Sensor packaging method and sensor package
US-2024222308-A1 · Jul 4, 2024 · US
Multiple die-attach connectors having different functions
Multiple die-attach connectors having different functions · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/367 |
| Official title | {Multiple die-attach connectors having different functions} |
| Display label | Multiple die-attach connectors having different functions |
| Total patents | 151 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 9 |
| 2017 | 14 |
| 2018 | 12 |
| 2019 | 13 |
| 2020 | 9 |
| 2021 | 11 |
| 2022 | 17 |
| 2023 | 15 |
| 2024 | 21 |
| 2025 | 16 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flip chip backside mechanical die grounding techniques
US-10600753-B2 · Mar 24, 2020 · US
Multichip modules and methods of fabrication
US-10490520-B2 · Nov 26, 2019 · US
Two material high K thermal encapsulant system
US-10475715-B2 · Nov 12, 2019 · US
3DIC packaging with hot spot thermal management features
US-10461009-B2 · Oct 29, 2019 · US
Method for polymer-assisted chip transfer
US-10388516-B1 · Aug 20, 2019 · US
Multilayer board and electronic device
US-10354939-B2 · Jul 16, 2019 · US
Low thermal resistance hanging die package
US-10347558-B2 · Jul 9, 2019 · US
Warpage Control in Package-on-Package Structures
US-2019131254-A1 · May 2, 2019 · US
Semiconductor device and semiconductor package
US-10256203-B2 · Apr 9, 2019 · US
3DIC Packaging with Hot Spot Thermal Management Features
US-2019096781-A1 · Mar 28, 2019 · US
Chemical mechanical polishing for hybrid bonding
US-2019096842-A1 · Mar 28, 2019 · US
Multichip modules and methods of fabrication
US-2019088607-A1 · Mar 21, 2019 · US
Semicondcutor device and semicondcutor package
US-2019035752-A1 · Jan 31, 2019 · US
Warpage control in package-on-package structures
US-10170434-B2 · Jan 1, 2019 · US
Multichip modules and methods of fabrication
US-10163833-B2 · Dec 25, 2018 · US
3DIC packaging with hot spot thermal management features
US-10157813-B2 · Dec 18, 2018 · US
Package-on-package semiconductor device
US-10083940-B2 · Sep 25, 2018 · US
Multilayer board and electronic device
US-2018233429-A1 · Aug 16, 2018 · US
Warpage Control in Package-on-Package Structures
US-2018226363-A1 · Aug 9, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/367?
- CPC H10W72/367 is the Cooperative Patent Classification code for “Multiple die-attach connectors having different functions.”
- How many patents are filed under CPC H10W72/367 (Multiple die-attach connectors having different functions)?
- Our database includes 151 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/367 growing?
- Publication counts under this code: 21 in 2024 vs 16 in 2025 (latest complete years).