MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNETIC ISOLATION (EMI) SHIELD STRUCTURES AND RELATED METHODS
US-2024021538-A1 · Jan 18, 2024 · US
characterised by their shape or disposition, e.g. between cap and walls of a container
characterised by their shape or disposition, e.g. between cap and walls of a container · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W76/63 |
| Official title | characterised by their shape or disposition, e.g. between cap and walls of a container |
| Display label | characterised by their shape or disposition, e.g. between cap and walls of a container |
| Total patents | 266 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 15 |
| 2017 | 24 |
| 2018 | 11 |
| 2019 | 18 |
| 2020 | 16 |
| 2021 | 12 |
| 2022 | 26 |
| 2023 | 44 |
| 2024 | 32 |
| 2025 | 48 |
| 2026 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor packaging structure and process
US-10157772-B2 · Dec 18, 2018 · US
Methods and apparatus for thermal interface material (tim) bond line thickness (blt) reduction and tim adhesion enhancement for efficient thermal management
US-2018358280-A1 · Dec 13, 2018 · US
Solid-state image pickup device, manufacturing method thereof, and electronic apparatus
US-2018332245-A1 · Nov 15, 2018 · US
Electronic component housing package, multi-piece wiring substrate, and method for manufacturing electronic component housing package
US-2018324969-A1 · Nov 8, 2018 · US
Electronic component storage substrate and housing package
US-2018090405-A1 · Mar 29, 2018 · US
High reliability wafer level semiconductor packaging
US-2018082913-A1 · Mar 22, 2018 · US
Light emitting device and method of producing the light emitting device
US-9919384-B2 · Mar 20, 2018 · US
Electronic device
US-9872407-B2 · Jan 16, 2018 · US
High reliability wafer level semiconductor packaging
US-9859180-B2 · Jan 2, 2018 · US
Semiconductor device assembly with heat transfer structure formed from semiconductor material
US-2017365584-A1 · Dec 21, 2017 · US
Semiconductor Packaging Structure and Process
US-2017345708-A1 · Nov 30, 2017 · US
Light emitting device with packaging having an adhesive in a groove for attaching a transparent cover
US-9831395-B2 · Nov 28, 2017 · US
Microelectronic assemblies with cavities, and methods of fabrication
US-9812406-B2 · Nov 7, 2017 · US
Light emitting module
US-9799802-B2 · Oct 24, 2017 · US
Stacked electronic device including a protective wafer bonded to a chip by an infused adhesive
US-9773740-B2 · Sep 26, 2017 · US
System and Method for Bonding Package Lid
US-2017271223-A1 · Sep 21, 2017 · US
Semiconductor device assembly with heat transfer structure formed from semiconductor material
US-9768149-B2 · Sep 19, 2017 · US
Rf shield with selectively integrated solder
US-2017245404-A1 · Aug 24, 2017 · US
High reliability wafer level semiconductor packaging
US-2017236761-A1 · Aug 17, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W76/63?
- CPC H10W76/63 is the Cooperative Patent Classification code for “characterised by their shape or disposition, e.g. between cap and walls of a container.”
- How many patents are filed under CPC H10W76/63 (characterised by their shape or disposition, e.g. between cap and walls of a container)?
- Our database includes 266 publications tagged with this CPC code.
- Is patent activity under CPC H10W76/63 growing?
- Publication counts under this code: 32 in 2024 vs 48 in 2025 (latest complete years).