Image sensor
US-12074187-B2 · Aug 27, 2024 · US
Two-dimensional or three-dimensional array CCD image sensors
Two-dimensional or three-dimensional array CCD image sensors · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10F39/153 |
| Official title | {Two-dimensional or three-dimensional array CCD image sensors} |
| Display label | Two-dimensional or three-dimensional array CCD image sensors |
| Total patents | 251 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 28 |
| 2016 | 23 |
| 2017 | 23 |
| 2018 | 14 |
| 2019 | 20 |
| 2020 | 19 |
| 2021 | 31 |
| 2022 | 39 |
| 2023 | 21 |
| 2024 | 21 |
| 2025 | 10 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Solid state imaging device
US-2024170528-A1 · May 23, 2024 · US
Global shutter pixel with hybrid transfer storage gate-storage diode storage node
US-2017359545-A1 · Dec 14, 2017 · US
Global shutter pixel with hybrid transfer storage gate-storage diode storage node
US-9843754-B1 · Dec 12, 2017 · US
Time-of-fight pixel including in-pixel buried channel transistors
US-2017338274-A1 · Nov 23, 2017 · US
Solid-state imaging device and electronic apparatus
US-2017338259-A1 · Nov 23, 2017 · US
Solid-state imaging device with channel stop region with multiple impurity regions in depth direction and method for manufacturing the same
US-9799691-B2 · Oct 24, 2017 · US
Solid-state imaging device
US-2017229501-A1 · Aug 10, 2017 · US
Image sensor with glow suppression output circuitry
US-2017208283-A1 · Jul 20, 2017 · US
Solid-state imaging devices with impurity regions between photoelectric conversion regions and methods for manufacturing the same
US-9520432-B2 · Dec 13, 2016 · US
Photocathode including field emitter array on a silicon substrate with boron layer
US-2016343532-A1 · Nov 24, 2016 · US
Solid-state imaging device and electronic apparatus
US-2016336364-A1 · Nov 17, 2016 · US
Solid imaging device including photoelectric conversion unit and TDI transfer unit
US-9491384-B2 · Nov 8, 2016 · US
Image Sensor, An Inspection System And A Method Of Inspecting An Article
US-2016315114-A1 · Oct 27, 2016 · US
Method of forming a shallow pinned photodiode
US-2016293660-A1 · Oct 6, 2016 · US
Method and apparatus for detecting defects on wafers
US-2016293502-A1 · Oct 6, 2016 · US
Solid-state imaging apparatus, method for driving the same, and imaging apparatus
US-9419052-B2 · Aug 16, 2016 · US
Image sensor, an inspection system and a method of inspecting an article
US-9410901-B2 · Aug 9, 2016 · US
Image sensor pixel cell with non-destructive readout
US-9406718-B2 · Aug 2, 2016 · US
Solid-state imaging device and electronic apparatus
US-2016204160-A1 · Jul 14, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10F39/153?
- CPC H10F39/153 is the Cooperative Patent Classification code for “Two-dimensional or three-dimensional array CCD image sensors.”
- How many patents are filed under CPC H10F39/153 (Two-dimensional or three-dimensional array CCD image sensors)?
- Our database includes 251 publications tagged with this CPC code.
- Is patent activity under CPC H10F39/153 growing?
- Publication counts under this code: 21 in 2024 vs 10 in 2025 (latest complete years).