Warpage control in package-on-package structures

Patent metadata

Field	Value
Publication number	US-10170434-B2
Application number	US-201815948247-A
Country	US
Kind code	B2
Filing date	Apr 9, 2018
Priority date	Dec 4, 2013
Publication date	Jan 1, 2019
Grant date	Jan 1, 2019

Abstract

A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate.

First claim

What is claimed is:

1. A package comprising:
a bottom package comprising:
a package component; and
a device die over and bonded to the package component;

an adhesive layer over a top surface of the device die, wherein the adhesive layer comprises a slanted sidewall, a planar top surface, and a curved corner joining the slanted sidewall to the planar top surface;
a rigid plate over and contacting the planar top surface of the adhesive layer;
a molding compound, wherein at least a lower portion of the device die is in the molding compound; and
a top package bonded to the bottom package through solder regions penetrating through the molding compound.

2. The package of claim 1 , wherein the molding compound has a top surface lower than a top surface of the device die.

3. The package of claim 2 , wherein an entirety of the molding compound is lower than the top surface of the device die.

4. The package of claim 1 , wherein the molding compound comprises a portion covering the rigid plate.

5. The package of claim 1 , wherein the adhesive layer comprises metal particles mixed therein.

6. The package of claim 1 , wherein the rigid plate comprises a non-metal plate.

7. The package of claim 6 , wherein the rigid plate comprises ceramic.

8. The package of claim 1 , wherein the rigid plate is spaced apart from a bottom surface of the top package by a space.

9. The package of claim 1 , wherein a joining point of the curved corner joining the rigid plate is directly underlying the rigid plate, and is laterally spaced apart from side edges of the rigid plate.

10. The package of claim 1 , wherein the molding compound contacts the curved corner.

11. The package of claim 1 , wherein the slanted sidewall of the adhesive layer has a first portion overlapped by the rigid plate, and a second portion extending laterally beyond edges of the rigid plate.

12. A package comprising:
a bottom package comprising:
a package component; and
a device die over and bonded to the package component;

a metal-particle-containing compound material over a top surface of the device die, wherein the metal-particle-containing compound material comprises an adhesive and metal particles mixed in the adhesive;
a rigid plate over and contacting the metal-particle-containing compound material;
an encapsulant over the package component and encapsulating a portion of the device die therein;
a top package bonded to the bottom package through solder regions, wherein the solder regions penetrate through the encapsulant; and
an underfill between the bottom package and the top package.

13. The package of claim 12 , wherein a portion of the encapsulant overlies and contacts a top surface of the rigid plate.

14. The package of claim 12 , wherein the rigid plate is formed of a non-metal material.

15. The package of claim 12 , wherein the rigid plate is a ceramic plate.

16. The package of claim 12 , wherein a top surface of the underfill is in contact with the rigid plate.

17. A package comprising:
a device die;
a metal-particle-containing compound material over a top surface of the device die, wherein the metal-particle-containing compound material comprises an adhesive and metal particles mixed in the adhesive, wherein the metal-particle-containing compound material has a top-view area smaller than a top-view area of the device die, and wherein lower portions of the metal-particle-containing compound material have top-view areas greater than top-view areas of upper portions of the metal-particle-containing compound material;
a metal plate over and contacting the metal-particle-containing compound material;
a molding compound molding a lower portion of the device die therein;
solder regions penetrating through the molding compound; and
a top package bonded to the solder regions, wherein the molding compound is spaced apart from a bottom surface of the top package.

18. The package of claim 17 , wherein the metal-particle-containing compound material and the metal plate are higher than the molding compound.

19. The package of claim 18 , wherein an entirety of the molding compound is lower than the metal-particle-containing compound material and the metal plate.

20. The package of claim 17 , wherein the metal plate is spaced apart from a bottom surface of the top package by a space.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Chen Wei-Yu
• Hu Yu-Hsiang
• Lin Wei-Hung
• Cheng Ming-Da
• Liu Chung-Shi

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title