Substrate processing device and substrate processing method

Patent metadata

Field	Value
Publication number	US-9601357-B2
Application number	US-201214383817-A
Country	US
Kind code	B2
Filing date	Sep 7, 2012
Priority date	Mar 30, 2012
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

A substrate processing apparatus and method includes, a plate that has a size equal to or larger than a principal face of the substrate, and has a horizontal and flat liquid holding face opposing the principal face of the substrate from below. A processing liquid supply unit supplies a processing liquid to the liquid holding face. A control unit controls the processing liquid supply unit and a movement unit to supply the processing liquid to the liquid holding face to form a processing liquid film, a contact step of bringing the principal face of the substrate and the liquid holding face close to each other to bring the principal face of the substrate into contact with the processing liquid film, and a liquid contact maintenance step of maintaining the processing liquid in contact with the principal face of the substrate.

First claim

The invention claimed is:

1. A substrate processing apparatus comprising:
a substrate holding unit that holds a substrate in a horizontal posture;
a plate that has a size equal to or larger than a principal face of the substrate held by the substrate holding unit, and has a horizontal and flat liquid holding face opposing the principal face of the substrate from below the principal face;
a processing liquid supply unit that supplies a processing liquid to the liquid holding face;
a movement unit that relatively moves the substrate holding unit and the plate to bring or separate the principal face of the substrate and the liquid holding face close to or from each other; and
a control unit that controls the processing liquid supply unit and the movement unit to execute a processing liquid film forming step of supplying the processing liquid to the liquid holding face by the processing liquid supply unit to form a processing liquid film on the liquid holding face, a contact step of bringing the principal face of the substrate and the liquid holding face close to each other by the movement unit to bring the principal face of the substrate into contact with the processing liquid film, and a liquid contact maintenance step of maintaining a state where the processing liquid is in contact with the principal face of the substrate after the contact step.

2. The substrate processing apparatus according to claim 1 , wherein a processing liquid discharge port that discharges the processing liquid is defined on the liquid holding face, and
the processing liquid supply unit discharges the processing liquid from the processing liquid discharge port.

3. The substrate processing apparatus according to claim 1 , further comprising: a plate rotation unit that rotates the plate about a rotation axis perpendicular to the liquid holding face.

4. The substrate processing apparatus according to claim 3 , wherein the control unit includes a low speed rotation control unit that controls the plate rotation unit to rotate the plate at a low rotational speed with which the processing liquid is capable of being held between the liquid holding face and the principal face of the substrate in parallel with the liquid contact maintenance step.

5. The substrate processing apparatus according to claim 3 , wherein the control unit includes a high speed rotation control unit that controls the plate rotation unit to rotate the plate at a high rotational speed with which the processing liquid is capable of being shaken off the liquid holding face after finishing the liquid contact maintenance step.

6. The substrate processing apparatus according to claim 1 , wherein the control unit includes a unit that stops supply of the processing liquid to the liquid holding face in synchronization with execution of the contact step or before the execution of the contact step.

7. The substrate processing apparatus according to claim 1 , wherein a dry gas discharge port that discharges a dry gas is defined on the liquid holding face.

8. The substrate processing apparatus according to claim 1 , further comprising: a heating unit that heats the liquid holding face.

9. The substrate processing apparatus according to claim 1 , wherein the processing liquid supply unit includes a chemical supply unit that supplies a chemical to the liquid holding face, and a rinse liquid supply unit that supplies a rinse liquid to the liquid holding face, and
the control unit controls the chemical supply unit, the rinse liquid supply unit, and the movement unit to execute a chemical film forming step of supplying the chemical to the liquid holding face by the chemical supply unit to form a chemical film on the liquid holding face, a chemical contact step of bringing the principal face of the substrate and the liquid holding face close to each other by the movement unit to bring the principal face of the substrate into contact with the chemical film, a chemical contact maintenance step of maintaining a state where the chemical is in contact with the principal face of the substrate after the chemical contact step, a separation step of separating the principal face of the substrate and the liquid holding face from each other by the movement unit, a rinse liquid film forming step of supplying the rinse liquid to the liquid holding face by the rinse liquid supply unit after the separation step to form a rinse liquid film on the liquid holding face, a rinse liquid contact step of bringing the principal face of the substrate and the liquid holding face close to each other by the movement unit to bring the principal face of the substrate into contact with the rinse liquid film, and a rinse liquid contact maintenance step of maintaining a state where the rinse liquid is in contact with the principal face of the substrate after the rinse liquid contact step.

10. The substrate processing apparatus according to claim 1 , wherein the processing liquid supply unit includes a first chemical supply unit that supplies a first chemical to the liquid holding face, and a second chemical supply unit that supplies a second chemical to the liquid holding face, and
the control unit controls the first chemical supply unit, the second chemical supply unit, and the movement unit to execute a first chemical film forming step of supplying the first chemical to the liquid holding face by the first chemical supply unit to form a first chemical film on the liquid holding face, a first chemical contact step of bringing the principal face of the substrate and the liquid holding face close to each other by the movement unit to bring the principal face of the substrate into contact with the first chemical film, a first chemical contact maintenance step of maintaining a state where the first chemical is in contact with the principal face of the substrate after the first chemical contact step, a separation step of separating the principal face of the substrate and the liquid holding face from each other by the movement unit, a second chemical film forming step of supplying the second chemical to the liquid holding face by the second chemical supply unit after the separation step to form a second chemical film on the liquid holding face, a second chemical contact step of bringing the principal face of the substrate and the liquid holding face close to each other by the movement unit to bring the principal face of the substrate into contact with the second chemical film, and a second chemical contact maintenance step of maintaining a state where the second chemical is in contact with the principal face of the substrate after the second chemical contact step.

11. A substrate processing method to be executed in a substrate processing apparatus including a substrate holding unit that holds a substrate in a horizontal posture, comprising:
a liquid film forming step of supplying a processing liquid to a horizontal and flat liquid holding face opposing a principal face of the substrate from below the principal face to form a processing liquid film on the liquid holding face;
a contact step of bringing the principal face of the substrate and the liquid holding face close to each other to bring the principal face of the substrate into contact with the processing liquid film; and
a liquid contact maintenance step of maintaining a state where the processing liquid is in contact with the principal face of the substrate after the contact step.

12. The substrate processing method according to claim 11 , wherein a processing liquid discharge port that discharges the processing liquid is defined on the liquid holding face, and
the liquid film forming step includes a step of discharging the processing liquid fro

Assignees

• Hashimoto Koji
• Miyagi Masahiro
• Takahashi Mitsukazu
• Screen Holdings Co Ltd

Inventors

• Hashimoto Koji
• Miyagi Masahiro
• Takahashi Mitsukazu

Classifications

• H10P72/3308

  Vertical transfer of a single workpiece · CPC title

• H10P72/0416

  with the semiconductor substrates being dipped in baths or vessels · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0411 Primary

  for wet cleaning or washing · CPC title

• H01L21/67051

  Electricity · mapped topic