Optical sensor device

Patent metadata

Field	Value
Publication number	US-2016190352-A1
Application number	US-201615059674-A
Country	US
Kind code	A1
Filing date	Mar 3, 2016
Priority date	Feb 4, 2014
Publication date	Jun 30, 2016
Grant date	—

Abstract

A package for an optical sensor device has a double-molded structure in which a first resin molded portion and a second resin molded portion are integrated. The first resin molded portion has a structure in which peripheries of a die pad portion on which an optical sensor element is mounted and a part of leads are molded with a resin so as to be integrated. The second resin molded portion has a structure in which the periphery of the first resin molded portion is molded with a resin so as to form an outer shape of the package. A glass substrate having a filter function is bonded to an upper surface of the resin molded portions to form a cavity in which is mounted the optical sensor element.

First claim

What is claimed is:

1 . A package body for an optical sensor element, comprising:
a first resin molded portion having embedded therein a part of each of a plurality of leads; and a second resin molded portion molded over at least a portion of the first resin molded portion and having embedded therein a part of each of the plurality of leads situated on an outer side of the first resin molded portion, wherein a cavity is provided in the second resin molded portion or jointly in the first and second resin molded portions, the cavity having a bottom portion the center of which is formed of the second resin molded portion, the second resin molded portion has a mounting portion for mounting thereon the optical sensor element, the mounting portion being formed at the center of the cavity bottom portion, and each of the plurality of leads has an inner end portion apart of which is exposed within the cavity, and an outer end portion that extends outside the second resin molded portion.

2 . A package body according to claim 1 ; wherein the cavity is provided jointly in the first and second resin molded portions, the first resin molded portion forming a periphery of the bottom portion and a first inner side surface of the cavity that continues from the periphery of the bottom portion, and the second resin molded portion forming a second inner side surface of the cavity that continues from the first inner side surface.

3 . An optical sensor device comprising:
the package body according to claim 2 ; an optical sensor element mounted on the mounting portion; and a lid having a light filter function adhered to the package body to cover the cavity.

4 . A package body according to claim 1 ; wherein the cavity is provided in the second resin molded portion, and the first resin molded portion is completely embedded in the second resin molded portion.

5 . An optical sensor device comprising:
the package body according to claim 4 ; an optical sensor element mounted on the mounting portion; and a lid having a light filter function adhered to the package body to cover the cavity.

6 . An optical sensor device comprising:
the package body according to claim 1 ; an optical sensor element mounted on the mounting portion; and a lid having a light filter function adhered to the package body to cover the cavity.

7 . An optical sensor device, comprising:
a package having an optical sensor element mounted thereon, the package comprising a package body having a double-molded structure, a lid, and a cavity formed between the lid and a bottom portion on an inner side of the package body, the package body comprising:
a first resin molded portion integrated with a part of a lead, excluding a wire bonding portion of the lead, by contact fitting molding; and
a second resin molded portion in which a periphery of the first resin molded portion and a periphery of another part of the lead are integrated by contact fitting molding, the second resin molded portion comprising an element mounting portion on which the optical sensor element is mounted at a center of the bottom portion,
the lid being formed of a glass substrate having a filter function and adhered to an uppermost portion of the package body, the first resin molded portion forming a periphery of the bottom portion and a first inner side surface continued from the periphery of the bottom portion, and the second resin molded portion forming a center of the bottom portion, a second inner side surface continued from the first inner side surface, and an outer shape of the package.

8 . An optical sensor device, comprising:
a package having an optical sensor element mounted thereon, the package comprising a package body having a double-molded structure, a lid, and a cavity formed between the lid and a bottom portion on an inner side of the package body, the package body comprising:
a first resin molded portion integrated with a part of a lead, excluding a wire bonding portion of the lead, by contact fitting molding; and
a second resin molding portion in which a periphery of the first resin molded portion and a periphery of another part of the lead are integrated by contact fitting molding, the second resin molding portion comprising an element mounting portion on which the optical sensor element is mounted at a center of the bottomed portion,
the lid being formed of a glass substrate having a filter function and adhered to an uppermost portion of the package body, the first resin molded portion being completely covered with the second resin molded portion, and the wire bonding portion being exposed from the second resin molded portion.

Assignees

• Seiko Instr Inc

Inventors

• Tsukagoshi Koji

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W74/131

  the semiconductor body being only partially enclosed · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title