Method for forming a multielectrode conformal penetrating array

Patent metadata

Field	Value
Publication number	US-10856764-B2
Application number	US-201515501426-A
Country	US
Kind code	B2
Filing date	Aug 7, 2015
Priority date	Aug 7, 2014
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

A preferred conformal penetrating multi electrode array includes a plastic substrate that is flexible enough to conform to cortical tissue. A plurality of penetrating semiconductor micro electrodes extend away from a surface of the flexible substrate and are stiff enough to penetrate cortical tissue. Electrode lines are encapsulated at least partially within the flexible substrate and electrically connected to the plurality of penetrating semiconductor microelectrodes. The penetrating semiconductor electrodes preferably include pointed metal tips. A preferred method of fabrication permits forming stiff penetrating electrodes on a substrate that is very flexible, and providing electrical connection to electrode lines within the substrate.

First claim

The invention claimed is:

1. A method for forming a multielectrode conformal penetrating array, the method comprising:
providing a semiconductor substrate having a thickness corresponding to a height of penetrating semiconductor micro electrodes to be formed;
coating a face of the semiconductor substrate with a flexible material in a thickness corresponding to a flexible substrate to be formed;
patterning the flexible material for vias;
patterning and forming electrode lines on the flexible material and contact pads through the vias;
patterning an opposite face of the semiconductor substrate; and etching away the semiconductor substrate to leave a pattern of a two-dimensional array of the penetrating semiconductor micro electrodes extending away from the flexible substrate formed by the flexible material that is exposed after etching away the semiconductor substrate to leave the pattern of the two-dimensional array of the penetrating semiconductor micro electrodes extending perpendicularly from the flexible substrate.

2. The method of claim 1 , wherein the flexible material and the flexible substrate comprise polyimide.

3. The method of claim 1 , wherein the semiconductor substrate and the penetrating semiconductor micro electrodes comprise silicon.

4. The method of claim 1 , wherein said etching away uses a mask that is resistant to etching for part of the etching away and becomes etched during a final portion of the etching away to form the penetrating semiconductor micro electrodes with pointed tips.

5. The method of claim 4 , further comprising depositing metal prior to said etching away, wherein the pointed tips include the metal that is deposited prior to said etching away.

6. The method of claim 1 , further comprising encapsulating the penetrating semiconductor micro electrodes with metal.

7. The method of claim 1 , wherein a pitch between individual ones of the penetrating semiconductor micro electrodes is in the range of 25-200 μm.

8. The method of claim 7 , wherein a pitch between individual ones of the penetrating semiconductor micro electrodes is in the range of 25-50 μm.

9. The method of claim 1 , wherein the flexible substrate has a total thickness in the range of ˜7-15 μm.

10. The method of claim 1 , wherein said patterning and etching away leaves a square pattern of the penetrating semiconductor microelectrodes.

11. The method of claim 1 , wherein the thickness of the semiconductor substrate and the height of semiconductor micro electrodes is ˜30-120 μm.

12. The method of claim 11 , wherein the thickness of the semiconductor substrate and the height of said semiconductor micro electrodes is ˜70-100 μm.

13. The method of claim 1 , wherein said flexible material comprises plastic.

14. The method of claim 13 , wherein said flexible material comprises polyimide.

15. The method of claim 1 , further comprising depositing an additional layer of flexible material over said electrode lines prior to said patterning an opposite face.

16. The method of claim 1 , further comprising encapsulating the penetrating semiconductor micro electrodes.

Assignees

• Univ California

Inventors

• Dayeh Shadi A
• Azzazy Farid
• Lee Sang Heon

Classifications

• A61B5/291 Primary

  for electroencephalography [EEG] · CPC title

• B81B1/00

  Devices without movable or flexible elements, e.g. microcapillary devices · CPC title

• B81C2201/013

  Etching · CPC title

• B81B2201/0292

  Sensors not provided for in B81B2201/0207 - B81B2201/0285 · CPC title

• B81B2203/04

  Electrodes · CPC title