Thickness uniformity improvement kit for thermally sensitive epitaxial processing
US-12519005-B2 · Jan 6, 2026 · US
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Collins Richard O patents
Collins Richard O is listed as an inventor on 36 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Collins Richard O |
| Total patents | 36 |
| First publication | Feb 5, 2015 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Overlap susceptor and preheat ring
US-2025354250-A1 · Nov 20, 2025 · US
Plasma preclean system for cluster tool
US-2025285846-A1 · Sep 11, 2025 · US
Epitaxial deposition chamber
US-2025275015-A1 · Aug 28, 2025 · US
Overlap susceptor and preheat ring
US-12371776-B2 · Jul 29, 2025 · US
Plasma preclean system for cluster tool
US-12334318-B2 · Jun 17, 2025 · US
Epitaxial deposition chamber
US-12324061-B2 · Jun 3, 2025 · US
Multi-layer epi chamber body
US-2025101629-A1 · Mar 27, 2025 · US
Multi-layer EPI chamber body
US-12188148-B2 · Jan 7, 2025 · US
Multi-thermal cvd chambers with shared gas delivery and exhaust system
US-2024318351-A1 · Sep 26, 2024 · US
Recent patents
Latest publications not already listed above.
Multi-thermal CVD chambers with shared gas delivery and exhaust system
US-12037701-B2 · Jul 16, 2024 · US
Thickness uniformity improvement kit for thermally sensitive epitaxial processing
US-2024038575-A1 · Feb 1, 2024 · US
Overlap susceptor and preheat ring
US-2024026522-A1 · Jan 25, 2024 · US
Substrate transfer mechanism to reduce back-side substrate contact
US-2023420279-A1 · Dec 28, 2023 · US
Plasma preclean system for cluster tool
US-2023402268-A1 · Dec 14, 2023 · US
Overlap susceptor and preheat ring
US-11781212-B2 · Oct 10, 2023 · US
Substrate transfer mechanism to reduce back-side substrate contact
US-11784076-B2 · Oct 10, 2023 · US
Substrate transfer mechanism to reduce back-side substrate contact
US-2022351999-A1 · Nov 3, 2022 · US
Overlap susceptor and preheat ring
US-2022325400-A1 · Oct 13, 2022 · US
Epitaxial deposition chamber
US-2022322492-A1 · Oct 6, 2022 · US
Substrate transfer mechanism to reduce back-side substrate contact
US-11424149-B2 · Aug 23, 2022 · US
Multi-layer epi chamber body
US-2022195617-A1 · Jun 23, 2022 · US
Diode laser for wafer heating for EPI processes
US-11171023-B2 · Nov 9, 2021 · US
Multi-thermal cvd chambers with shared gas delivery and exhaust system
US-2021324514-A1 · Oct 21, 2021 · US
Susceptor support
US-10837121-B2 · Nov 17, 2020 · US
Substrate transfer mechanism to reduce back-side substrate contact
US-2020303228-A1 · Sep 24, 2020 · US
Substrate transfer mechanism to reduce back-side substrate contact
US-10755955-B2 · Aug 25, 2020 · US
Substrate transfer mechanism to reduce back-side substrate contact
US-2019252229-A1 · Aug 15, 2019 · US
Susceptor design to reduce edge thermal peak
US-10269614-B2 · Apr 23, 2019 · US
Susceptor support
US-2017275777-A1 · Sep 28, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 36 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0436 | 27 |
| H10P72/0402 | 18 |
| H10P72/7612 | 17 |
| H10P72/7611 | 16 |
| H01L21/67017 | 12 |