Metal lines of hybrid heights
US-12575397-B2 · Mar 10, 2026 · US
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Chen Hsin-Ping patents
Chen Hsin-Ping is listed as an inventor on 101 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Hsin-Ping |
| Total patents | 101 |
| First publication | Apr 13, 2017 |
| Latest publication | Mar 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and manufacturing method thereof
US-2026052963-A1 · Feb 19, 2026 · US
Semiconductor device with self-aligned contact via and method for manufacturing the same
US-2026047413-A1 · Feb 12, 2026 · US
Semiconductor devices and methods of forming the same
US-12543556-B2 · Feb 3, 2026 · US
Integrated chip structure with high thermal conductivity layer
US-2025343148-A1 · Nov 6, 2025 · US
Metal lines of hybrid heights
US-2025336807-A1 · Oct 30, 2025 · US
Semiconductor structure and method for forming the same
US-2025309041-A1 · Oct 2, 2025 · US
Semiconductor structure with improved heat dissipation
US-12412804-B2 · Sep 9, 2025 · US
Semiconductor device structure and manufacturing method thereof
US-2025239449-A1 · Jul 24, 2025 · US
Interconnection structure having air gap
US-2025174492-A1 · May 29, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor structure and manufacturing method thereof
US-2025140683-A1 · May 1, 2025 · US
Integrated chip structure with high thermal conductivity layer
US-2025140697-A1 · May 1, 2025 · US
Semiconductor device and manufacturing method thereof
US-2025125251-A1 · Apr 17, 2025 · US
Interconnect structure with reinforcing spacer and method for manufacturing the same
US-2025125189-A1 · Apr 17, 2025 · US
Interconnection structure and manufacturing method thereof
US-2025118598-A1 · Apr 10, 2025 · US
Semiconductor structure and manufacturing method thereof
US-2025118594-A1 · Apr 10, 2025 · US
Integrated circuit device and method for fabricating the same
US-2025112087-A1 · Apr 3, 2025 · US
Semiconductor structure
US-2025112088-A1 · Apr 3, 2025 · US
Hybrid metal line structure
US-2025079298-A1 · Mar 6, 2025 · US
Semiconductor device and method of manufacture
US-12230534-B2 · Feb 18, 2025 · US
Semiconductor structure including lines of different height
US-2025054811-A1 · Feb 13, 2025 · US
Hybrid metal line structure
US-12183671-B2 · Dec 31, 2024 · US
Interconnect layer and method for manufacturing the same
US-2024420994-A1 · Dec 19, 2024 · US
Semiconductor structure having deep metal line and method for forming the semiconductor structure
US-2024379537-A1 · Nov 14, 2024 · US
Fully Self-Aligned Interconnect Structure
US-2024379434-A1 · Nov 14, 2024 · US
Fully self-aligned interconnect structure
US-12136567-B2 · Nov 5, 2024 · US
Integrated circuit interconnect structures with air gaps
US-2024339406-A1 · Oct 10, 2024 · US
Semiconductor structure having deep metal line and method for forming the semiconductor structure
US-12094816-B2 · Sep 17, 2024 · US
Gate all around device
US-12094946-B2 · Sep 17, 2024 · US
Semiconductor device with spacers for self aligned vias
US-2024297077-A1 · Sep 5, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 102 |
| Taiwan Semicondctor Mfg Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01L23/5226 | 59 |
| H10W20/42 | 58 |
| H10W20/056 | 51 |
| H10W20/435 | 51 |
| H10W20/063 | 46 |