Lead frame, package structure comprising the same and method for manufacturing the package structure

Patent metadata

Field	Value
Publication number	US-11462467-B2
Application number	US-202016929018-A
Country	US
Kind code	B2
Filing date	Jul 14, 2020
Priority date	Jul 14, 2020
Publication date	Oct 4, 2022
Grant date	Oct 4, 2022

Abstract

A lead frame includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion and an outer lead portion connecting to the inner lead portion. The inner lead portion is adjacent to and spaced apart from the die paddle. A bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion. The bottom surface of the inner lead portion includes one or more supporting members disposed thereon. The one or more supporting members have a convex surface facing away from the inner lead portion.

First claim

What is claimed is:

1. A leadframe, comprising:
a die paddle; and
a plurality of leads surrounding the die paddle, each of the leads including an inner lead portion and an outer lead portion connecting to the inner lead portion,
wherein the inner lead portion is adjacent to and spaced apart from the die paddle, a bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion and the bottom surface of the inner lead portion comprises one or more supporting members disposed thereon, and
wherein the one or more supporting members have a convex surface facing away from the inner lead portion.

2. The leadframe of claim 1 , wherein the inner lead portion and the outer lead portion are formed integrally as a monolithic structure.

3. The leadframe of claim 1 , wherein an interface is formed between the supporting member and the inner lead portion.

4. The leadframe of claim 1 , wherein a top of the convex surface of the supporting member is substantially coplanar with the bottom surface of the outer lead portion.

5. The leadframe of claim 1 , wherein the supporting member is disposed close to a distal end of the inner lead portion.

6. The leadframe of claim 1 , wherein the supporting member is a solder resist coating.

7. The leadframe of claim 1 , wherein a width of the supporting member is substantially the same as or smaller than a width of the bottom surface of the inner lead portion.

8. The leadframe of claim 1 , wherein the bottom surface of the inner lead portion comprises a plurality of supporting members disposed in a linear arrangement or staggered arrangement along a longitudinal direction of the inner lead portion.

9. A package structure, comprising:
a die paddle;
a semiconductor die disposed on the die paddle;
a plurality of leads surrounding the die paddle, each of the leads including an inner lead portion and an outer lead portion connecting to the inner lead portion, wherein the inner lead portion is adjacent to and spaced apart from the die paddle, a bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion, the bottom surface of the inner lead portion comprises one or more supporting members disposed thereon and the one or more supporting members have a convex surface facing away from the inner lead portion; and
an encapsulant covering the semiconductor die, the die paddle, the leads and the one or more supporting members.

10. The package structure of claim 9 , further comprising a plurality of bonding wires for electrically connecting the semiconductor die and the inner lead portion of the leads.

11. The package structure of claim 9 , wherein a bottom surface of the outer leads is exposed from the encapsulant.

12. The package structure of claim 11 , wherein a portion of the convex surface of supporting member is exposed from the encapsulant.

13. The package structure of claim 11 , wherein a top of the convex surface of the supporting member is substantially coplanar with the bottom surface of the outer lead portion.

14. The package structure of claim 9 , wherein an interface is formed between the supporting member and the inner lead portion.

15. The package structure of claim 9 , wherein the supporting member is disposed close to a distal end of the inner lead portion.

16. The package structure of claim 9 , wherein a material of the supporting member is different from a material of the encapsulant.

17. The package structure of claim 9 , wherein the bottom surface of the inner lead portion comprises a plurality of supporting members disposed in a linear arrangement or staggered arrangement along a longitudinal direction of the inner lead portion.

18. A method for manufacturing a package structure, comprising:
(a) providing a leadframe comprising a die paddle and a plurality of leads surrounding the die paddle, each of the leads including an inner lead portion and an outer lead portion connecting to the inner lead portion, wherein the inner lead portion is adjacent to and spaced apart from the die paddle, a bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion; and
(b) forming one or more supporting members to a bottom surface of the inner lead portion of each lead, wherein the supporting members are formed by spraying coating and have a convex surface facing away from the inner lead portion.

19. The method of claim 18 , wherein after (b), the method further comprises:
(c) disposing a semiconductor die on the die paddle, and electrically connecting the semiconductor die and the inner lead portions through a plurality of bonding wires; and
(d) forming an encapsulant to cover the semiconductor die, the die paddle, the bonding wires and the leads, and expose the bottom surface of the outer lead portions.

Assignees

• Advanced Semiconductor Eng

Inventors

• Huang Chia Hsiu
• Chen Chun Chen
• Cho Wei Chih
• Yang Shao-Lun
• Hsieh Yu-Shun

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W72/50

  Bond wires · CPC title

• H10W70/465

  Bumps or wires · CPC title