Pixel for time-of-flight applications

Patent metadata

Field	Value
Publication number	US-11435452-B2
Application number	US-201916267162-A
Country	US
Kind code	B2
Filing date	Feb 4, 2019
Priority date	Feb 4, 2019
Publication date	Sep 6, 2022
Grant date	Sep 6, 2022

Abstract

A time-of-flight (TOF) pixel includes a semiconductor material and a photogate disposed proximate to a frontside of the semiconductor material. The photogate is positioned to transfer charge in the semiconductor material toward the frontside in response to a voltage applied to the photogate. A floating diffusion is disposed in the semiconductor material proximate to the frontside of the semiconductor material, and one or more virtual phase implants is disposed in the semiconductor material proximate to the frontside of the semiconductor material. At least one of the one or more virtual phase implants extend laterally from under the photogate to the floating diffusion to transfer the charge to the floating diffusion.

First claim

What is claimed is:

1. A time-of-flight (TOF) pixel, comprising:
a semiconductor material;
a photogate disposed proximate to a frontside of the semiconductor material and positioned to transfer charge in the semiconductor material toward the frontside in response to a voltage applied to the photogate;
a floating diffusion disposed in the semiconductor material proximate to the frontside of the semiconductor material; and
one or more virtual phase implants disposed in the semiconductor material proximate to the frontside of the semiconductor material, wherein at least one of the one or more virtual phase implants extend laterally from under the photogate to the floating diffusion to transfer the charge to the floating diffusion.

2. The TOF pixel of claim 1 , wherein the one or more virtual phase implants includes a first virtual phase implant and a second virtual phase implant, wherein the first virtual phase implant has a lower dopant density than the second virtual phase implant.

3. The TOF pixel of claim 2 , wherein the one or more virtual phase implants includes a third virtual phase implant, wherein the second virtual phase implant is disposed between the first virtual phase implant and the third virtual phase implant, and wherein the second virtual phase implant has a lower dopant density than the third virtual phase implant.

4. The TOF pixel of claim 3 , wherein the first virtual phase implant is larger than the second virtual phase implant and the second virtual phase implant is larger than the third virtual phase implant.

5. The TOF pixel of claim 3 , wherein the second virtual phase implant overlaps the first virtual phase implant, and wherein the first virtual phase implant and the second virtual phase implant extend into the semiconductor material a same distance.

6. The TOF pixel of claim 5 , wherein the third virtual phase implant overlaps the first and the second virtual phase implants, and wherein the third virtual phase implant, extends into the semiconductor material the same distance as the first and the second virtual phase implants.

7. The TOF pixel of claim 1 , further comprising a transfer gate disposed proximate to the frontside of the semiconductor material and laterally between the photogate and the floating diffusion.

8. The TOF pixel of claim 7 , wherein the transfer gate and the photogate include a continuous polysilicon region.

9. The TOF pixel of claim 7 , further comprising an oxide layer disposed between the semiconductor material and the photogate and the transfer gate.

10. The TOF pixel of claim 1 , wherein the pixel is encircled by a doped well in the semiconductor material.

11. The TOF pixel of claim 10 , and wherein the photogate, the floating diffusion, and the one or more virtual phase implants form a first digit that extends into a center region of the doped well.

12. The TOF pixel of claim 11 , wherein the first digit is included in a plurality of digits that extend into the center region of the doped well.

13. The TOF pixel of claim 1 , wherein the floating diffusion has a higher dopant concentration than the one or more virtual phase implants so that the charge travels laterally from the one or more virtual phase implants into the floating diffusion.

14. A time-of-flight (TOF) system, comprising:
a light source to emit light;
a pixel array including a pixel, comprising:
a semiconductor material;
a photogate disposed proximate to a frontside of the semiconductor material;
a floating diffusion disposed in the semiconductor material proximate to the frontside; and
one or more virtual phase implants disposed in the semiconductor material proximate to the frontside of the semiconductor material, wherein at least one of the one or more virtual phase implants extend laterally from the floating diffusion towards the photogate; and

a controller coupled to the light emitter and the pixel array, wherein the controller includes logic that when executed by the controller causes the TOF system to perform operations, including:
emitting, with the light emitter, a sinusoidal waveform of the light;
receiving the light reflected from an object with the pixel array, wherein the light is phase shifted; and
in response to receiving the light, calculating a distance based on the phase shift.

15. The TOF system of claim 14 , wherein the distance is calculated using a time-of-flight of the light.

16. The TOF system of claim 14 , wherein the one or more virtual phase implants includes a first virtual phase implant and a second virtual phase implant, wherein the first virtual phase implant is disposed between the photogate and the second virtual phase implant and has a lower dopant density than the second virtual phase implant.

17. The TOF system of claim 16 , wherein the one or more virtual phase implants includes a third virtual phase implant, wherein the second virtual phase implant is disposed between the first virtual phase implant and the third virtual phase implant, and wherein the second virtual phase implant has a lower dopant density than the third virtual phase implant.

18. The TOF system of claim 14 , wherein the one or more virtual phase implants includes a first virtual phase implant and a second virtual phase implant, and wherein the second virtual phase implant overlaps the first virtual phase implant, and wherein the first virtual phase implant and the second virtual phase implant extend into the semiconductor material a same distance.

19. The TOF system of claim 18 , wherein the one or more virtual phase implants includes a third virtual phase implant, and wherein the third virtual phase implant overlaps the first and the second virtual phase implants, and wherein the third virtual phase implant extends into the semiconductor material the same distance as the first virtual phase implant and the second virtual phase implant.

20. The TOF system of claim 18 , wherein the first virtual phase implant is larger than the second virtual phase implant and the second virtual phase implant is larger than the third virtual phase implant.

21. The TOF system of claim 14 , the pixel further comprising a transfer gate disposed proximate to the frontside of the semiconductor material and laterally between the photogate and the floating diffusion.

22. The TOF system of claim 14 , wherein the pixel is encircled at least in part by a doped well disposed in the semiconductor material.

23. The TOF system of claim 22 , wherein the photogate, the floating diffusion, and the one or more virtual phase implants form a first digit that extends into a center region of the doped well.

24. The TOF system of claim 23 , wherein the first digit is included in a plurality of digits that extend into the center region of the doped well.

25. The TOF system of claim 24 , wherein the plurality of digits are interdigitated, and wherein the floating diffusion is disposed in the doped well.

Assignees

• Omnivision Tech Inc

Inventors

• Webster Eric A G

Classifications

• G01S7/497

  Means for monitoring or calibrating · CPC title

• G01S17/42

  Simultaneous measurement of distance and other co-ordinates (indirect measurement G01S17/46) · CPC title

• G01S17/89

  for mapping or imaging · CPC title

• G01S17/894

  Three-dimensional [3D] imaging with simultaneous measurement of time-of-flight at a two-dimensional [2D] array of receiver pixels, e.g. time-of-flight cameras or flash lidar · CPC title

• G01S7/4914 Primary

  of detector arrays, e.g. charge-transfer gates · CPC title