Wiring board, mounting structure using same, and method of manufacturing wiring board

Patent metadata

Field	Value
Publication number	US-9693451-B2
Application number	US-201314380207-A
Country	US
Kind code	B2
Filing date	Feb 20, 2013
Priority date	Feb 23, 2012
Publication date	Jun 27, 2017
Grant date	Jun 27, 2017

Abstract

A wiring board ( 3 ) according to an embodiment of the present invention includes an inorganic insulating layer ( 11 A); a first resin layer ( 12 A) on one main surface of the inorganic insulating layer ( 11 A); a second resin layer ( 13 A) on another main surface of the inorganic insulating layer ( 11 A); and a conductive layer ( 8 ) partially on one main surface of the second resin layer ( 13 A), the one main surface being on an opposite side to the inorganic insulating layer ( 11 A). The inorganic insulating layer ( 11 A) includes a plurality of first inorganic insulating particles ( 14 ) which are bound to each other at a part of each of the first inorganic insulating particles and gaps (G) surrounded by the plurality of first inorganic insulating particles ( 14 ). A part of the first resin layer ( 12 A) and a part of the second resin layer ( 13 A) are located inside the gaps (G).

First claim

The invention claimed is:

1. A wiring board, comprising:
an inorganic insulating layer;
a first resin layer on one main surface of the inorganic insulating layer;
a second resin layer on another main surface of the inorganic insulating layer;
a conductive layer partially on one main surface of the second resin layer, the one main surface being on an opposite side to the inorganic insulating layer; and
a third resin layer formed by covering the conductive layer on the one main surface of the second resin layer,
wherein
the inorganic insulating layer comprises a plurality of first inorganic insulating particles which are bound to each other at a part of each of the first inorganic insulating particles, and gaps which are surrounded by the plurality of first inorganic insulating particles,
a part of the first resin layer and a part of the second resin layer are located inside the gaps,
the third resin layer is made of a resin material which is the same as that of the second resin layer,
the third resin layer comprises the plurality of filler particles,
the plurality of filler particles are dispersed in the third resin layer, and
a content ratio of the plurality of filler particles in an area of a side of the conductive layer is smaller than that of the plurality of filler particles in an area of an opposite side to the conductive layer in the third resin layer.

2. A method of manufacturing a wiring board, comprising:
preparing an inorganic insulating layer that comprises a plurality of first inorganic insulating particles which are bound to each other at a part of each of the first inorganic insulating particles and gaps which are surrounded by the plurality of first inorganic insulating particles;
disposing a first resin precursor formed of an uncured first resin material in a form of a layer on one main surface of the inorganic insulating layer;
disposing a second resin precursor formed of an uncured second resin material in a form of a layer on another main surface of the inorganic insulating layer;
heating and pressing the inorganic insulating layer on which the first resin precursor is disposed at a temperature of less than a curing starting temperature of the first resin material and allowing a part of the first resin precursor to be located inside a part of the gaps of the inorganic insulating layer;
heating the inorganic insulating layer and the first resin precursor at a temperature higher than or equal to the curing starting temperature of the first resin material and making the first resin precursor into a first resin layer;
heating and pressing the inorganic insulating layer on which the second resin precursor is disposed at a temperature of less than the curing starting temperature of the second resin material and allowing a part of the second resin precursor to be located inside a part of the gaps of the inorganic insulating layer;
heating the inorganic insulating layer and the second resin precursor at a temperature higher than or equal to the curing starting temperature of the second resin material and making the second resin precursor into a second resin layer; and
forming a conductive layer on one main surface of the second resin layer, the one main surface being on an opposite side to the inorganic insulating layer.

3. The method of manufacturing the wiring board according to claim 2 , wherein
the step of making the first resin precursor into the first resin layer is performed before the step of allowing a part of the second resin material to be located inside a part of the gaps of the inorganic insulating layer.

4. The method of manufacturing the wiring board according to claim 3 , wherein
in the step of disposing the second resin precursor in a form of a layer, the second resin precursor, to which a plurality of filler particles whose average particle diameter is greater than a width of each of the gaps and which are made of an inorganic insulating material are dispersed, is disposed on another main surface of the inorganic insulating layer in a form of a layer.

5. A mounting structure, comprising:
the wiring board according to claim 1 ; and
an electronic component mounted on one main surface of a side of the second resin layer of the wiring board.

Assignees

• Kyocera Corp

Inventors

• Nagasawa Tadashi
• Hayashi Katsura

Classifications

• H05K3/4673

  Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28) · CPC title

• H05K2201/068

  wherein the coefficient of thermal expansion is important · CPC title

• H05K3/3436

  having an array of bottom contacts, e.g. pad grid array or ball grid array components · CPC title

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• H05K3/467

  Adding a circuit layer by thin film methods (H05K3/4647 takes precedence) · CPC title