Multi-Functional Interconnect Module and Carrier with Multi-Functional Interconnect Module Attached Thereto

Patent metadata

Field	Value
Publication number	US-2016377689-A1
Application number	US-201615049923-A
Country	US
Kind code	A1
Filing date	Feb 22, 2016
Priority date	Jun 23, 2015
Publication date	Dec 29, 2016
Grant date	—

Abstract

An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.

First claim

What is claimed is:

1 . An interconnect module, comprising:
a metal clip comprising a first end section, a second end section and a middle section extending between the first and the second end sections, the first end section being configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier, the second end section being configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier; and a magnetic field sensor secured to the metal clip, the magnetic field sensor operable to sense a magnetic field produced by current flowing through the metal clip.

2 . The interconnect module of claim 1 , wherein the magnetic field sensor is galvanically isolated from the metal clip.

3 . The interconnect module of claim 1 , wherein the metal clip is embedded in an encapsulant, and wherein electrical contact pads disposed at a side of the magnetic field sensor facing away from the metal clip have an exposed surface that is uncovered by the encapsulant.

4 . The interconnect module of claim 3 , wherein a surface of the middle section of the metal clip facing away from the magnetic field sensor is covered by the encapsulant, and wherein the first end section and the second end section each have an exposed surface facing away from the magnetic field sensor that is uncovered by the encapsulant.

5 . The interconnect module of claim 3 , wherein the encapsulant is an adhesive, mold compound or a laminate.

6 . The interconnect module of claim 1 , further comprising:
a metal redistribution layer embedded in the encapsulant and separated from the metal clip.

7 . The interconnect module of claim 1 , wherein the middle section of the metal clip comprises a first leg and a second leg spaced apart from the first leg, and wherein the magnetic field sensor comprises a first magnetic field sensing component adjacent the first leg and positioned so that a magnetic field produced by current flowing in the first leg impinges on the first magnetic field sensing component in a first direction and a second magnetic field sensing component adjacent the second leg and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.

8 . The interconnect module of claim 7 , wherein the magnetic field sensor is operable to produce an electrical signal which is proportional to the magnetic field, and wherein the electrical signal comprises a first signal component output by the first magnetic field sensing component and a second signal component output by the first magnetic field sensing component.

9 . The interconnect module of claim 1 , further comprising:
a logic device secured to the metal clip and operable to control the magnetic field sensor.

10 . The interconnect module of claim 1 , wherein the magnetic field sensor is secured to the metal clip by a spacer.

11 . The interconnect module of claim 10 , wherein the spacer is selected from the group consisting of: a polymer; a ceramic; silicon; glass; a non-conductive film; and a film.

12 . The interconnect module of claim 10 , wherein the spacer has a thickness such that the strength of the magnetic field which enters the magnetic field sensor is reduced to a non-destructive level.

13 . A carrier assembly, comprising:
a carrier comprising a plurality of metal regions embedded in or attached to an electrically insulating material; a first bare semiconductor die or packaged semiconductor die attached to a first one of the metal regions of the carrier; and a first interconnect module, comprising:
a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections, the first end section being attached to the first metal region of the carrier or to the first bare semiconductor die or packaged semiconductor die, the second end section being attached to a second metal region of the carrier or to a second bare semiconductor die or packaged semiconductor die attached to the carrier; and
a magnetic field sensor secured to the metal clip, the magnetic field sensor operable to sense a magnetic field produced by current flowing through the metal clip.

14 . The carrier assembly of claim 13 , wherein the magnetic field sensor is galvanically isolated from the metal clip.

15 . The carrier assembly of claim 13 , wherein the first interconnect module further comprises an encapsulant in which the metal clip is embedded, and wherein electrical contact pads disposed at a side of the magnetic field sensor facing away from the metal clip have a surface that is uncovered by the encapsulant.

16 . The carrier assembly of claim 15 , wherein a surface of the middle section of the metal clip facing away from the magnetic field sensor is covered by the encapsulant, wherein the first end section of the metal clip has a surface that is uncovered by the encapsulant and attached to the first metal region of the carrier or to the first bare semiconductor die or packaged semiconductor die, and wherein the second end section of the metal clip has a surface that is uncovered by the encapsulant and attached to the second metal region of the carrier or to the second bare semiconductor die or packaged semiconductor die.

17 . The carrier assembly of claim 15 , wherein the first interconnect module further comprises a metal redistribution layer embedded in the encapsulant and separated from the metal clip, and wherein the carrier assembly further comprises:
a plurality of electrical conductors connecting different ones of the metal regions of the carrier to the metal redistribution layer of the first interconnect module.

18 . The carrier assembly of claim 13 , wherein the middle section of the metal clip of the first interconnect module comprises a first leg and a second leg spaced apart from the first leg, and wherein the magnetic field sensor of the first interconnect module comprises a first magnetic field sensing component adjacent the first leg and positioned so that a magnetic field produced by current flowing in the first leg impinges on the first magnetic field sensing component in a first direction and a second magnetic field sensing component adjacent the second leg and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.

19 . The carrier assembly of claim 18 , wherein the first bare semiconductor die or packaged semiconductor die is a lateral transistor device with all power terminals at a side facing the first interconnect module, wherein the first leg of the first interconnect module provides a direct electrical connection between a first one of the power terminals and the second metal region of the carrier, and wherein the second leg of the first interconnect module provides a direct electrical connection between a second one of the power terminals and a third one of the metal regions of the carrier.

20 . The carrier assembly of claim 18 , wherein the first bare semiconductor die or packaged semiconductor die is a vertical transistor device with a first power terminal attached to the first metal region of the carrier and a second power terminal at a side facing the first interconnect module, wherein the first leg of the first interconnect module provides a di

Assignees

• Infineon Technologies Ag

Inventors

• Babulano Giuliano Angelo
• Oetjen Jens
• Chen Liu
• Salminen Toni
• Mieslinger Stefan
• Dinkel Markus
• Gruber Martin
• Jost Franz
• Meyer Thorsten
• Schaller Rainer

Classifications

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07552

  changes in structures or sizes · CPC title

• H10W72/652

  comprising metals or metalloids, e.g. silver · CPC title

• H10W72/527

  Multiple bond wires having different sizes · CPC title