Table for holding workpiece and processing apparatus with the table

Patent metadata

Field	Value
Publication number	US-2016346902-A1
Application number	US-201615167464-A
Country	US
Kind code	A1
Filing date	May 27, 2016
Priority date	Jun 1, 2015
Publication date	Dec 1, 2016
Grant date	—

Abstract

Provided is a wet substrate processing apparatus for processing a substrate. The apparatus comprises a table for holding a substrate, and a process liquid feeding mechanism for feeding process liquid to the substrate held on the table. The table includes a support face for supporting the substrate, a first opening formed in the support face, a second opening formed in the support face and arranged at least partially around the first opening, a first fluid path configured to extend to the first opening of the support face via the table and be connectable to a vacuum source, and a second fluid path configured to extend to the second opening of the support face via the table and discharge the process liquid.

First claim

1 . A wet substrate processing apparatus for processing a substrate, comprising:
a table for holding a substrate; and a process liquid feeding mechanism for feeding process liquid to the substrate held on the table, wherein the table includes a support face for supporting the substrate; a first opening formed in the support face; a second opening formed in the support face and arranged at least partially around the first opening; a first fluid path configured to extend to the first opening of the support face through the table and be connectable to a vacuum source; and a second fluid path configured to extend to the second opening of the support face through the table and open the second opening to the atmosphere.

2 . The wet substrate processing apparatus according to claim 1 , wherein the second fluid path extends through at least part of the table.

3 . The wet substrate processing apparatus according to claim 2 , wherein the table includes an expanded edge portion which extends in such a direction that a surface of the table expands; the second opening is located in the expanded edge portion; and the second fluid path extends through the expanded edge portion.

4 . The wet substrate processing apparatus according to claim 1 , wherein the first fluid path is configured to be connectable to a fluid feeding source for feeding fluid from the first opening through the first fluid path.

5 . The wet substrate processing apparatus according to claim 4 , wherein the fluid includes at least one from a group consisting of air, nitrogen, and water.

6 . The wet substrate processing apparatus according to claim 1 , wherein the table is configured to be rotatable.

7 . The wet substrate processing apparatus according to claim 1 , including a polishing pad for polishing the substrate.

8 . A wet substrate processing apparatus for processing a substrate, comprising:
a table for holding a substrate; and a process liquid feeding mechanism for feeding process liquid to the substrate held on the table, wherein the table includes a support face for supporting the substrate; a first opening formed in the support face; a second opening formed in the support face and arranged at least partially around the first opening; a first fluid path configured to extend to the first opening of the support face through the table and be connectable to a vacuum source; and a second fluid path configured to extend to the second opening of the support face through the table and be connectable to a fluid feeding source.

9 . The wet substrate processing apparatus according to claim 8 , wherein the fluid includes at least one from a group consisting of air, nitrogen, and water.

10 . The wet substrate processing apparatus according to claim 8 , wherein the table is configured to be rotatable.

11 . The wet substrate processing apparatus according to claim 8 , including a polishing pad for polishing the substrate.

12 . A wet substrate processing apparatus for processing a substrate, comprising:
a table for holding a substrate; and a process liquid feeding mechanism for feeding process liquid to the substrate held on the table, wherein the table includes a support face for supporting the substrate; a first opening formed in the support face; a second opening formed in the support face and arranged at least partially around the first opening; a first fluid path configured to extend to the first opening of the support face through the table and be connectable to a fluid feeding source; and a second fluid path configured to extend to the second opening of the support face through the table and be connectable to a vacuum source.

13 . The wet substrate processing apparatus according to claim 12 , wherein the fluid includes at least one from a group consisting of air, nitrogen, and water.

14 . The wet substrate processing apparatus according to claim 12 , wherein the first fluid path is configured to be connectable to the vacuum source.

15 . The wet substrate processing apparatus according to claim 12 , wherein the table is configured to be rotatable.

16 . The wet substrate processing apparatus according to claim 12 , including a polishing pad for polishing the substrate.

17 . A backing member configured to be mountable on a table for holding a substrate, the backing member including throughholes in positions which coincide with the first and second openings of the table of the wet substrate processing apparatus according to claim 1 when the backing member is mounted on the table.

Assignees

• Ebara Corp

Inventors

• Toyomura Naoki
• Miyazaki Mitsuru
• Kunisawa Junji

Classifications

• H10P72/70

  for supporting or gripping · CPC title

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• H10P72/0404

  for general liquid treatment, e.g. etching followed by cleaning · CPC title

• H10P72/10 Primary

  using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] · CPC title

• H01L21/30625

  Electricity · mapped topic