Semiconductor package with integrated magnetic field sensor

Patent metadata

Field	Value
Publication number	US-9564578-B2
Application number	US-201514947649-A
Country	US
Kind code	B2
Filing date	Nov 20, 2015
Priority date	Jun 23, 2015
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.

First claim

What is claimed is:

1. A semiconductor package, comprising:
a semiconductor die attached to a substrate; and
a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway, the magnetic field sensor comprising:
a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction; and
a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.

2. The semiconductor package of claim 1 , wherein the magnetic field sensor is operable to produce an electrical signal which is proportional to the magnetic field, and wherein the electrical signal comprises a first signal component output by the first magnetic field sensing component and a second signal component output by the first magnetic field sensing component.

3. The semiconductor package of claim 1 , wherein each magnetic field sensing component of the magnetic field sensor is a magnetoresistive magnetic field sensing component or a Hall magnetic field sensing component.

4. The semiconductor package of claim 1 , wherein the first and the second magnetic field sensing components are positioned so that the magnetic field impinges on the first magnetic field sensing component in the opposite direction as the second magnetic field sensing component.

5. The semiconductor package of claim 1 , wherein the first and the second magnetic field sensing components are integrated in the same sensor die.

6. The semiconductor package of claim 1 , wherein the first and the second magnetic field sensing components are fixed in the same plane.

7. The semiconductor package of claim 1 , wherein at least one of the first and the second magnetic field sensing components is a three-dimensional magnetic field sensing component operable to produce an electrical signal which is proportional to the distance between the current pathway and the three-dimensional magnetic field sensing component.

8. The semiconductor package of claim 1 , further comprising:
a lead or metal clip electrically connected to a terminal of the semiconductor die,
wherein current flowing in the current pathway traverses along the lead/metal clip,
wherein the first magnetic field sensing component is adjacent a first side of the lead/metal clip and the second magnetic field sensing component is adjacent a second side of the lead/metal clip opposite the first side.

9. The semiconductor package of claim 1 , further comprising:
a lead or metal clip electrically connected to a terminal of the semiconductor die,
wherein the lead/metal clip comprises a first section and a second section which are spaced apart from each other and extend in parallel with one another as part of the current pathway,
wherein current flowing in the current pathway traverses a different direction along the first section of the lead/metal clip than along the second section of the lead/metal clip,
wherein the first magnetic field sensing component is adjacent the first section and the second magnetic field sensing component is adjacent the second section.

10. The semiconductor package of claim 9 , wherein the first section of the lead/metal clip extends beyond a footprint of the semiconductor die, wherein the first magnetic field sensing component is adjacent the first section outside the footprint of the semiconductor die, and wherein the second magnetic field sensing component is adjacent the second section inside the footprint of the semiconductor die.

11. The semiconductor package of claim 9 , wherein the first section of the lead/metal clip extends beyond a footprint of the semiconductor die, wherein the second section of the lead/metal clip extends beyond the footprint of the semiconductor die, wherein the first magnetic field sensing component is adjacent the first section outside the footprint of the semiconductor die, and wherein the second magnetic field sensing component is adjacent the second section outside the footprint of the semiconductor die.

12. The semiconductor package of claim 1 , further comprising:
a first lead or metal clip electrically connected to a first terminal of the semiconductor die; and
a second lead or metal clip electrically connected to a second terminal of the semiconductor die,
wherein current flowing in the current pathway traverses a different direction along the first lead/metal clip than along the second lead/metal clip,
wherein the first magnetic field sensing component is adjacent the first lead/metal clip and the second magnetic field sensing component is adjacent the second lead/metal clip.

13. The semiconductor package of claim 1 , further comprising:
a first lead electrically connected to a first terminal of the semiconductor die;
a second lead electrically connected to a second terminal of the semiconductor die; and
an encapsulant encasing the semiconductor die,
wherein the first and the second leads protrude from the encapsulant,
wherein the first and the second magnetic field sensing components are integrated in the same sensor die,
wherein the sensor die is attached to a same side of the first and the second leads outside the encapsulant,
wherein current flowing in the current pathway traverses a different direction along the first lead than along the second lead,
wherein the first magnetic field sensing component extends along the first lead and the second magnetic field sensing component extends along the second lead.

14. The semiconductor package of claim 13 , further comprising:
an additional substrate attached to the first and the second leads outside the encapsulant,
wherein the additional substrate is attached to the opposite side of the first and the second leads as the sensor die outside the encapsulant,
wherein terminals of the sensor die are electrically connected to leads of the additional substrate.

15. The semiconductor package of claim 1 , further comprising:
a first lead electrically connected to a first terminal of the semiconductor die;
a second lead electrically connected to a second terminal of the semiconductor die; and
an encapsulant encasing the semiconductor die,
wherein the first and the second leads protrude from the encapsulant at opposite sides of the semiconductor package,
wherein current flowing in the current pathway traverses a different direction along the first lead than along the second lead,
wherein the first and the second magnetic field sensing components are disposed in separate sensor dies,
wherein the sensor die with the first magnetic field sensing component is adjacent the first lead,
wherein the sensor die with the second magnetic field sensing component is adjacent the second lead.

16. The semiconductor package of claim 15 , further comprising:
an additional substrate encased by the encapsulant,
wherein terminals of the separate sensor dies are electrically connected to leads of the additional substrate.

17. A method of sensing current in a semiconductor package which includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semico

Assignees

• Infineon Technologies Ag

Inventors

• Meyer Thorsten
• Gruber Martin
• Schaller Rainer Markus
• Jost Franz
• Mieslinger Stefan
• Chen Liu
• Salminen Toni
• Babulano Giuliano Angelo
• Oetjen Jens
• Dinkel Markus

Classifications

• H10W72/07651

  characterised by changes in properties of the strap connectors during connecting · CPC title

• H10W72/60

  Strap connectors, e.g. thick copper clips for grounding of power devices · CPC title

• H10W90/766

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/07552

  changes in structures or sizes · CPC title