Overmolded substrate-chip arrangement with heat sink

Patent metadata

Field	Value
Publication number	US-9385059-B2
Application number	US-201314011772-A
Country	US
Kind code	B2
Filing date	Aug 28, 2013
Priority date	Aug 28, 2013
Publication date	Jul 5, 2016
Grant date	Jul 5, 2016

Abstract

An electronic device comprises a substrate, at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system, a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device, and an overmolding structure configured for at least partially encapsulating at least the at least one electronic chip and the substrate.

First claim

What is claimed is:

1. An electronic device, comprising:
a substrate;
at least one electronic chip mounted on and electrically connected to the substrate and being configured as a system control unit for controlling a connected system;
a heat removal structure thermally connected to the at least one electronic chip and configured for removing heat generated by the at least one electronic chip upon operation of the electronic device; and
an overmolding structure configured for at least partially encapsulating the at least one electronic chip and the substrate;
wherein the heat removal structure is configured as a thermally conductive grid having recesses being at least partially filled with material of the overmolding structure.

2. The device according to claim 1 , wherein the substrate has a first main surface and a second main surface opposing the first main surface, wherein the at least one electronic chip is mounted on the first surface and the heat removal structure is mounted on the second surface.

3. The device according to claim 1 , wherein the at least one electronic chip has a first main surface and a second main surface opposing the first main surface, wherein the at least one electronic chip is mounted with its first surface on the substrate and is mounted with its second surface on the heat removal structure.

4. The device according to claim 1 , wherein the at least one electronic chip has a first main surface and a second main surface opposing the first main surface, wherein the at least one electronic chip is mounted with its first surface on the substrate, and the heat removal structure is mounted with a varying height on the second main surface of the at least one electronic chip.

5. The device according to claim 1 , comprising an electric connector electrically coupled with the substrate, being partially covered by the overmolding structure but extending beyond the overmolding structure, and being configured for electrically connecting the device to a connection apparatus.

6. The device according to claim 5 , wherein the electric connector comprises at least one of the group consisting of a cable, and a plug connector.

7. The device according to claim 1 , comprising an electric connector electrically coupled with the substrate and being fully covered by the overmolding structure, wherein the device comprises one or more wired interconnects extending from the electric connector beyond the overmolding structure and being configured for electrically connecting the device to a connection apparatus.

8. The device according to claim 1 , wherein the overmolding structure and the heat removal structure are configured for completely encapsulating at least the at least one electronic chip and the substrate so that both the at least one electronic chip and the substrate are circumferentially surrounded completely by the overmolding structure and the heat removal structure.

9. The device according to claim 1 , comprising an electrical coupling structure configured for electrically coupling the substrate with the heat removal structure.

10. The device according to claim 1 , wherein an external surface of the heat removal structure remains at least partially uncovered from the overmolding structure.

11. The device according to claim 1 , wherein the overmolding structure and the heat removal structure form at least part of an exterior surface of the device.

12. The device according to claim 1 , wherein the system control unit is configured for automotive applications, in particular for engine control.

13. The device according to claim 1 , wherein the heat removal structure has a mechanical fastening provision configured for mechanically fastening the device to a mounting base of the connected system.

14. The device according to claim 1 , wherein the system control unit is formed by a plurality of electronic chips having different height and being mounted on and electrically connected to the substrate, wherein at least one of the heat removal structure and the substrate has a mounting surface facing the plurality of electronic chips and having a height profile compensating for the different height of the plurality of electronic chips.

15. The device according to claim 1 , wherein the heat removal structure is configured as a thermally conductive grid having recesses being at least partially filled with material of the overmolding structure.

16. The device according claim 1 , wherein the heat removal structure is at least partially made of an elastically deformable or a plastically deformable material so that a height profile of the heat removal structure is adaptable during assembly of the device to compensate for level deviations.

17. The device according to claim 1 , wherein the heat removal structure is ductile or flexible to compensate for different height caused by manufacturing tolerances and height dimensions of different electronic chips.

18. The device according to claim 1 , wherein the heat removal structure comprises a rigid member and comprises an elastically or plastically deformable member connected to the rigid member.

19. An engine control module, comprising:
at least one semiconductor chip with a first main surface and a second main surface opposing the first main surface, wherein the at least one semiconductor chip is configured for performing an engine control function;
a printed circuit board to which the first surface of the at least one semiconductor chip is mounted and electrically connected;
a heat removal structure to which the second surface of the at least one semiconductor chip is mounted and thermally connected to the second surface of the at least one semiconductor chip, wherein the heat removal structure is configured for removing heat generated by the at least one semiconductor chip upon operation of the engine control module; and
an overmolding structure configured for at least partially encapsulating at least the at least one semiconductor chip and the printed circuit board;
wherein the heat removal structure is configured as a thermally conductive grid having recesses being at least partially filled with material of the overmolding structure.

Assignees

• Infineon Technologies Ag

Inventors

• Ossimitz Peter
• Schaefer Juergen
• Chen Liu
• Dinkel Markus
• Macheiner Stefan

Classifications

• H05K3/32

  electrically connecting electric components or wires to printed circuits · CPC title

• H05K5/0034

  having an overmolded housing covering the PCB · CPC title

• H05K7/20854

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20863 takes precedence) · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K2201/10166

  Transistor · CPC title