Multilayer board and electronic device

Patent metadata

Field	Value
Publication number	US-10354939-B2
Application number	US-201815952279-A
Country	US
Kind code	B2
Filing date	Apr 13, 2018
Priority date	Nov 17, 2015
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

A multilayer board includes a base including insulating layers stacked in a stacking direction, and a mounting surface at an end of the base in a first direction along the stacking direction, an electronic component inside the base, and a first heat dissipator extending through at least one of the insulating layers from a surface of the electronic component located at an end of the electronic component in the first direction to the mounting surface. When a section of the first heat dissipator is defined as a first section, and a section of the first heat dissipator located farther in a second direction along the layer stacking direction than the first section is defined as a second section, there is a combination of a first section and a second section in which the second section extends farther outward than the first section when viewed from the layer stacking direction.

First claim

What is claimed is:

1. A multilayer board comprising:
a base including insulating layers stacked on one another along a layer stacking direction, and a mounting surface located at an end of the base in a first direction along the layer stacking direction;
an electronic component disposed inside the base; and
a first heat dissipator extending through one or more of the insulating layers from a surface of the electronic component located at an end of the electronic component in the first direction along the layer stacking direction to the mounting surface and not connected to any external electrodes of the electronic component, the first heat dissipator being made of a material having a second coefficient of thermal conductivity higher than a first coefficient of thermal conductivity of a material of the insulating layers; wherein
a section of the first heat dissipator which is perpendicular or substantially perpendicular to the layer stacking direction is a first section, a section of the first heat dissipator which is perpendicular or substantially perpendicular to the layer stacking direction and located farther in a second direction along the layer stacking direction than the first section is a second section, and in a combination of the first section and the second section, the second section extends farther outward than the first section when viewed from the layer stacking direction.

2. The multilayer board according to claim 1 , wherein no external electrodes are disposed on the surface of the electronic component located at the end of the electronic component in the first direction along the layer stacking direction.

3. The multilayer board according to claim 1 , wherein a first external electrode is disposed on a surface of the electronic component located at an end of the electronic component in the second direction along the layer stacking direction.

4. The multilayer board according to claim 3 , further comprising:
a second external electrode disposed on the mounting surface; and
a connector connecting the first external electrode to the second external electrode and including an interlayer connection conductor and a wiring conductive layer.

5. The multilayer board according to claim 4 , wherein the connector extends from the first external electrode in the second direction along the layer stacking direction, extends in a direction perpendicular or substantially perpendicular to the layer stacking direction, and further extends in the first direction along the layer stacking direction to the second external electrode.

6. The multilayer board according to claim 1 , wherein in any combination of the first section and the second section, the second section extends farther outward than the first section when viewed from the layer stacking direction.

7. The multilayer board according to claim 1 , wherein in any combination of the first section and the second section, the second section is larger than the first section.

8. The multilayer board according to claim 1 , wherein the electronic component is located nearer to the mounting surface than to a surface of the base at an end of the base in the second direction along the layer stacking direction.

9. The multilayer board according to claim 1 , wherein the first heat dissipator is a metal plate or a metal block.

10. The multilayer board according to claim 1 , further comprising:
a second heat dissipator extending through one or more of the insulating layers from the surface of the electronic component located at the end of the electronic component in the first direction along the layer stacking direction to the mounting surface and not connected to any external electrodes of the electronic component, the second heat dissipator being made of a material having a coefficient of thermal conductivity higher than the first coefficient of thermal conductivity of the material of the insulating layers; wherein
the first heat dissipator and the second heat dissipator are arranged in a direction perpendicular or substantially perpendicular to the layer stacking direction with a space therebetween.

11. The multilayer board according to claim 10 , further comprising a wiring conductive layer disposed between the first heat dissipator and the second heat dissipator.

12. The multilayer board according to claim 1 , wherein the first heat dissipator is connected to the electronic component via a first joining member made of a material having a third coefficient of thermal conductivity higher than the first coefficient of thermal conductivity.

13. The multilayer board according to claim 1 , wherein the material of the insulating layers includes a thermoplastic resin.

14. An electronic device comprising:
a mother board; and
a multilayer board mounted on the mother board; wherein
the multilayer board includes:
a base including insulating layers stacked on one another along a layer stacking direction, and a mounting surface located at an end of the base in a first direction along the layer stacking direction where the insulating layers are stacked;
an electronic component disposed inside the base; and
a first heat dissipator extending through one or more of the insulating layers from a surface of the electronic component located at an end of the electronic component in the first direction along the layer stacking direction to the mounting surface and not connected to any external electrodes of the electronic component, the first heat dissipator being made of a material having a second coefficient of thermal conductivity higher than a first coefficient of thermal conductivity of a material of the insulating layers;

the first heat dissipator is in direct contact with the mother board or is connected to the mother board via a second joining member made of a material having a fourth coefficient of thermal conductivity higher than the first coefficient of thermal conductivity; and
a section of the first heat dissipator which is perpendicular or substantially perpendicular to the layer stacking direction is a first section, a section of the first heat dissipator which is perpendicular or substantially perpendicular to the layer stacking direction and located farther in a second direction along the layer stacking direction than the first section is a second section, and in a combination of the first section and the second section, the second section extends farther outward than the first section when viewed from the layer stacking direction.

15. The electronic device according to claim 14 , wherein
the mother board includes a third external electrode; and
the first heat dissipator is in direct contact with the third external electrode or is connected to the third external electrode via the second joining member.

16. The electronic device according to claim 14 , wherein the material of the insulating layers includes a thermoplastic resin.

17. The electronic device according to claim 14 , wherein no external electrodes are disposed on the surface of the electronic component located at the end of the electronic component in the first direction along the layer stacking direction.

18. The electronic device according to claim 14 , wherein a first external electrode is disposed on a surface of the electronic component located at an end of the electronic component in the second direction along the layer stacking direction.

19. The electronic device according to claim 14 , wherein in any combination of the first section and the second section, the second section extends farther outward than the first sect

Assignees

• Murata Manufacturing Co

Inventors

• Yosui Kuniaki
• Baba Takahiro
• Mashimo Yoshiyuki

Classifications

• H10W72/874

  On different surfaces · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/09

  extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title