Electrodeposition systems and methods that minimize anode and/or plating solution degradation
US-10041183-B2 · Aug 7, 2018 · US
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Cox Harry D patents
Cox Harry D is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cox Harry D |
| Total patents | 19 |
| First publication | May 19, 2015 |
| Latest publication | Aug 7, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device contact structure having stacked nickel, copper, and tin layers
US-9853006-B2 · Dec 26, 2017 · US
Filtering lead from photoresist stripping solution
US-9804498-B2 · Oct 31, 2017 · US
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer
US-9728440-B2 · Aug 8, 2017 · US
Electrodeposition systems and methods that minimize anode and/or plating solution degradation
US-2017211199-A1 · Jul 27, 2017 · US
Electrodeposition systems and methods that minimize anode and/or plating solution degradation
US-9689084-B2 · Jun 27, 2017 · US
Anodized metal on carrier wafer
US-9679796-B2 · Jun 13, 2017 · US
Layered contact structure
US-2016307860-A1 · Oct 20, 2016 · US
Dual layer stack for contact formation
US-9401336-B2 · Jul 26, 2016 · US
Multilayered contact structure having nickel, copper, and nickel-iron layers
US-9396991-B2 · Jul 19, 2016 · US
Recent patents
Latest publications not already listed above.
Dual layer stack for contact formation
US-2016126201-A1 · May 5, 2016 · US
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer
US-2016118287-A1 · Apr 28, 2016 · US
Anodized metal on carrier wafer
US-2016118283-A1 · Apr 28, 2016 · US
Multilayered contact structure having nickel, copper, and nickel-iron layers
US-2016056072-A1 · Feb 25, 2016 · US
Filtering lead from photoresist stripping solution
US-2015352476-A1 · Dec 10, 2015 · US
Selective plating without photoresist
US-2015348910-A1 · Dec 3, 2015 · US
Electrodeposition systems and methods that minimize anode and/or plating solution degradation
US-2015337451-A1 · Nov 26, 2015 · US
Selective plating without photoresist
US-2015311161-A1 · Oct 29, 2015 · US
Structures for improving current carrying capability of interconnects and methods of fabricating the same
US-9035459-B2 · May 19, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 12 |
| Globalfoundries Inc | 8 |
| Arvin Charles L | 1 |
| Bezama Raschid J | 1 |
| Cox Harry D | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/7422 | 8 |
| H10P72/7416 | 8 |
| H10P72/744 | 8 |
| H10P72/74 | 8 |
| H10W72/952 | 7 |