Field effect transistor with strained channels and method
US-2025359162-A1 · Nov 20, 2025 · US
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Chen Ming-Te patents
Chen Ming-Te is listed as an inventor on 58 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Ming-Te |
| Total patents | 58 |
| First publication | Jan 15, 2015 |
| Latest publication | Nov 20, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Gate stack treatment
US-2025241055-A1 · Jul 24, 2025 · US
Gate stack treatment
US-12300549-B2 · May 13, 2025 · US
Semiconductor structure and manufacturing method of the same
US-2025072028-A1 · Feb 27, 2025 · US
Semiconductor structure and manufacturing method of the same
US-12170327-B2 · Dec 17, 2024 · US
Method of manufacturing semiconductor devices and semiconductor devices
US-2024387734-A1 · Nov 21, 2024 · US
Semiconductor structure and manufacturing method of the same
US-2024379825-A1 · Nov 14, 2024 · US
Method of manufacturing semiconductor devices and semiconductor devices
US-12142682-B2 · Nov 12, 2024 · US
Field effect transistor with strained channels and method
US-2024234530-A1 · Jul 11, 2024 · US
Method of manufacturing semiconductor devices and semiconductor devices
US-11978675-B2 · May 7, 2024 · US
Recent patents
Latest publications not already listed above.
Method of manufacturing semiconductor devices and semiconductor devices
US-2023377994-A1 · Nov 23, 2023 · US
Gate stack treatment
US-2023268231-A1 · Aug 24, 2023 · US
Gate stack treatment
US-11670553-B2 · Jun 6, 2023 · US
Semiconductor structure and manufacturing method of the same
US-2022320319-A1 · Oct 6, 2022 · US
FinFET gate structure
US-11329160-B2 · May 10, 2022 · US
Method of manufacturing semiconductor devices and semiconductor devices
US-2022084890-A1 · Mar 17, 2022 · US
Method of manufacturing semiconductor devices and semiconductor devices
US-2022059684-A1 · Feb 24, 2022 · US
Method of manufacturing a semiconductor device and a semiconductor device
US-11232953-B2 · Jan 25, 2022 · US
Gate stack treatment
US-2021366778-A1 · Nov 25, 2021 · US
Method of manufacturing semiconductor devices and semiconductor devices
US-11183431-B2 · Nov 23, 2021 · US
Gate stack treatment
US-11088029-B2 · Aug 10, 2021 · US
Method of manufacturing semiconductor devices using a capping layer in forming gate electrode and semiconductor devices
US-11081584-B2 · Aug 3, 2021 · US
Method of manufacturing a semiconductor device and a semiconductor device
US-2021082707-A1 · Mar 18, 2021 · US
Method of manufacturing semiconductor devices and semiconductor devices
US-2021074593-A1 · Mar 11, 2021 · US
Atomic layer deposition method
US-10858736-B2 · Dec 8, 2020 · US
Method of manufacturing semiconductor devices and semiconductor devices
US-2020135915-A1 · Apr 30, 2020 · US
Contact resistance reduction technique
US-10340269-B2 · Jul 2, 2019 · US
Multi-platen ion implanter and method for implanting multiple substrates simultaneously
US-10121637-B2 · Nov 6, 2018 · US
High-throughput system and method for post-implantation single wafer warm-up
US-9982338-B2 · May 29, 2018 · US
Wafer cleaning
US-9781994-B2 · Oct 10, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 46 |
| Taiwan Semiconductor Mfg | 12 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D30/024 | 30 |
| H10D84/038 | 26 |
| H10D30/62 | 24 |
| H10P95/90 | 23 |
| H10D84/0158 | 21 |