Resilient miniature integrated electrical connector

Patent metadata

Field	Value
Publication number	US-9801269-B1
Application number	US-201615150834-A
Country	US
Kind code	B1
Filing date	May 10, 2016
Priority date	May 10, 2016
Publication date	Oct 24, 2017
Grant date	Oct 24, 2017

Abstract

A resilient electrical connector assembly includes a base PCB and stacked layers of interconnected resilient conductive structures where each structure has at least two resilient conductive strips and at least two conductive contacts. One contact is integrated with a conductive path on the base PCB and another contact pad is positioned to establish a conductive path with a target PCB when the latter is mounted parallel to the base PCB. The resilient conductive strips flex due to a compressive force exerted between the base PCB and target PCB on the stacked layers. The resilient conductive structures are formed by depositing metal to sequentially form each of the stacked layers with one contact being initially formed in engagement with the conductive path on the base PCB.

First claim

The invention claimed is:

1. A resilient integrated electrical connector assembly for providing an electrical interconnection with a target printed circuit board (PCB), the miniature resilient electrical connector assembly comprising:
a base PCB with at least one conductive path on one surface;
stacked layers of interconnected resilient conductive structures where each structure has at least one resilient conductive strip and at least one conductive contact attached to the at least one resilient conductive strip, all the resilient conductive structures being conductively connected together to form a miniature connector;
first and second conductive contacts mounted to and extending perpendicular from one surface of one of the resilient conductive strips in one of the stacked layers, the first and second conductive contacts engaging the at least one conductive path on the base PCB;
a third conductive contact mounted to and extending perpendicular from a surface of another resilient conductive strip disposed in another of the stacked layers and positioned to establish a conductive path on the target PCB when the latter is mounted parallel to the base PCB;
the first and second conductive contacts positioned on the one surface of the one resilient conductive strip to allow flexing of the one resilient conductive strip due to a compressive force exerted between the base PCB and target PCB;
the third conductive contact positioned on the another resilient conductive strip to allow flexing of the another resilient conductive strip due to the compressive force exerted between the base PCB and target PCB;
the resilient conductive structures formed by depositing metal to sequentially form each of the stacked layers with the first and second conductive contacts being initially formed in engagement with the at least one conductive path on the base PCB.

2. The resilient electrical connector assembly of claim 1 wherein the first and second conductive contacts are mounted near distal ends of the one resilient conductive strip.

3. The resilient electrical connector assembly of claim 1 wherein the one resilient conductive strip is fabricated, after the forming of the first and second conductive contacts, by depositing metal which forms the one resilient conductive strip between the first and second conductive contacts.

4. The resilient electrical connector assembly of claim 1 wherein each of at least one resilient conductive strips in each of the stacked layers are disposed in planes parallel to each other.

5. The resilient electrical connector assembly of claim 1 wherein each of at least one resilient conductive strips in each of the stacked layers are supported to facilitate flexing due to the compressive force.

6. The resilient electrical connector assembly of claim 1 wherein the at least one resilient conductive strip in one stacked layer has a contact which is disposed to engage another of the at least one resilient conductive strip in an adjacent stacked layer so that each stacked layer is supported by an adjacent stacked layer.

7. The resilient electrical connector assembly of claim 1 wherein the maximum length of the at least one resilient conductive strip is 10 mils (250 um) so that frequencies exceeding 20 GHz are transported by the miniature connector without adverse impedance changes.

8. The resilient electrical connector assembly of claim 7 wherein a radio frequency (RF) signal on the base PCB is transported to the target PCB by an array of the laterally positioned miniature connectors simulating a coaxial connection, the array having 5 miniature connectors with a first miniature connector providing a center connector of the coaxial connection and the other 4 miniature connectors equally spaced from the first miniature connector which together simulate a shield of an outer coaxial connection.

9. A resilient electrical connector assembly comprising:
stacked layers of interconnected resilient conductive structures where each structure has at least one resilient conductive strip and at least one conductive contact attached to the at least one resilient conductive strip, all the resilient conductive structures being conductively connected together to form a miniature connector;
a base PCB with at least one conductive path on one surface;
a spacer board with first and second parallel planar surfaces, a first conductive Via traversing the spacer board to connect first and second conductive pads on the first and second surfaces, respectively, the spacer board disposed between the base PCB and a target PCB;
a first miniature connector disposed between the base PCB and the spacer board;
a second miniature connector disposed between the spacer board and the target PCB;
the first miniature connector forming a conductive path between the at least one conductive path on the one surface of the base PCB and the first pad on the first surface of the spacer board;
the second miniature connector positioned establishing a conductive path with the second pad on the second surface of the spacer board and positioned to provide a conductive path with the target PCB;
the width of the spacer board establishing a distance between the base and target PCBs with a predetermined compressive force being exerted on the first and second miniature connectors.

Assignees

• Northrop Grumman Systems Corp

Inventors

• Jackson Charles M
• Kunkee Elizabeth T

Classifications

• H05K2201/042

  Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other · CPC title

• H01P3/088

  Stacked transmission lines · CPC title

• H05K1/0242 Primary

  Structural details of individual signal conductors, e.g. related to the skin effect · CPC title

• H05K1/025 Primary

  Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H10W44/20) · CPC title

• H05K1/144

  Stacked arrangements of planar printed circuit boards · CPC title