018 · US
Solid-state wafer bonding of functional materials on substrates and self-aligned contacts
US-2017317050-A1 · Nov 2, 2017 · US
Flexible penetrating cortical multielectrode arrays, sensor devices and manufacturing methods
US-2017231518-A1 · Aug 17, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ California | 17 |
| The Regents of the Unverslty of California | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| A61B2562/125 | 7 |
| B81C1/00111 | 4 |
| A61B5/293 | 4 |
| A61B2562/0209 | 4 |
| A61B5/388 | 3 |