Microelectronic devices including heat sinks, and associated devices and methods
US-2026018483-A1 · Jan 15, 2026 · US
This page is not indexed by search engines while we improve data quality.
Davis James E patents
Davis James E is listed as an inventor on 47 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Davis James E |
| Total patents | 47 |
| First publication | Mar 5, 2015 |
| Latest publication | Jan 15, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Apparatus with voltage protection mechanism
US-12513998-B2 · Dec 30, 2025 · US
Discharge circuits
US-2025308600-A1 · Oct 2, 2025 · US
Discharge circuits
US-12354669-B2 · Jul 8, 2025 · US
Plasma induced damage detection of a memory die
US-2025180640-A1 · Jun 5, 2025 · US
Method and apparatus of memory array device with low arcing risk
US-2024395325-A1 · Nov 28, 2024 · US
Drain-ballasted electrostatic discharge protection circuits
US-2024372360-A1 · Nov 7, 2024 · US
Microelectronic devices including through-silicon vias, and related memory devices and electronic systems
US-2024290385-A1 · Aug 29, 2024 · US
Discharge circuits
US-2024071516-A1 · Feb 29, 2024 · US
Multi-die memory device with peak current reduction
US-11908812-B2 · Feb 20, 2024 · US
Recent patents
Latest publications not already listed above.
Apparatus with voltage protection mechanism
US-2024038759-A1 · Feb 1, 2024 · US
Semiconductor devices with package-level configurability
US-11848323-B2 · Dec 19, 2023 · US
Apparatus with voltage protection mechanism
US-11798935-B2 · Oct 24, 2023 · US
Semiconductor devices having 3-dimensional inductive structures
US-11508657-B2 · Nov 22, 2022 · US
Apparatus with voltage protection mechanism
US-2022359495-A1 · Nov 10, 2022 · US
Memory device including circuitry under bond pads
US-11424169-B2 · Aug 23, 2022 · US
Apparatus with voltage protection mechanism
US-11398468-B2 · Jul 26, 2022 · US
Multi-die memory device with peak current reduction
US-2022199554-A1 · Jun 23, 2022 · US
Semiconductor devices with through silicon vias and package-level configurability
US-11056467-B2 · Jul 6, 2021 · US
Apparatus with voltage protection mechanism
US-2021183851-A1 · Jun 17, 2021 · US
Semiconductor devices with package-level configurability
US-2021175228-A1 · Jun 10, 2021 · US
Semiconductor devices with package-level configurability
US-10930645-B2 · Feb 23, 2021 · US
Memory device including circuitry under bond pads
US-2021043525-A1 · Feb 11, 2021 · US
Semiconductor devices with package-level configurability
US-10867991-B2 · Dec 15, 2020 · US
Semiconductor devices having 3-dimensional inductive structures
US-2020373238-A1 · Nov 26, 2020 · US
Semiconductor devices with post-probe configurability
US-10811372-B2 · Oct 20, 2020 · US
Semiconductor devices having 3-dimensional inductive structures
US-10784192-B2 · Sep 22, 2020 · US
Semiconductor devices with package-level configurability
US-2020212032-A1 · Jul 2, 2020 · US
Semiconductor devices with package-level configurability
US-2020152620-A1 · May 14, 2020 · US
Semiconductor devices having 3-dimensional inductive structures
US-2020144182-A1 · May 7, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 42 |
| Univ California | 3 |
| Intel Corp | 2 |
| Davis James E | 1 |
| Chaine Michael D | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 31 |
| H10W42/60 | 26 |
| H10W90/24 | 20 |
| H10D89/921 | 20 |
| H10W72/01 | 19 |