Semiconductor device package, electronic assembly and method for manufacturing the same
US-12451415-B2 · Oct 21, 2025 · US
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Chen Chun Chen patents
Chen Chun Chen is listed as an inventor on 35 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Chun Chen |
| Total patents | 35 |
| First publication | Feb 22, 2018 |
| Latest publication | Oct 21, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor packages and methods of manufacturing the same
US-12412845-B2 · Sep 9, 2025 · US
Semiconductor device package and method of manufacturing the same
US-2025183517-A1 · Jun 5, 2025 · US
Semiconductor device package and method of manufacturing the same
US-12308306-B2 · May 20, 2025 · US
Semiconductor device package and method of manufacturing the same
US-12224481-B2 · Feb 11, 2025 · US
Semiconductor device package and method for manufacturing the same
US-2024421103-A1 · Dec 19, 2024 · US
Semiconductor device package and method for manufacturing the same
US-12074118-B2 · Aug 27, 2024 · US
Semiconductor device package, electronic assembly and method for manufacturing the same
US-2024088001-A1 · Mar 14, 2024 · US
Semiconductor device package and method for manufacturing the same
US-2023326878-A1 · Oct 12, 2023 · US
Semiconductor device package and method of manufacturing the same
US-2023298985-A1 · Sep 21, 2023 · US
Recent patents
Latest publications not already listed above.
Semiconductor device package, electronic assembly and method for manufacturing the same
US-11764137-B2 · Sep 19, 2023 · US
Semiconductor device package and method of manufacturing the same
US-2023223676-A1 · Jul 13, 2023 · US
Semiconductor structure
US-11682660-B2 · Jun 20, 2023 · US
Semiconductor device package and method for manufacturing the same
US-11676912-B2 · Jun 13, 2023 · US
Semiconductor device package and method of manufacturing the same
US-11658102-B2 · May 23, 2023 · US
Semiconductor packages and methods of manufacturing the same
US-2023145588-A1 · May 11, 2023 · US
Semiconductor device package and method of manufacturing the same
US-11600901-B2 · Mar 7, 2023 · US
Semiconductor packages and methods of manufacturing the same
US-11552026-B2 · Jan 10, 2023 · US
Lead frame, package structure comprising the same and method for manufacturing the package structure
US-11462467-B2 · Oct 4, 2022 · US
Semiconductor package and method of manufacturing the same
US-11443997-B2 · Sep 13, 2022 · US
Semiconductor device package and method for manufacturing the same
US-2022199552-A1 · Jun 23, 2022 · US
Semiconductor structure and electronic device
US-2022122950-A1 · Apr 21, 2022 · US
Circuit and method for detecting control pilot abnormality of a DC charging pile
US-11254231-B2 · Feb 22, 2022 · US
Lead frame, package structure comprising the same and method for manufacturing the package structure
US-2022020680-A1 · Jan 20, 2022 · US
Semiconductor package and method of manufacturing the same
US-2022020654-A1 · Jan 20, 2022 · US
Semiconductor device package and method for manufacturing the same
US-11201386-B2 · Dec 14, 2021 · US
Circuit and Method for Detecting Control Pilot Abnormality of a DC Charging Pile
US-2021237607-A1 · Aug 5, 2021 · US
Semiconductor device package and method of manufacturing the same
US-2021225747-A1 · Jul 22, 2021 · US
Semiconductor device package and method for manufacturing the same
US-2021135333-A1 · May 6, 2021 · US
Semiconductor device package, electronic assembly and method for manufacturing the same
US-2021125909-A1 · Apr 29, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Advanced Semiconductor Eng | 32 |
| Phihong Tech Co Ltd | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 27 |
| H10W74/117 | 21 |
| H10W90/401 | 21 |
| H10W90/724 | 19 |
| H10W44/20 | 17 |