Multi-layer epi chamber body

Patent metadata

Field	Value
Publication number	US-2025101629-A1
Application number	US-202418976591-A
Country	US
Kind code	A1
Filing date	Dec 11, 2024
Priority date	Dec 22, 2020
Publication date	Mar 27, 2025
Grant date	—

Abstract

An apparatus as disclosed herein relates to a chamber body design for use within a thermal deposition chamber, such as an epitaxial deposition chamber. The chamber body is a segmented chamber body design and includes an inject ring and a base plate. The base plate includes a substrate transfer passage and one or more exhaust passages disposed therethrough. The inject ring includes a plurality of gas inject passages disposed therethrough. The inject ring is disposed on top of the base plate and attached to the base plate. The one or more exhaust passages and the gas inject passages are disposed opposite one another. One or more seal grooves are formed in both the base plate and the inject ring to enable the inject ring and the base plate to seal to one another as well as other components within the process chamber.

First claim

What is claimed is:

1 . An inject ring for substrate processing comprising:
a ring body comprising:
an upper surface;
a lower surface;
an inner surface disposed from the upper surface to the lower surface and forming an annular opening;
an outer surface disposed from the upper surface to the lower surface and radially outward from the inner surface;
a plurality of gas inject passages formed between the inner surface and the outer surface along a first side;
one or more upper coupling seal grooves disposed along the upper surface and surrounding the inner surface; and
one or more purge gas passages disposed between the inner surface and the outer surface.

2 . The inject ring of claim 1 , further comprising:
one or more cooling channels disposed through the ring body.

3 . The inject ring of claim 1 , further comprising:
a plurality of gas line connections disposed along the outer surface and coupled to the plurality of gas inject passages.

4 . The inject ring of claim 1 , wherein the upper coupling seal grooves further comprise:
a first upper coupling seal groove; and a second upper coupling seal groove.

5 . The inject ring of claim 4 , further comprising one or more upper window seal passages connecting the outer surface and the upper surface wherein an outlet of the upper window seal passages is between the first upper coupling seal groove and the second upper coupling seal groove.

6 . The inject ring of claim 1 , further comprising:
one or more cross-flow ports disposed between the outer surface and the inner surface and at an angle to the plurality of gas inject passages.

7 . A base plate for substrate processing comprising:
a base body comprising:
an upper surface;
a lower surface;
an inner surface disposed from the upper surface to the lower surface and forming an annular opening;
an outer surface disposed from the upper surface to the lower surface and radially outward from the inner surface;
a substrate transfer passage formed between the inner surface and the outer surface along a first side;
one or more exhaust passages formed between the inner surface and the outer surface opposite the substrate transfer passage along a second side;
one or more intermediate coupling seal grooves disposed along the upper surface and surrounding the inner surface;
one or more lower coupling seal grooves disposed along the lower surface and surrounding the inner surface; and
one or more purge gas passages disposed between the inner surface and the outer surface.

8 . The base plate of claim 7 , further comprising:
a flange disposed along the outer surface on the first side, wherein the substrate transfer passage is disposed through the flange and the flange includes a chamber coupling surface; and one or more cooling channels disposed through the base body.

9 . The base plate of claim 7 , wherein the one or more intermediate coupling seal grooves further comprise:
a first intermediate coupling seal groove; and a second intermediate coupling seal groove.

10 . The base plate of claim 7 , further comprising:
one or more upper chamber body seal passages connecting the outer surface and the upper surface; and one or more window seal passages connecting the outer surface and the lower surface.

11 . The base plate of claim 7 , further comprising:
one or more exhaust coupling seal grooves disposed around the one or more exhaust passages on the outer surface.

12 . The base plate of claim 11 , further comprising:
a chamber coupling purge passage connecting the outer surface and a chamber coupling surface; and an exhaust seal passage connecting the upper surface and the outer surface.

13 . The base plate of claim 7 , wherein the lower surface is a stepped surface and comprises:
a step; the one or more lower coupling seal grooves disposed therein; and a rim pressure passage having an outlet disposed in the step and connecting the outer surface and the lower surface.

14 . A chamber body assembly for substrate processing comprising:
a base plate comprising:
a first upper surface;
a first lower surface;
a first inner surface forming an annular opening;
a first outer surface disposed radially outward from the first inner surface;
a substrate transfer passage formed between the first inner surface and the first outer surface along a first side;
one or more exhaust passages formed between the first inner surface and the first outer surface opposite the substrate transfer passage along a second side; and
the inject ring of claim 1 .

15 . The chamber body assembly of claim 14 , further comprising one or more intermediate coupling seal grooves disposed along the first upper surface and surrounding the first inner surface, wherein the one or more intermediate coupling seal grooves comprises:
a first intermediate coupling seal groove; and a second intermediate coupling seal groove.

16 . The chamber body assembly of claim 15 , further comprising one or more lower coupling seal grooves disposed along the first lower surface and surrounding the first inner surface and one or more upper coupling seal grooves disposed along the upper surface and surrounding the first inner surface, wherein the one or more lower coupling seal grooves and the one or more upper coupling seal grooves each further comprise:
a first seal groove; and a second seal groove.

17 . The chamber body assembly of claim 14 , further comprising:
a first plurality of fastener openings disposed around the first inner surface and through the first upper surface; and a second plurality of fastener openings disposed around the inner surface, from the upper surface to the lower surface, and aligned with the first plurality of fastener openings.

18 . The chamber body assembly of claim 16 , wherein the base plate further comprises:
one or more upper chamber body seal passages connecting the first outer surface and the one or more intermediate coupling seal grooves.

19 . The chamber body assembly of claim 14 , wherein the plurality of gas inject passages further comprise:
a plurality of inject passage outlets vertically offset from the one or more exhaust passages.

20 . The chamber body assembly of claim 14 , further comprising:
a flange disposed along the first outer surface on the first side, wherein the substrate transfer passage is disposed through the flange, and wherein the first inner surface and the inner surface have a same inner radius.

Assignees

• Applied Materials Inc

Inventors

• Lau Shu-Kwan
• Ye Zhiyuan
• Collins Richard O
• Burrows Brian Hayes

Classifications

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/0434

  mainly by convection · CPC title