High density organic bridge device and method
US-10103105-B2 · Oct 16, 2018 · US
Adding a circuit layer by thin film methods (H05K3/4647 takes precedence)
Adding a circuit layer by thin film methods (H05K3/4647 takes precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/467 |
| Official title | {Adding a circuit layer by thin film methods (H05K3/4647 takes precedence)} |
| Display label | Adding a circuit layer by thin film methods (H05K3/4647 takes precedence) |
| Total patents | 166 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 8 |
| 2016 | 23 |
| 2017 | 21 |
| 2018 | 11 |
| 2019 | 19 |
| 2020 | 15 |
| 2021 | 16 |
| 2022 | 14 |
| 2023 | 11 |
| 2024 | 16 |
| 2025 | 9 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
High-current transmitting method utilizing printed circuit board
US-2018255648-A1 · Sep 6, 2018 · US
3DIC interconnect apparatus and method
US-10056353-B2 · Aug 21, 2018 · US
Method of forming a metal layer and method of manufacturing a substrate having such metal layer
US-9988730-B2 · Jun 5, 2018 · US
Thin film measuring apparatus and thin film measuring method
US-2018135959-A1 · May 17, 2018 · US
Integration of embedded thin film capacitors in package substrates
US-9941054-B2 · Apr 10, 2018 · US
Touch screen, method for producing touch screen, touch display device
US-9886148-B2 · Feb 6, 2018 · US
Printed circuit board for integrated led driver
US-2018014373-A1 · Jan 11, 2018 · US
Multi-layer substrates including thin film signal lines
US-9854687-B2 · Dec 26, 2017 · US
Resilient miniature integrated electrical connector
US-2017332476-A1 · Nov 16, 2017 · US
Printed circuit board and method of manufacturing the same
US-9820378-B2 · Nov 14, 2017 · US
Resilient miniature integrated electrical connector
US-9801269-B1 · Oct 24, 2017 · US
Thin film surface mount components
US-9755609-B2 · Sep 5, 2017 · US
Method of making a monolithically integrated RF system
US-9756737-B2 · Sep 5, 2017 · US
Touch panel and method of manufacturing conductive layer for touch panel
US-9736934-B2 · Aug 15, 2017 · US
Laminate film and electrode substrate film, and method of manufacturing the same
US-2017226624-A1 · Aug 10, 2017 · US
Laminate film and electrode substrate film, and method of manufacturing the same
US-2017223826-A1 · Aug 3, 2017 · US
Thin film surface mount components
US-9722568-B2 · Aug 1, 2017 · US
Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
US-9691698-B2 · Jun 27, 2017 · US
Wiring board, mounting structure using same, and method of manufacturing wiring board
US-9693451-B2 · Jun 27, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/467?
- CPC H05K3/467 is the Cooperative Patent Classification code for “Adding a circuit layer by thin film methods (H05K3/4647 takes precedence).”
- How many patents are filed under CPC H05K3/467 (Adding a circuit layer by thin film methods (H05K3/4647 takes precedence))?
- Our database includes 166 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/467 growing?
- Publication counts under this code: 16 in 2024 vs 9 in 2025 (latest complete years).