Substrate transfer mechanism to reduce back-side substrate contact

Patent metadata

Field	Value
Publication number	US-2023420279-A1
Application number	US-202318244557-A
Country	US
Kind code	A1
Filing date	Sep 11, 2023
Priority date	Feb 12, 2018
Publication date	Dec 28, 2023
Grant date	—

Abstract

A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.

First claim

1 . A chamber, comprising:
a plurality of stacked holders that are each configured to support a substrate, wherein each of the stacked holders includes a standoff, and the standoff includes a curved inner portion; and a pedestal comprising a heat transfer element positioned to regulate a temperature of a substrate supported on a holder of the plurality of stacked holders.

2 . A substrate processing system, comprising:
a transfer chamber; the chamber of claim 1 , wherein the chamber is coupled to the transfer chamber; and a transfer chamber robot disposed within the transfer chamber and configured to transfer a substrate from the transfer chamber to each of the plurality of stacked holders.

3 . The substrate processing system of claim 2 , further comprising:
a factory interface loading station comprising a loading station robot, wherein the processing chamber is disposed between the transfer chamber and the factory interface loading station, and the loading station robot is configured to transfer a substrate from the factory interface loading station to each of the plurality of stacked holders.

4 . The chamber of claim 1 , wherein each of the stacked holders further includes a plurality of support members extending laterally from the curved inner portion of the standoff.

5 . The chamber of claim 4 , wherein the plurality of support members are made of a quartz material and are coupled to the standoff, and the standoff is made of a metallic material.

6 . The chamber of claim 1 , further comprising a heating module, wherein the plurality of stacked holders are disposed between the heating module and the pedestal, and the heating module is configured to heat a substrate supported on a holder of the plurality of stacked holders.

7 . The chamber of claim 1 , further comprising one or more vent passages and an exhaust passage, wherein the one or more vent passages and the exhaust passage are configured to form a laminar gas flow therebetween.

8 . The chamber of claim 1 , wherein the substrate rests on the holder of the plurality of stacked holders.

9 . The chamber of claim 1 , wherein the plurality of stacked holders are each configured to support a carrier that supports the respective substrate, and the carrier is made of a ceramic material.

10 . The chamber of claim 1 , further comprising:
a support coupled to a shaft that extends through a bottom of the chamber, wherein the plurality of stacked holders are mounted to the support; and a lift mechanism coupled to the shaft, the lift mechanism disposed exterior to the chamber, wherein the lift mechanism is configured to control an elevation of the plurality of stacked holders within the chamber.

11 . The chamber of claim 1 , wherein the heat transfer element is sealed into the pedestal using a circular metallic over plate.

12 . A chamber, comprising:
a plurality of stacked holders that are each configured to support a substrate; and a pedestal comprising a heat transfer element positioned to regulate a temperature of a substrate supported on a holder of the plurality of stacked holders, the pedestal coupled to a bottom of the processing chamber, and the heat transfer element comprising passages to allow a fluid to pass therethrough.

13 . The chamber of claim 12 , wherein a distance between an upper surface of the pedestal and a lower surface of a carrier supported by one of the holders is about inches.

14 . The chamber of claim 12 , wherein each of the stacked holders includes:
a standoff, the standoff including a curved inner portion, and the curved inner portion including a curved lip; and a second standoff having a second curved lip pointing toward the curved lip of the standoff, wherein the standoff and the second standoff are on opposite sides of the pedestal.

15 . The chamber of claim 14 , wherein the pedestal is centrally disposed within the chamber, and the standoff and the second standoff are separated by a pitch of about 1 inch.

16 . The chamber of claim 12 , wherein the passages are coupled to a cooling fluid source.

17 . A chamber, comprising:
a plurality of stacked holders that are each configured to support a substrate; a pedestal comprising a heat transfer element positioned to regulate a temperature of a substrate supported on a holder of the plurality of stacked holders; and a plurality of locating pins positioned within a plurality of openings formed in a peripheral region of a platen of the pedestal, the plurality of locating pins made of a quartz material, and the plurality of locating pins defining an outer edge location of a carrier when the carrier is supported by one of the stacked holders.

18 . The chamber of claim 17 , further comprising a plurality of alignment pads coupled to the platen, each of the plurality of alignment pads comprising a shoulder portion surrounding a protrusion that extends from the shoulder portion.

19 . The chamber of claim 18 , wherein each of the plurality of alignment pads comprises:
an angled surface between the shoulder portion and the protrusion, wherein the protrusion is frustoconical; a pin portion inserted into a pad opening formed in the platen; and a shoulder portion fits into a recessed flange of the platen, wherein a height of the shoulder portion is greater than a depth of the recessed flange to provide a gap between the platen and a substrate receiving surface of the carrier.

20 . The chamber of claim 19 , wherein each of the stacked holders includes a standoff, the standoff includes a curved inner portion, and the carrier comprises:
a circular body comprising a concave groove formed in the circular body opposite to the substrate receiving surface; peripheral edges adjacent to the concave groove and configured to contact the shoulder portions of the alignment pads; a beveled edge connecting one of the peripheral edges with an outer wall, the beveled edge configured to contact the angled surfaces of the alignment pads.

Assignees

• Applied Materials Inc

Inventors

• Ishii Masato
• Collins Richard O
• Giljum Richard
• Berger Alexander

Classifications

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3308

  Vertical transfer of a single workpiece · CPC title