Substrate treatment method and substrate treatment apparatus
US-2024162032-A1 · May 16, 2024 · US
for wet cleaning or washing
for wet cleaning or washing · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/0411 |
| Official title | {for wet cleaning or washing} |
| Display label | for wet cleaning or washing |
| Total patents | 945 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 26 |
| 2016 | 29 |
| 2017 | 67 |
| 2018 | 100 |
| 2019 | 107 |
| 2020 | 118 |
| 2021 | 106 |
| 2022 | 105 |
| 2023 | 82 |
| 2024 | 100 |
| 2025 | 88 |
| 2026 | 17 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Substrate processing apparatus and substrate processing method
US-2017287744-A1 · Oct 5, 2017 · US
Substrate processing method, substrate processing apparatus and non-transitory storage medium
US-9627232-B2 · Apr 18, 2017 · US
Substrate processing apparatus, substrate processing method and recording medium
US-2017084480-A1 · Mar 23, 2017 · US
Substrate processing device and substrate processing method
US-9601357-B2 · Mar 21, 2017 · US
Substrate processing apparatus, substrate transfer method and substrate transfer device
US-9530676-B2 · Dec 27, 2016 · US
Uv cleaning device of glass substrate
US-2016365371-A1 · Dec 15, 2016 · US
Table for holding workpiece and processing apparatus with the table
US-2016346902-A1 · Dec 1, 2016 · US
Substrate liquid processing apparatus, substrate liquid processing method, and computer-readable storage medium storing substrate liquid processing program
US-2016336202-A1 · Nov 17, 2016 · US
Substrate processing method and substrate processing apparatus
US-2016300710-A1 · Oct 13, 2016 · US
Wafer Treating Device and Sealing Ring for a Wafer Treating Device
US-2016300751-A1 · Oct 13, 2016 · US
Deoxygenation apparatus and substrate processing apparatus
US-2016288018-A1 · Oct 6, 2016 · US
Substrate processing method and substrate processing apparatus
US-2016279679-A1 · Sep 29, 2016 · US
Substrate treatment method and substrate treating apparatus
US-9437448-B2 · Sep 6, 2016 · US
Control of wafer surface charge during CMP
US-9437453-B2 · Sep 6, 2016 · US
Substrate processing method, and substrate processing device
US-2016247698-A1 · Aug 25, 2016 · US
Filter unit pretreatment method, treatment liquid supply apparatus, filter unit heating apparatus, and treatment liquid supply passage pretreatment method
US-2016236124-A1 · Aug 18, 2016 · US
Aqua regia and hydrogen peroxide HCL combination to remove Ni and NiPt residues
US-9399753-B2 · Jul 26, 2016 · US
Control of wafer surface charge during cmp
US-2016211155-A1 · Jul 21, 2016 · US
Method for measuring overall concentration of oxidizing substances, substrate cleaning method, and substrate cleaning system
US-2016172185-A1 · Jun 16, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/0411?
- CPC H10P72/0411 is the Cooperative Patent Classification code for “for wet cleaning or washing.”
- How many patents are filed under CPC H10P72/0411 (for wet cleaning or washing)?
- Our database includes 945 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/0411 growing?
- Publication counts under this code: 100 in 2024 vs 88 in 2025 (latest complete years).