Flexible electronic circuits with embedded integrated circuit die and methods of making and using the same
US-2018308799-A1 · Oct 25, 2018 · US
laminating flexible circuit boards using additional insulating adhesive materials between the boards
laminating flexible circuit boards using additional insulating adhesive materials between the boards · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/4635 |
| Official title | {laminating flexible circuit boards using additional insulating adhesive materials between the boards} |
| Display label | laminating flexible circuit boards using additional insulating adhesive materials between the boards |
| Total patents | 175 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 17 |
| 2016 | 15 |
| 2017 | 19 |
| 2018 | 17 |
| 2019 | 23 |
| 2020 | 17 |
| 2021 | 10 |
| 2022 | 25 |
| 2023 | 11 |
| 2024 | 13 |
| 2025 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Multilayer wiring board for an electronic device
US-10104785-B2 · Oct 16, 2018 · US
Multilayer substrate and electronic device
US-2018151951-A1 · May 31, 2018 · US
High-frequency filter and communication device module
US-2018115037-A1 · Apr 26, 2018 · US
Mechanical and electrical interconnects between conductive threads in fabrics to PCB, FPC, and rigid-flex circuits
US-9936581-B1 · Apr 3, 2018 · US
Multilayer resin substrate, and method of manufacturing multilayer resin substrate
US-2018070435-A1 · Mar 8, 2018 · US
Multi-layer wiring board and method of manufacturing the same
US-9907189-B2 · Feb 27, 2018 · US
Multilayer substrate and electronic device
US-2018042107-A1 · Feb 8, 2018 · US
Signal transmission cable and communication device module
US-9887446-B2 · Feb 6, 2018 · US
Multilayer resin substrate, and method of manufacturing multilayer resin substrate
US-9848489-B2 · Dec 19, 2017 · US
Winged coil structure and method of manufacturing the same
US-9847165-B2 · Dec 19, 2017 · US
Multilayer substrate, component mounted board, and method for producing component mounted board
US-2017338172-A1 · Nov 23, 2017 · US
Printed wiring board
US-9807870-B2 · Oct 31, 2017 · US
Circuit board and method for manufacturing same
US-2017238428-A1 · Aug 17, 2017 · US
Graphene-containing epoxy adhesives
US-2017233621-A1 · Aug 17, 2017 · US
Film composite having electrical functionality for applying to a substrate
US-9723726-B2 · Aug 1, 2017 · US
Rigid flexible board and method for manufacturing the same
US-2017196077-A1 · Jul 6, 2017 · US
Electric element-embedded multilayer substrate and method for manufacturing the same
US-9699892-B2 · Jul 4, 2017 · US
Multilayer wiring board for an electronic device
US-2017171986-A1 · Jun 15, 2017 · US
Bond ply materials and circuit assemblies formed therefrom
US-2017145266-A1 · May 25, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/4635?
- CPC H05K3/4635 is the Cooperative Patent Classification code for “laminating flexible circuit boards using additional insulating adhesive materials between the boards.”
- How many patents are filed under CPC H05K3/4635 (laminating flexible circuit boards using additional insulating adhesive materials between the boards)?
- Our database includes 175 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/4635 growing?
- Publication counts under this code: 13 in 2024 vs 8 in 2025 (latest complete years).