Vertically stacked light sensors
US-2025194269-A1 · Jun 12, 2025 · US
One-dimensional array CCD image sensors
One-dimensional array CCD image sensors · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10F39/152 |
| Official title | {One-dimensional array CCD image sensors} |
| Display label | One-dimensional array CCD image sensors |
| Total patents | 50 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 6 |
| 2017 | 5 |
| 2018 | 3 |
| 2019 | 4 |
| 2020 | 10 |
| 2021 | 2 |
| 2022 | 5 |
| 2023 | 2 |
| 2024 | 6 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Vertically stacked light sensors
US-12261190-B2 · Mar 25, 2025 · US
Integrated circuit with sequentially-coupled charge storage and associated techniques
US-12169142-B2 · Dec 17, 2024 · US
Integrated circuit with sequentially-coupled charge storage and associated techniques
US-12152936-B2 · Nov 26, 2024 · US
Vertically stacked light sensors
US-2024363672-A1 · Oct 31, 2024 · US
Waveguide integration with optical coupling structures on light detection device
US-12111262-B2 · Oct 8, 2024 · US
Integrated circuit with sequentially-coupled charge storage and associated techniques
US-12085442-B2 · Sep 10, 2024 · US
Integrated circuit with sequentially-coupled charge storage and associated techniques
US-2024044703-A1 · Feb 8, 2024 · US
Integrated circuit with sequentially-coupled charge storage and associated techniques
US-2023349755-A1 · Nov 2, 2023 · US
Integrated circuit with sequentially-coupled charge storage and associated techniques comprising a photodetection region and charge storage regions to induce an intrinsic electric field
US-11714001-B2 · Aug 1, 2023 · US
Pixel for time-of-flight applications
US-11435452-B2 · Sep 6, 2022 · US
Solid-state imaging device
US-11362129-B2 · Jun 14, 2022 · US
Integrated circuit with sequentially-coupled charge storage and associated techniques
US-2022128403-A1 · Apr 28, 2022 · US
Integrated circuit with sequentially-coupled charge storage and associated techniques
US-2022128402-A1 · Apr 28, 2022 · US
Waveguide integration with optical coupling structures on light detection device
US-2022120684-A1 · Apr 21, 2022 · US
Solid-state imaging device and imaging apparatus including same
US-11194025-B2 · Dec 7, 2021 · US
Solid-state image pickup device and control method of solid-state image pickup device
US-10986291-B2 · Apr 20, 2021 · US
Backside incidence type solid-state image pickup device
US-10811459-B2 · Oct 20, 2020 · US
Imaging device
US-10797100-B2 · Oct 6, 2020 · US
Solid-state image pickup device and control method of solid-state image pickup device
US-2020304738-A1 · Sep 24, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10F39/152?
- CPC H10F39/152 is the Cooperative Patent Classification code for “One-dimensional array CCD image sensors.”
- How many patents are filed under CPC H10F39/152 (One-dimensional array CCD image sensors)?
- Our database includes 50 publications tagged with this CPC code.
- Is patent activity under CPC H10F39/152 growing?
- Publication counts under this code: 6 in 2024 vs 2 in 2025 (latest complete years).