Substrate transfer mechanism to reduce back-side substrate contact

Patent metadata

Field	Value
Publication number	US-2022351999-A1
Application number	US-202217866152-A
Country	US
Kind code	A1
Filing date	Jul 15, 2022
Priority date	Feb 12, 2018
Publication date	Nov 3, 2022
Grant date	—

Abstract

A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.

First claim

1 . A chamber, comprising:
a platen having a heat transfer element embedded therein; a plurality of carrier holders positioned about the platen; a plurality of support members extending from the plurality of carrier holders; and a carrier positioned on the support members of one of the plurality of carrier holders.

2 . The chamber of claim 1 , wherein each of the carrier holders includes a plurality of support members extending therefrom to support the carrier.

3 . The chamber of claim 1 , further comprising a plurality of lift pins movably disposed through the platen.

4 . The chamber of claim 3 , wherein each of the plurality of lift pins comprises a tip and a shaft, and the tip is made of a material that is softer than the material of the shaft.

5 . The chamber of claim 4 , wherein the material of the tip is a polymer material and the material of the shaft is a metallic material.

6 . The chamber of claim 5 , wherein a protruded portion of the tip is fitted into a depression formed in the shaft using an interference fit.

7 . The chamber of claim 3 , wherein each of the plurality of lift pins is operably coupled to a dedicated actuator.

8 . The chamber of claim 3 , wherein the plurality of lift pins are disposed in openings formed in the platen, and each of the openings is fluidly coupled to a vacuum system.

9 . The chamber of claim 3 , wherein the plurality of lift pins are disposed inwardly of the carrier and the plurality of carrier holders.

10 . The chamber of claim 1 , wherein each of the plurality of carrier holders comprises a standoff and a curved lip.

11 . The chamber of claim 1 , wherein each of the plurality of carrier holders is mounted to a support that is coupled to a shaft extending through a bottom of the chamber.

12 . A lift pin assembly, comprising:
a support plate; a base housing coupled to the support plate; a shaft made of a first material and comprising a depression formed in the shaft, the shaft at least partially disposed in the base housing; a tip made of a second material and comprising a protruded portion fitted into the depression using an interference fit, wherein the second material is softer than the first material.

13 . The lift pin assembly of claim 12 , wherein the first material is a metallic material and the second material is polymer material.

14 . The lift pin assembly of claim 12 , further comprising a bellows disposed about at least part of the shaft.

15 . The lift pin assembly of claim 12 , further comprising:
a gripping member disposed in the base housing, wherein an end of the shaft is coupled to the gripping member; and a retainer housing disposed in the base housing and coupled to the support plate, wherein a lip of the gripping member is received in the retainer housing.

16 . A method of transferring a substrate to a chamber, comprising:
positioning the substrate above a carrier positioned on one of a plurality of carrier holders positioned about a platen; positioning the substrate on a plurality of lift pins; and positioning the substrate on the carrier.

17 . The method of claim 16 , wherein the positioning of the substrate above the carrier comprises extending a first robot blade into the chamber.

18 . The method of claim 17 , wherein the positioning of the substrate on the plurality of lift pins comprises lowering the first robot blade to contact the substrate with the plurality of lift pins.

19 . The method of claim 18 , wherein the positioning of the substrate on the carrier comprises:
raising the plurality of carrier holders to contact the substrate with the carrier.

20 . The method of claim 19 , further comprising:
retracting the plurality of lift pins away from the substrate; extending a second robot blade into the chamber; and lowering the plurality of carrier holders to contact the carrier with the second robot blade and position the carrier and the substrate on the second robot blade.

Assignees

• Applied Materials Inc

Inventors

• Ishii Masato
• Collins Richard O
• Giljum Richard
• Berger Alexander

Classifications

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3308

  Vertical transfer of a single workpiece · CPC title