Power electronic assembly having a laminate inlay and method of producing the power electronic assembly
US-11903132-B2 · Feb 13, 2024 · US
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Chen Liu patents
Chen Liu is listed as an inventor on 22 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Liu |
| Total patents | 22 |
| First publication | Mar 5, 2015 |
| Latest publication | Feb 13, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Power electronic assembly having a laminate inlay and method of producing the power electronic assembly
US-2023240012-A1 · Jul 27, 2023 · US
Power electronic assembly and method of producing thereof
US-11632860-B2 · Apr 18, 2023 · US
Topside-cooled semiconductor package with molded standoff
US-11239127-B2 · Feb 1, 2022 · US
Topside-cooled semiconductor package with molded standoff
US-2021398867-A1 · Dec 23, 2021 · US
Power transistor device including first and second transistor cells having different on-resistances for improved thermal stability
US-11127853-B2 · Sep 21, 2021 · US
Power Electronic Assembly and Method of Producing Thereof
US-2021127490-A1 · Apr 29, 2021 · US
Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package
US-10727151-B2 · Jul 28, 2020 · US
Transistor Device
US-2019386133-A1 · Dec 19, 2019 · US
Transistor package with three-terminal clip
US-10290567-B2 · May 14, 2019 · US
Recent patents
Latest publications not already listed above.
Transistor package with three-terminal clip
US-2019074243-A1 · Mar 7, 2019 · US
Multi-functional interconnect module and carrier with multi-functional interconnect module attached thereto
US-10168391-B2 · Jan 1, 2019 · US
Semiconductor Chip Package Having a Cooling Surface and Method of Manufacturing a Semiconductor Package
US-2018342438-A1 · Nov 29, 2018 · US
Module with integrated power electronic circuitry and logic circuitry
US-9681558-B2 · Jun 13, 2017 · US
Power package with integrated magnetic field sensor
US-9564423-B2 · Feb 7, 2017 · US
Semiconductor package with integrated magnetic field sensor
US-9564578-B2 · Feb 7, 2017 · US
Semiconductor Package with Integrated Magnetic Field Sensor
US-2016380181-A1 · Dec 29, 2016 · US
Power package with integrated magnetic field sensor
US-2016379966-A1 · Dec 29, 2016 · US
Multi-Functional Interconnect Module and Carrier with Multi-Functional Interconnect Module Attached Thereto
US-2016377689-A1 · Dec 29, 2016 · US
Overmolded substrate-chip arrangement with heat sink
US-9385059-B2 · Jul 5, 2016 · US
Module with Integrated Power Electronic Circuitry and Logic Circuitry
US-2016050768-A1 · Feb 18, 2016 · US
Overmolded substrate-chip arrangement with heat sink
US-2015062825-A1 · Mar 5, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 22 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/766 | 12 |
| H10W72/926 | 10 |
| H10W90/756 | 10 |
| H10W70/466 | 10 |
| H10W70/481 | 10 |