Light emitting device and method of producing the light emitting device

Patent metadata

Field	Value
Publication number	US-9919384-B2
Application number	US-201514740321-A
Country	US
Kind code	B2
Filing date	Jun 16, 2015
Priority date	Jun 17, 2014
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A light emitting device includes a package having a recess, a light emitting element disposed in the recess, a light-transmissive member covering an opening of the recess, and a frame member bonded to the package. The light-transmissive member is held by and between the package and the frame member.

First claim

What is claimed is:

1. A light emitting device comprising:
a package having a recess;
a light emitting element disposed in the recess;
a light-transmissive member covering an opening of the recess; and
a frame member bonded to the package,
wherein the light-transmissive member is held by and between the package and the frame member,
wherein at least the package, among the package and the frame member, has a side recess for arranging the light-transmissive member,
wherein a lower surface of the frame member and an upper surface of the package are bonded to each other, and
wherein the recess is structured by a bottom surface portion and a sidewall portion, the sidewall portion comprising an inner circumferential surface, the inner circumferential surface comprising, in order from a bottom side to a top side, a first inner surface adjacent to an upper surface of the bottom surface portion, a first stepped surface adjacent to the first inner surface outwardly, a second inner surface adjacent to the first stepped surface, a second stepped surface adjacent to the second inner surface outwardly, and a third inner surface adjacent to the second stepped surface and adjacent to the upper surface of the sidewall portion, and the second stepped surface and the third inner surface form the side recess of the package.

2. The light emitting device according to claim 1 , wherein the package and the frame member are bonded by a solder which is an adhesive agent.

3. The light emitting device according to claim 1 , wherein the frame member has a side recess for arranging the light-transmissive member, and wherein the side recess of the frame member has a first side recess portion and a second side recess portion, the first side recess portion being formed at one side of the frame member, the second side recess portion being formed at another side opposite to the one side of the frame member.

4. The light emitting device according to claim 2 , wherein the frame member has a side recess for arranging the light-transmissive member, and wherein the side recess of the frame member has a first side recess portion and a second side recess portion, the first side recess portion being formed at one side of the frame member, the second side recess portion being formed at another side opposite to the one side of the frame member.

5. The light emitting device according claim 2 , wherein the frame member has a side recess for arranging the light-transmissive member, and an inner surface of the frame member defines the side recess, wherein the inner surface of the frame member has a curved surface.

6. The light emitting device according claim 4 , wherein an inner surface of the frame member defines the side recess, wherein the inner surface of the frame member has a curved surface.

7. The light emitting device according to claim 1 , wherein the frame member is made of a material different from a material of the package.

8. The light emitting device according to claim 6 , wherein the frame member is made of a material different from a material of the package.

9. The light emitting device according to claim 1 , wherein the package is made of ceramic.

10. The light emitting device according to claim 8 , wherein the package is made of ceramic.

11. The light emitting device according to claim 1 , wherein the frame member is made of a metal.

12. The light emitting device according to claim 10 , wherein the frame member is made of a metal.

13. The light emitting device according to claim 1 , wherein the package further has
a step difference under the side recess,
a positive and a negative interconnection are disposed on an upper surface of the step difference, and
the light emitting element and the positive and negative interconnections are electrically connected by wires respectively.

14. The light emitting device according to claim 12 , wherein the package further has
a step difference under the side recess,
a positive and a negative interconnection are disposed on an upper surface of the step difference, and
the light emitting element and the positive and negative interconnections are electrically connected by wires respectively.

15. A method of producing a light emitting device comprising steps of:
disposing a light emitting element in a recess of a package;
covering an opening of the recess with a light-transmissive member; and
bonding a lower surface of a frame member to an upper surface of the package by a solder to hold the light-transmissive member by and between the package and the frame member,
wherein the light-transmissive member is held by a side recess formed at least in the package among the package and the frame member, and
wherein the recess is structured by a bottom surface portion and a sidewall portion, the sidewall portion comprising an inner circumferential surface, the inner circumferential surface comprising, in order from a bottom side to a top side, a first inner surface adjacent to an upper surface of the bottom surface portion, a first stepped surface adjacent to the first inner surface outwardly, a second inner surface adjacent to the first stepped surface, a second stepped surface adjacent to the second inner surface outwardly, and a third inner surface adjacent to the second stepped surface and adjacent to the upper surface of the sidewall portion, and the second stepped surface and the third inner surface form the side recess of the package.

16. The light emitting device according claim 1 , wherein the package has the side recess at a place inner than the upper surface of the package in a plan view, and the frame member has a side recess at a place inner than the lower surface of the frame member in a plan view.

17. The method of producing a light emitting device according to claim 15 , wherein the package has the side recess at a place inner than the upper surface of the package in a plan view, and the frame member has a side recess at a place inner than the lower surface of the frame member in a plan view.

Assignees

• Nichia Corp

Inventors

• Igata Toshiya
• Yoshida Hirofumi

Classifications

• H10W76/63

  characterised by their shape or disposition, e.g. between cap and walls of a container · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• B23K2203/42

  Operations & Transport · mapped topic

• B23K35/30

  with the principal constituent melting at less than 1550°C · CPC title

• H01L33/58

  Electricity · mapped topic