Filtering lead from photoresist stripping solution

Patent metadata

Field	Value
Publication number	US-9804498-B2
Application number	US-201414299444-A
Country	US
Kind code	B2
Filing date	Jun 9, 2014
Priority date	Jun 9, 2014
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A photoresist stripping tool includes a reservoir configured to contain photoresist stripping solution and a Pb filter comprising a filter element with Tin (Sn) exterior surfaces. A semiconductor wafer fabrication system includes a semiconductor wafer attached to the photoresist stripping tool that strips photoresist from the semiconductor wafer. A photoresist stripping processes includes stripping photoresist from a leaded semiconductor wafer with photoresist stripping solution within the photoresist stripping tool, filtering Lead Pb from the photoresist stripping solution with the Pb filter, and stripping photoresist from a lead-free semiconductor wafer with the filtered photoresist stripping solution.

First claim

The invention claimed is:

1. A photoresist stripping tool comprising:
a reservoir comprising a photoresist stripping solution;
a Lead (Pb) free semiconductor wafer and a leaded semiconductor wafer simultaneously within the reservoir, wherein Pb from the leaded semiconductor wafer corrodes into the photoresist stripping solution;
a Pb filter within the reservoir that removes Pb from the photoresist stripping solution, the Pb filter comprising a mesh filter element comprising an inner Copper structure and Tin (Sn) specie exterior surfaces; and
Pb from the photoresist stripping solution deposited upon the Sn specie exterior surfaces of the mesh filter element.

2. The photoresist stripping tool of claim 1 , wherein the Sn specie is pure Sn.

3. The photoresist stripping tool of claim 1 , wherein the Sn specie has an oxidation state of 2.

4. The photoresist stripping tool of claim 1 , further comprising:
a conduit in contact with the reservoir, the conduit comprising an inlet to accept the photoresist stripping solution from the reservoir and an outlet to return the photoresist stripping solution to the reservoir, and;
a pump to move the photoresist stripping solution via the conduit.

5. The photoresist stripping tool of claim 4 , wherein the Pb filter is comprised between the inlet and the outlet.

6. The photoresist stripping tool of claim 1 , wherein the Pb filter comprises a plurality of mesh filter elements.

7. A semiconductor wafer fabrication system comprising:
a Lead (Pb) free semiconductor wafer and a leaded semiconductor wafer within a reservoir of a photoresist stripping tool that simultaneously strips photoresist from the Pb free semiconductor wafer and the leaded semiconductor wafer, wherein Pb from the leaded semiconductor wafer corrodes into the photoresist stripping solution, the photoresist stripping tool comprising:
the reservoir that contains a photoresist stripping solution;
a Pb filter within the reservoir that removes Pb from the photoresist stripping solution, the Pb filter comprising a mesh filter element comprising an inner Titanium structure and Tin (Sn) specie exterior surfaces; and
Pb from the photoresist stripping solution deposited upon the Sn specie exterior surfaces of the mesh filter element.

8. The semiconductor wafer fabrication system of claim 7 , wherein the Sn specie is pure Sn.

9. The of claim 7 , wherein the Sn specie has an oxidation state of 2.

10. The semiconductor wafer fabrication system of claim 7 , wherein the photoresist stripping tool further comprises:
a conduit in contact with the reservoir, the conduit comprising an inlet to accept the photoresist stripping solution from the reservoir and an outlet to return the photoresist stripping solution to the reservoir, and;
a pump to move the photoresist stripping solution via the conduit.

11. The semiconductor wafer fabrication system of claim 10 , wherein the Pb filter is comprised between the inlet and the outlet.

12. The semiconductor wafer fabrication system of claim 7 , wherein the Pb filter comprises a plurality of mesh filter elements.

13. The photoresist stripping tool of claim 1 , wherein a concentration of Pb within the photoresist stripping solution is below a predetermined Pb concentration threshold such that a monolayer of Pb does not form upon the Pb free semiconductor wafer and does not form upon the leaded semiconductor wafer.

14. The semiconductor wafer fabrication system of claim 7 , wherein a concentration of Pb within the photoresist stripping solution is below a predetermined Pb concentration threshold such that a monolayer of Pb does not form upon the Pb free semiconductor wafer and does not form upon the leaded semiconductor wafer.

15. The photoresist stripping tool of claim 1 , wherein Pb oxidizes the Sn specie exterior surface of the mesh filter element and Pb is deposited upon the mesh filter element.

16. The semiconductor wafer fabrication system of claim 7 , wherein Pb oxidizes the Sn specie exterior surfaces of the mesh filter element and Pb is deposited upon the mesh filter element.

17. The photoresist stripping tool of claim 1 , wherein the Sn specie is Cu 6 Sn 5 .

18. The photoresist stripping tool of claim 1 , wherein the Sn specie is Cu 3 Sn.

19. The photoresist stripping tool of claim 1 , wherein the Sn specie is SnAg.

20. The photoresist stripping tool of claim 1 , wherein the Sn specie is SnBi.

Assignees

• IBM

Inventors

• Arvin Charles L
• Cox Harry D
• Merryman Arthur G
• Schuler Jennifer D

Classifications

• H10P50/287

  by chemical means · CPC title

• B01D39/12

  of wire gauze; of knitted wire; of expanded metal · CPC title

• G03F7/422 Primary

  using liquids only (G03F7/421 takes precedence) · CPC title

• H01L21/31133

  Electricity · mapped topic