Flexible penetrating cortical multielectrode arrays, sensor devices and manufacturing methods

Patent metadata

Field	Value
Publication number	US-2017231518-A1
Application number	US-201515501426-A
Country	US
Kind code	A1
Filing date	Aug 7, 2015
Priority date	Aug 7, 2014
Publication date	Aug 17, 2017
Grant date	—

Abstract

A preferred conformal penetrating multi electrode array includes a plastic substrate that is flexible enough to conform to cortical tissue. A plurality of penetrating semiconductor micro electrodes extend away from a surface of the flexible substrate and are stiff enough to penetrate cortical tissue. Electrode lines are encapsulated at least partially within the flexible substrate and electrically connected to the plurality of penetrating semiconductor microelectrodes. The penetrating semiconductor electrodes preferably include pointed metal tips. A preferred method of fabrication permits forming stiff penetrating electrodes on a substrate that is very flexible, and providing electrical connection to electrode lines within the substrate.

First claim

1 . A conformal penetrating multi electrode array, comprising:
a flexible substrate; electrode lines encapsulated at least partially within the flexible substrate; and a plurality of penetrating semiconductor micro electrodes extending away from a surface of said flexible substrate and being electrically connected to provide signals to said electrode lines.

2 . The array of claim 1 , wherein end portions of at least some of said electrode lines are exposed for contact to another device.

3 . The array of claim 2 , further comprising an electrode clip attached to said end portions.

4 . The array of claim 1 , wherein said electrode lines separately address single ones or groups of said plurality of penetrating semiconductor micro electrodes.

5 . The array of claim 1 , wherein said flexible substrate comprises a plastic substrate.

6 . The array of claim 5 , wherein said flexible substrate comprises polyimide.

7 . The array of claim 5 , wherein said penetrating semiconductor micro electrodes comprise silicon.

8 . The array of claim 1 , wherein said penetrating semiconductor micro electrodes comprise silicon a pointed tip.

9 . The array of claim 8 , wherein said penetrating semiconductor micro electrodes comprise a pointed metal tip.

10 . The array of claim 8 , further comprising a metal encapsulation of said penetrating semiconductor micro electrodes.

11 . The array of claim 1 , further comprising a metal encapsulation of said penetrating semiconductor micro electrodes.

12 . The array of claim 1 , wherein a pitch between individual ones of said penetrating semiconductor micro electrodes is in the range of 25-200 μm.

13 . The array of claim 12 , wherein a pitch between individual ones of said penetrating semiconductor micro electrodes is in the range of 25-50 μm.

14 . The array of claim 1 , wherein said flexible substrate has a total thickness in the range of 7˜15 μm.

15 . The array of claim 1 , wherein said plurality of semiconductor electrodes are arranged in a square pattern.

16 . The array of claim 1 , wherein a height of said semiconductor micro electrodes is ˜30-120 μm.

17 . The array of claim 16 , wherein a height of said semiconductor micro electrodes is ˜70-100 μm.

18 . A method for forming a multielectrode conformal penetrating array, the method comprising:
providing a semiconductor substrate; coating a face of the semiconductor substrate with a flexible material; patterning the flexible material for vias; patterning and forming electrode lines on the flexible material and contact pads through the vias; patterning an opposite face of the semiconductor substrate; and etching the semiconductor substrate to form penetrating semiconductor micro electrodes extending away from the opposite face.

19 . The method of claim 18 , wherein said flexible material comprises plastic.

20 . The method of claim 19 , wherein said flexible material comprises polyimide.

21 . The method of claim 18 , further comprising depositing an additional layer of flexible material over said electrode lines prior to said patterning an opposite face.

22 . The method of claim 18 , further comprising encapsulating the penetrating semiconductor micro electrodes.

23 . A conformal penetrating multi electrode array, comprising:
a plastic substrate that is flexible enough to conform to cortical tissue; a plurality of penetrating semiconductor micro electrodes extending away from a surface of said flexible substrate that are stiff enough to penetrate cortical tissue; and electrode lines encapsulated at least partially within the flexible substrate and electrically connected to said plurality of penetrating semiconductor microelectrodes.

24 . The array of claim 23 , wherein said penetrating semiconductor electrodes comprise pointed metal tips.

Assignees

• Univ California

Inventors

• Dayeh Shadi A
• Azzazy Farid
• Lee Sang Heon

Classifications

• B81B1/00

  Devices without movable or flexible elements, e.g. microcapillary devices · CPC title

• B81B2201/0292

  Sensors not provided for in B81B2201/0207 - B81B2201/0285 · CPC title

• B81C1/00111

  Tips, pillars, i.e. raised structures (microneedles A61M37/0015) · CPC title

• B81B2203/04

  Electrodes · CPC title

• B81B2203/0361

  Tips, pillars · CPC title